SPC5602BK0VLL4R528 - 32-bit MCU, 256KB Flash, 48MHz, Automotive | NXP
부품 번호: SPC5602BK0VLL4R528 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $12.5 | $12.50 |
| 10 | $11.2 | $112.00 |
| 100 | $9.85 | $985.00 |
| 500 | $8.6 | $4,300.00 |
| 1,000 | $7.4 | $7,400.00 |
SPC5602BK0VLL4R528 개요
The SPC5602BK0VLL4R528 belongs to the broader category of microcontrollers (MCUs), which are programmable semiconductor devices that integrate a CPU core, memory, and peripherals into a single chip. Within that hierarchy it sits under 32-bit microcontrollers, then automotive MCUs, then body-electronics MCUs - the lowest-level classification targeted specifically at in-vehicle networks, body control modules, and chassis sub-systems.
Key features include the e200z0h Power Architecture core with hardware multiply/divide, 256 KB of embedded Flash with ECC, up to 48 MHz operation, and an integrated 10-bit ADC supporting a 3 V to 5.5 V analog supply range. The part supports automotive-grade qualification, JTAG debugging, and CAN/LIN peripherals typical of the MPC560xB/C/D platform.
Typical applications include automotive body controllers, door/seat/lighting modules, CAN and LIN nodes for in-vehicle networking, HVAC actuators, and industrial PLCs where a robust automotive-qualified MCU is required.
When designing with this part, ensure that the supply rail stays within 3 V to 5.5 V and that decoupling caps are placed close to all VDD/VSS pairs. The 100-pin LQFP package requires careful fan-out for signals at the 48 MHz edge rates.
드롭인 대체품: SPC5602BK0VLL4R528 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: SPC5602BK0VLL4R528 (동일 폼 팩터 및 풋프린트) — 차이점: Automotive Grade, Core Architecture, Operating Temperature Range, Package.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
SPC5602BK0VLL4
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →SPC5602BK0MLL4R
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
SPC5603BK0VLL4R
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
SPC5601BK0VLL4R
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
SPC5604BK0VLL4R
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
SPC5602BK0VLL4R528 최대 정격 & 전기적 특성
| Core Architecture | Power Architecture e200z0h |
| Core Family | MPC560xB/C/D Qorivva |
| 데이터 버스 폭 | 32-bit |
| Program Memory Size | 256 KB Flash |
| Maximum CPU Frequency | 48 MHz |
| Supply Voltage Range | 3 V to 5.5 V |
| 동작 온도 범위 | -40 °C to +105 °C |
| ADC Resolution | 10-bit |
| ADC Analog Supply | 3 V to 5.5 V |
| 패키지 | 100-LQFP (VLL) 14x14 mm |
| 실장 유형 | Surface Mount |
| Packaging Format | Tape & Reel (R528) |
| Automotive Grade | Yes |
| RoHS 상태 | Compliant |
| Core Series | Freescale/NXP MPC56xx |
SPC5602BK0VLL4R528 100-lqfp (vll) 14x14 mm 핀 구성 가이드
SPC5602BK0VLL4R528(100-lqfp (vll) 14x14 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: SPC5602BK0VLL4R528.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
SPC5602BK0VLL4R528 적합 용도: 6 애플리케이션s: Automotive Body Control Module, Door Module / Mirror Control ECU, LIN Network Slave Node, HVAC Actuator / Blower Controller, Industrial CAN-to-USB Gateway, Seat Control ECU.
Automotive Body Control Module
The SPC5602BK0VLL4R528 is well-suited to automotive body control modules (BCMs) where its 32-bit e200z0h core and 256 KB Flash deliver sufficient headroom for door, seat, lighting, and wiper logic while operating reliably across -40 °C to +105 °C. Its integrated FlexCAN and LINFlexD peripherals connect to in-vehicle networks, and the 100-LQFP package provides enough pins for typical BCM I/O. The 48 MHz CPU frequency is adequate for the deterministic control loops in BCM firmware, and the 10-bit ADC supports sensor inputs.
추천
Door Module / Mirror Control ECU
In door and mirror control ECUs, the SPC5602BK0VLL4R528's small 256 KB Flash footprint keeps BOM cost down while the CAN/LIN interfaces enable communication with the central BCM. The 100-LQFP exposes enough GPIO for window, mirror, and lock actuator drives with PWM, and the 10-bit ADC reads mirror-position feedback. Automotive-grade qualification lets the part survive the under-door thermal environment without derating, and surface-mount LQFP assembly keeps the module compact.
추천
LIN Network Slave Node
The SPC5602BK0VLL4R528 is a good fit for LIN slave nodes such as seat controllers, lighting drivers, and HVAC actuators. Its LINFlexD peripheral supports LIN 2.x master/slave roles, and the 32-bit e200z0h core executes the LIN scheduling and application firmware with deterministic timing. The 256 KB Flash holds a LIN bootloader plus production firmware, and the -40 °C to +105 °C range covers in-cabin placement. The 100-LQFP pin count leaves margin for analog sensing plus digital I/O.
추천
HVAC Actuator / Blower Controller
The SPC5602BK0VLL4R528's 48 MHz e200z0h core runs PID loops for HVAC blowers and air-mix actuators, while the 10-bit ADC reads feedback from temperature and pressure sensors. Automotive-grade operation up to 105 °C handles under-hood climate-control environments, and the LQFP-100 package provides enough PWM-capable pins for multiple motor drivers. Compared to switching off a larger MCU, the SPC5602BK0VLL4R528 keeps unused peripherals off to reduce quiescent current in parked-vehicle modes.
추천
Industrial CAN-to-USB Gateway
Outside the automotive cabin, the SPC5602BK0VLL4R528 functions as a CAN-to-USB or CAN-to-Ethernet bridge for industrial automation networks. The e200z0h core processes CAN frames at full bus throughput, and the 100-LQFP exposes USART/SPI pins for external Ethernet or USB controllers. The 256 KB Flash stores a CANopen or DeviceNet stack, and the 3 V to 5.5 V supply range simplifies integration with both 3.3 V and 5 V industrial buses. The robust -40/+105 °C spec suits factory-floor enclosures.
추천
Seat Control ECU
Power seat modules use the SPC5602BK0VLL4R528 to coordinate multiple brushed-DC motors for fore/aft, recline, and lumbar functions. The 100-LQFP exposes PWM channels for each motor, the 10-bit ADC reads position-feedback pots, and the CAN/LIN interfaces communicate with the cabin network. Automotive-grade qualification lets the part live in seat-mounted electronics where temperature spikes are common. Flash size at 256 KB accommodates seat-position memory and diagnostics.
추천
추천 제품 요약
엔지니어링 참조 데이터: SPC5602BK0VLL4R528 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | SPC5602BK0VLL4 | SPC5602BK0MLL4R | SPC5603BK0VLL4R | SPC5601BK0VLL4R | SPC5604BK0VLL4R |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 100-LQFP (VLL) 14x14 mm | 100-LQFP (VLL) 14x14 mm | 100-LQFP (VLL) 14x14 mm | 100-LQFP (VLL) 14x14 mm | 100-LQFP (VLL) 14x14 mm | 100-LQFP (VLL) 14x14 mm |
| Core Architecture | e200z0h Power Architecture | e200z0h Power Architecture | e200z0h Power Architecture | e200z0h Power Architecture | e200z0h Power Architecture | e200z0h Power Architecture |
| Maximum CPU Frequency | 48 MHz | 48 MHz | 48 MHz | 48 MHz | 48 MHz | 48 MHz |
| Supply Voltage Range | 3 V to 5.5 V | 3 V to 5.5 V | 3 V to 5.5 V | 3 V to 5.5 V | 3 V to 5.5 V | 3 V to 5.5 V |
| Operating Temperature Range | -40 °C to +105 °C | -40 °C to +105 °C | -40 °C to +105 °C | -40 °C to +105 °C | -40 °C to +105 °C | -40 °C to +105 °C |
| Packaging Format | Tape & Reel (R528) | Tray | Tape & Reel | Tape & Reel | Tape & Reel | Tape & Reel |
| Automotive Grade | Yes | Yes | Yes | Yes | Yes | Yes |
주요 차별점
- Optimized for cost-sensitive 256 KB Flash automotive tier (vs SPC5604BK0VLL4R)
- Tape & Reel (R528) production packaging (vs SPC5602BK0VLL4)
- Within MPC560xB/C/D family, pin-compatible across 100-LQFP VLL (vs SPC5603BK0VLL4R)
설계 노트
Estimated: At 48 MHz and full peripheral activity, the SPC5602BK0VLL4R528 typically draws in the order of tens of mA from VDD. Decouple each VDD/VSS pair with at least one 100 nF ceramic capacitor placed within 5 mm of each pin pair, plus a 4.7 µF bulk capacitor at the regulator output. Keep the analog VDDA supply cleanly isolated from digital VDD by a small ferrite if ADC accuracy is critical. Avoid daisy-chaining GND between analog and digital pins - use a star ground at the package thermal pad.
The 100-LQFP (VLL) package is 14 × 14 mm with 0.5 mm pitch. Use 4-layer stackup with continuous ground plane for EMC immunity in automotive environments. Route the JTAG signals (TCK, TMS, TDI, TDO, and optional TRST) with short lengths matched within ±2 cm to avoid debug lockups. Place the high-current motor/MOSFET driver traces on inner layers and keep analog feedback traces well-separated from switching signals to minimize crosstalk into the 10-bit ADC channels.
Do not assume the SPC5602BK0VLL4R528 is the same as its larger Flash siblings (e.g., SPC5604B or SPC5606B variants) when porting code - the small 256 KB Flash means drivers must be sized carefully. Confirm that your application stays inside the 48 MHz CPU budget before locking timing. Also verify supply sequencing: do not apply VDDA before VDD; otherwise the 10-bit ADC may latch up. Watch for LQFP CTE mismatch on heavy thermal-shock cycles in under-hood applications.
규정 준수 정보
RoHS compliant per the NXP product page and JLCPCB listing. AEC-Q100 Grade 2 aligned per the -40/+105 °C operating range specified by NXP and Mouser. Verified cross-brand replacements not applicable due to NXP-specific Power Architecture and 100-LQFP VLL pinout.
