A3PE1500-1FGG676I - ProASIC3E FPGA, 1.5M Gates | Microchip
부품 번호: A3PE1500-1FGG676I ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $89.5 | $89.50 |
| 10 | $82.3 | $823.00 |
| 100 | $74.1 | $7,410.00 |
| 500 | $66.8 | $33,400.00 |
| 1,000 | $59.6 | $59,600.00 |
A3PE1500-1FGG676I 개요
An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer or designer after manufacturing—hence 'field-programmable'. FPGAs are part of the programmable logic device family, which sits between ASICs (Application-Specific Integrated Circuits) and general-purpose processors in the digital logic hierarchy. They offer the flexibility of software with the performance of hardware, making them ideal for prototyping, low-volume production, and applications requiring in-field updates. The ProASIC3E family is specifically a flash-based FPGA, meaning configuration is stored in non-volatile flash memory, allowing instant-on operation without an external boot device.
Key features of the A3PE1500-1FGG676I include 1.5 million system gates, 38400 logic elements, 276480 bits of RAM, and 444 user I/Os. It operates from a 1.5V core supply and supports I/O standards including LVCMOS, LVTTL, PCI, and LVDS. The device is lead-free and RoHS compliant, with an industrial temperature range of -40°C to +85°C. The flash-based architecture provides inherent security against reverse engineering and supports in-system programming (ISP) for easy updates.
Technically, the A3PE1500-1FGG676I is fabricated on a 130nm, 7-layer metal flash CMOS process, which balances performance and power consumption. The '1' speed grade guarantees operation up to 231 MHz, while the 'FGG676I' suffix indicates the 676-pin FBGA package with industrial temperature rating. The device includes up to 16 global clock networks, PLLs, and dedicated memory blocks, enabling complex digital designs. Its non-volatile configuration means it powers up instantly and is immune to configuration bitstream corruption, a common concern in SRAM-based FPGAs.
Typical applications include communications infrastructure, industrial automation, avionics, and consumer electronics. In networking, it can implement protocol bridging and packet processing; in industrial settings, it handles motor control and sensor interfacing; in avionics, its flash-based security and reliability are critical. The 444 I/Os allow extensive peripheral connectivity, and the 1.5V core reduces power dissipation compared to older 3.3V FPGAs.
When designing with this device, ensure adequate decoupling on the 1.5V core supply and follow Microchip's layout guidelines for the FBGA package. The flash-based architecture eliminates the need for an external configuration PROM, simplifying the BOM and reducing board space. However, the 676-pin FBGA requires careful PCB design for routing and thermal management.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing engineers with a comprehensive resource for evaluating the A3PE1500-1FGG676I.
드롭인 대체품: A3PE1500-1FGG676I — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: A3PE1500-1FGG676I (동일 폼 팩터 및 풋프린트) — 차이점: Core Supply Voltage, System Gates, Configuration, Package, Process Technology.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
A3PE1500-FGG676I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
A3PE1500-2FGG676
✅ 드롭인✓ 재고 있음
$33.5 / 개
데이터시트 보기 →A3PE1500-1FG676I
✅ 드롭인✓ 재고 있음
$65.89 / 개
데이터시트 보기 →M1A3PE1500-1FGG676I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
A3PE1500-2FGG676I
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →A3PE1500-1FGG676I 최대 정격 & 전기적 특성
| Family | ProASIC3E |
| Equivalent System Gates | 1,500,000 |
| Logic Elements | 38400 |
| RAM Bits | 276480 |
| Number of I/Os | 444 |
| 동작 공급 전압 | 1.5 V |
| Maximum Operating Frequency | 231 MHz |
| 패키지 / 케이스 | FBGA-676 |
| 장착 스타일 | SMD/SMT |
| Minimum Operating Temperature | -40 C |
| Maximum Operating Temperature | +85 C |
| Packaging | Tray |
| Lead Free | Yes |
| RoHS | Compliant |
| Process Technology | 130nm 7-layer metal flash CMOS |
A3PE1500-1FGG676I fbga-676 핀 구성 가이드
A3PE1500-1FGG676I(fbga-676 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: A3PE1500-1FGG676I.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
A3PE1500-1FGG676I 적합 용도: 6 애플리케이션s: Communications Infrastructure, Industrial Automation, Avionics and Defense, Consumer Electronics, Medical Electronics, Automotive Electronics.
Communications Infrastructure
The A3PE1500-1FGG676I is ideal for communications infrastructure such as network routers, switches, and base stations. Its 444 I/Os and 1.5M gates enable protocol bridging, packet processing, and interface conversion. The flash-based architecture provides instant-on and high reliability, critical for always-on network equipment. With 231 MHz performance, it can handle high-speed data paths while maintaining low power consumption. The device supports various I/O standards including LVDS and PCI, making it versatile for backplane and line-card interfaces. Its reprogrammability allows in-field updates for evolving protocols, reducing downtime and extending product life.
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Industrial Automation
In industrial automation, the A3PE1500-1FGG676I excels in motor control, PLCs, and sensor interfacing. Its 444 I/Os allow direct connection to multiple sensors and actuators, while the 1.5M gates provide ample logic for implementing control algorithms. The -40°C to +85°C temperature range ensures operation in harsh factory environments. The flash-based FPGA offers instant-on, eliminating boot delays in safety-critical systems. Its low power consumption reduces heat generation in sealed enclosures. The device's reprogrammability enables firmware updates for changing production requirements without hardware redesign, making it a cost-effective solution for evolving industrial systems.
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Avionics and Defense
The A3PE1500-1FGG676I is well-suited for avionics and defense applications due to its flash-based security and reliability. The non-volatile configuration prevents bitstream tampering and ensures instant-on, critical for mission-critical systems. Its 1.5M gates and 444 I/Os support complex signal processing, radar, and communication systems. The industrial temperature range and lead-free packaging meet stringent environmental requirements. The device's reprogrammability allows for secure in-field updates, reducing maintenance costs. With 231 MHz performance, it can handle real-time data processing while maintaining deterministic behavior, essential for safety-critical avionics.
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Consumer Electronics
In consumer electronics, the A3PE1500-1FGG676I enables features like video processing, display control, and smart home interfaces. Its 444 I/Os connect to various peripherals, while 1.5M gates handle image scaling, color space conversion, and UI rendering. The 1.5V core reduces power consumption, extending battery life in portable devices. The flash-based architecture allows instant-on for immediate user response. Its small FBGA package fits compact designs. The device's reprogrammability supports firmware updates for adding new features or fixing bugs post-launch, enhancing product longevity and user satisfaction.
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Medical Electronics
The A3PE1500-1FGG676I is used in medical electronics such as patient monitors, imaging systems, and diagnostic equipment. Its 444 I/Os interface with sensors, ADCs, and displays, while 1.5M gates implement signal processing and control logic. The industrial temperature range ensures reliable operation in clinical environments. The flash-based architecture provides high reliability and instant-on, critical for life-supporting devices. Its low power consumption reduces heat, important for compact medical devices. The device's reprogrammability allows for software updates to improve algorithms or add new diagnostic features without hardware changes, extending device lifespan.
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Automotive Electronics
In automotive electronics, the A3PE1500-1FGG676I supports applications like infotainment, ADAS, and body control modules. Its 444 I/Os connect to cameras, sensors, and displays, while 1.5M gates handle video processing, sensor fusion, and control algorithms. The -40°C to +85°C range covers automotive temperature requirements. The flash-based architecture provides instant-on for immediate system response and high reliability in vibration-prone environments. Its low power consumption reduces load on the vehicle's electrical system. The device's reprogrammability enables over-the-air updates for feature enhancements and security patches, keeping vehicles up-to-date.
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추천 제품 요약
엔지니어링 참조 데이터: A3PE1500-1FGG676I — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | A3PE1500-FGG676I | A3PE1500-2FGG676 | A3PE1500-1FG676I | M1A3PE1500-1FGG676I |
|---|---|---|---|---|---|
| Package | FBGA-676 | FBGA-676 | FBGA-676 | FBGA-676 | FBGA-676 |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Speed Grade | -1 (231 MHz) | Standard (350 MHz) | -2 (higher) | -1 (231 MHz) | -1 (231 MHz) |
| Temperature Grade | Industrial (-40 to +85 C) | Industrial (-40 to +85 C) | Commercial (0 to +70 C) | Industrial (-40 to +85 C) | Military (-55 to +125 C) |
| Lead-Free | Yes | Yes | Yes | No | Yes |
| Number of I/Os | 444 | 444 | 444 | 444 | 444 |
| RAM Bits | 276480 | 276480 | 276480 | 276480 | 276480 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
주요 차별점
- Flash-based architecture provides instant-on and security (vs SRAM-based FPGAs (e.g., Xilinx Spartan-6))
- Industrial temperature range (-40 to +85 C) (vs A3PE1500-2FGG676 (commercial only))
- Lead-free and RoHS compliant (vs A3PE1500-1FG676I (non-lead-free))
설계 노트
The A3PE1500-1FGG676I requires a 1.5V core supply. Use a low-dropout regulator (LDO) or a switching regulator with low ripple to provide this rail. Decouple each power pin with a 0.1uF ceramic capacitor and add bulk capacitance (10uF) near the FPGA. Estimated: For a typical design with 50% logic utilization and 100 MHz clock, core power dissipation is approximately 0.5W, based on Microchip's power calculator. Ensure the power supply can handle peak current during configuration.
The 676-pin FBGA package requires a multi-layer PCB with at least 6 layers for proper routing and power distribution. Follow Microchip's layout guidelines: use 0.1uF decoupling capacitors on each power pin, place them as close as possible to the balls, and use a solid ground plane. For high-speed I/Os, control impedance and use series termination resistors. The ball pitch is 1mm, so use vias with a drill size of 0.2mm or smaller for routing.
The A3PE1500-1FGG676I in FBGA-676 package has a thermal resistance (theta_JA) of approximately 15 C/W, depending on airflow and PCB design. Estimated: For 1W power dissipation, the junction temperature rise is 15C above ambient. At 85C ambient, the junction would be 100C, within the maximum rating. For higher power designs, add thermal vias under the package and consider a heatsink or forced airflow. Monitor junction temperature in high-reliability applications.
규정 준수 정보
Lead-free and RoHS compliant per part number suffix 'GG'. REACH and conflict minerals status not specified in provided data.
