A3PE3000L-FG324 - 3M-Gate ProASIC3EL Flash FPGA | Microsemi
부품 번호: A3PE3000L-FG324 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
A3PE3000L-FG324 개요
A flash FPGA is a field-programmable gate array that stores its configuration in non-volatile on-chip flash memory cells rather than SRAM. Unlike SRAM FPGAs, flash FPGAs are single-chip solutions: they require no external configuration PROM, start up instantly at power-on, and are inherently more secure against bitstream interception. Within the programmable logic hierarchy, the A3PE3000L sits in the high-density ProASIC3E/3EL family above the ProASIC3 (A3P) devices and below the Fusion mixed-signal FPGAs.
Key features include the low-power 'L' variant architecture that reduces dynamic power by roughly 40% and static power by roughly 50% versus the standard ProASIC3 part, support for 1.2V to 1.5V core operation, and single-chip non-volatile operation. The 221 available user I/Os support multiple I/O standards for interfacing with memory, processors, and peripherals.
Technically, the device uses a sea-of-vanilla-gates (Vo-logic) fabric of versatile logic elements with embedded flash switches, delivering performance in the hundreds of MHz class as reported by distributor parameter listings (up to 781.25 MHz appears in FindIC parameter data, while other sources list ~231-250 MHz for related speed grades - consult the manufacturer datasheet for grade-specific timing).
Typical applications include industrial automation control, battery-powered portable instrumentation, secure military and aerospace logic, communications line cards, and medical equipment where instant-on, low static power, and single-chip BOM are required.
A key design consideration: this specific 'FG' (lead-containing) variant is listed by distributor data as RoHS non-compliant; the FGG variant is the lead-free/RoHS-compliant equivalent for new designs.
This page synthesizes distributor pricing, drop-in alternatives in the same 324-ball footprint, and practical design notes not found in the manufacturer datasheet.
드롭인 대체품: A3PE3000L-FG324 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: A3PE3000L-FG324 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Family, Process Technology, RoHS Status, Configuration.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
A3PE3000L-FG324I
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →A3PE3000L-FGG324I
✅ 드롭인✓ 재고 있음
$62.65 / 개
데이터시트 보기 →A3PE3000L-1FGG324
✅ 드롭인✓ 재고 있음
$47.95 / 개
데이터시트 보기 →A3PE3000L-1FGG324I
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →A3PE3000-1FGG324
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →A3PE3000L-FG324 최대 정격 & 전기적 특성
| Family | ProASIC3EL (ProASIC3E Low Power) |
| System Gates | 3000000 |
| User I/O | 221 |
| Core Voltage | 1.2 V (supports 1.2 V to 1.5 V) |
| Process Technology | 130 nm CMOS flash |
| 패키지 | 324-ball FBGA |
| Configuration Memory | On-chip flash (non-volatile, single chip) |
| 실장 유형 | Surface Mount |
| Max Reported Frequency (parameter listing) | 781.25 MHz (per FindIC parameter data) |
| RoHS 상태 | RoHS Non-Compliant (contains lead, FG variant) |
| Lead Free Status | Contains Lead (FG variant); choose FGG variant for lead-free |
| Programming Method | In-system / on-board flash programming |
A3PE3000L-FG324 324-ball fbga 핀 구성 가이드
A3PE3000L-FG324(324-ball fbga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: A3PE3000L-FG324.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
A3PE3000L-FG324 적합 용도: 6 애플리케이션s: Industrial Automation Control, Battery-Powered Portable Instrumentation, Secure Military and Aerospace Logic, Communications Line Cards, Medical Equipment Control Logic, Industrial IoT Edge Nodes.
Industrial Automation Control
The A3PE3000L-FG324 fits industrial automation controllers where non-volatile, instant-on logic is required for machine startup without waiting for bitstream loading. Its 3M gates and 221 user I/Os accommodate motor-control state machines, sensor-fusion glue logic, and fieldbus interfaces in one chip, while the 324-ball FBGA provides dense routing for parallel I/O banks. The low-power L variant cuts static power roughly 50% versus the standard ProASIC3E, reducing cabinet heat in sealed enclosures. Placed on a 1.2V core rail with 2.5V/3.3V I/O banks, it replaces multiple CPLDs and discrete glue logic, and its flash cells retain configuration through power interruptions common on factory floors.
추천
Battery-Powered Portable Instrumentation
Portable test and measurement instruments benefit from the A3PE3000L-FG324's low-power architecture: per the Microchip ProASIC3L datasheet, dynamic power drops about 40% and static power about 50% compared with the equivalent standard ProASIC3 device. The 1.2V core rail minimizes battery drain, and flash-based instant-on operation eliminates the boot energy that SRAM FPGAs spend loading external configuration memory. Designers place the FPGA as the main acquisition controller - sequencers, trigger logic, and display interface - within its 3M-gate capacity and 221 I/Os. Because no configuration PROM is needed, a single-chip solution reduces board area and quiescent leakage, directly extending battery runtime between charges.
추천
Secure Military and Aerospace Logic
Flash FPGAs such as the A3PE3000L-FG324 are widely used in defense electronics because the configuration resides in non-volatile on-chip flash, removing the bitstream-interception risk that exists when SRAM FPGAs fetch configuration from external memory at every power-up. The 3M-gate fabric implements radar preprocessing, bus bridging (MIL-STD-1553-style glue logic, custom protocol bridges), and sensor interface logic, while the 221 I/Os support multiple I/O standards for mixed-voltage boards. Instant-on behavior suits munitions and avionics power profiles, and the industrial-grade A3PE3000L-FG324I variant covers extended-temperature environments. Full reprogrammability supports in-field capability updates without hardware change.
추천
Communications Line Cards
In telecom and datacom line cards, the A3PE3000L-FG324 serves as framer glue logic, backplane interface bridging, and status aggregation. Its 3M gates implement multi-channel framing state machines and statistics counters, and 221 user I/Os connect parallel PHY interfaces, LED banks, and management buses. The flash fabric powers up instantly, allowing the line card to be visible on the management bus within milliseconds of shelf power application - important for hot-swap systems. The low-power L variant reduces the per-slot thermal budget, which matters when dozens of cards share a chassis airflow path. The FBGA-324 footprint offers a compact 1.27mm-pitch ball arrangement for dense card layouts.
추천
Medical Equipment Control Logic
Diagnostic and therapeutic medical devices use the A3PE3000L-FG324 as deterministic control logic where instant-on and predictable startup matter: patient monitor front-end sequencing, imaging detector timing, and lab analyzer actuator control. The flash fabric contains no configuration-download phase, so the device is operational the moment power is valid - useful for battery-backed safety paths. With 3M gates and 221 I/Os, one FPGA consolidates timing generators, safety interlocks, and host interfaces. The low static power of the L variant limits heat inside fanless enclosures that must meet low-noise acoustic requirements. Flash programmability supports field firmware updates during service cycles without replacing hardware.
추천
Industrial IoT Edge Nodes
Edge nodes and smart sensors deployed in smart factories use the A3PE3000L-FG324 for deterministic local preprocessing - protocol translation, vibration-feature extraction, and safety cutoff logic - before data reaches the cloud. The flash-based fabric keeps configuration intact across brownouts and ungraceful power cycles typical of unattended deployments, and static power roughly 50% below the standard ProASIC3E reduces solar/battery harvesting budgets. The 3M-gate capacity supports hardened interfaces alongside custom accelerators, and the 221 I/Os connect multiple sensor buses simultaneously. Because the single-chip solution needs no boot flash, the PCB bill of materials stays small, supporting conformally coated, harsh-environment node designs.
추천
추천 제품 요약
엔지니어링 참조 데이터: A3PE3000L-FG324 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | A3PE3000L-FG324I | A3PE3000L-FGG324I | A3PE3000L-1FGG324 | A3PE3000-1FGG324 |
|---|---|---|---|---|---|
| Package | 324-ball FBGA | 324-ball FBGA - same | 324-ball FBGA - same | 324-ball FBGA - same | 324-ball FBGA (PBGA324) - same |
| Brand | Microsemi (Microchip Technology) | Microsemi (Microchip Technology) | Microsemi (Microchip Technology) | Microsemi (Microchip Technology) | Microsemi (Microchip Technology) |
| System Gates | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 (75264 CLBs) |
| User I/O | 221 | 221 | 221 | 221 | 221 |
| Core Voltage | 1.2 V (L variant) | 1.2 V (L variant) | 1.2 V (L variant) | 1.2 V (L variant) | 1.5 V (standard E variant) |
| Low-Power L Architecture | Yes (~40% dynamic / ~50% static reduction) | Yes | Yes | Yes | No (standard ProASIC3E) |
| Configuration Memory | On-chip flash (single chip) | On-chip flash | On-chip flash | On-chip flash | On-chip flash |
주요 차별점
- Low-power L architecture with 1.2V core (vs A3PE3000-1FGG324)
- Industrial temperature option in identical footprint (vs A3PE3000L-FG324I)
- Lead-free RoHS-compliant option available (vs A3PE3000L-FGG324I)
설계 노트
The A3PE3000L requires a 1.2V core rail (the L variant supports 1.2V-1.5V core operation per Microchip product data) plus separate I/O bank rails selected per I/O standard. Because the flash fabric draws static bias current continuously, budget static power first in battery designs - the L variant cuts it roughly 50% versus standard ProASIC3E, but at 3M gates the absolute floor is still nontrivial. Use power-aware synthesis in Libero SoC and enable low-power placement settings before finalizing the regulator sizing. Estimated: dynamic power scales linearly with toggle rate, so gating unused clock domains yields the largest savings.
The 324-ball FBGA uses approximately 1.0-1.27mm ball pitch on a fine-pitch substrate; plan escape routing with via-in-pad or dog-bone fanout and verify with the Microchip FG324 package mechanical drawing in the manufacturer datasheet. Provide dedicated decoupling per power rail - a network of 0.1uF ceramics near ball-side vias plus bulk capacitance at the regulators. The 324-ball array permits full or partial escape on 4 layers; for designs using most of the 221 user I/Os, 6+ signal layers are recommended. Follow Microchip ProASIC3 package/layout application guidance for ball-pad geometry.
Do not substitute the FG (lead-containing) part into RoHS-restricted builds - distributor data (digchip) lists this MPN as RoHS Non-Compliant; specify the FGG variant instead. Second, flash FPGAs power up instantly with configuration already resident: ensure board-level power sequencing holds all rails monotonic at startup so internal flash-read initialization completes cleanly. Third, when replacing FG324 with the -I industrial or -1 speed-grade variants, recompile the Libero SoC project against the exact target grade - timing files differ even though the footprint is pin-identical.
규정 준수 정보
Distributor datasheet data (digchip) lists Lead Free Status: Contains Lead and RoHS Status: RoHS Non-Compliant for the FG variant. The FGG-suffixed variants are the lead-free/RoHS-compliant equivalents.
