STM32F745IEK6 - 216MHz Cortex-M7 512KB MCU | STMicroelectronics
부품 번호: STM32F745IEK6 ✓ 활성STM32F745IEK6 개요
A microcontroller such as the STM32F745IEK6 belongs to the embedded-processing hierarchy: microcontroller IC, 32-bit RISC processor, Arm Cortex-M7 core and STM32F7 high-performance family. It combines general-purpose control, digital signal processing, floating-point math and integrated connectivity in one package. The single-precision FPU accelerates control-loop and filtering workloads that would otherwise require slower integer-only implementation.
Principal features include a maximum clock frequency of 216 MHz, 512 KB of Flash program memory and support for 1.8 V, 2.5 V and 3.3 V operation as listed by Arrow. The Cortex-M7 core implements a full set of DSP instructions and memory-protection features, while the integrated Art Accelerator accelerates 2D graphics and video-related operations. An L1 cache and SDRAM interface support higher-throughput data-handling designs.
The STM32F745IEK6 targets applications where real-time responsiveness, compact area and graphics or media processing matter more than minimal cost. Its 176-ball UFBGA package is substantially smaller and offers more connection options than leaded packages, but it requires a fine-pitch assembly process, careful escape routing and reliable inspection. Exact external peripheral assignments must be confirmed against the STMicroelectronics datasheet before PCB routing.
Typical uses include industrial HMI panels, networked data acquisition equipment, audio and media controllers, camera-facing embedded systems, motor and motion controllers, and connected sensor gateways. The Art Accelerator and SDRAM support distinguish it from simpler Cortex-M microcontrollers when graphical output or external memory access is required. The Cortex-M7 DSP instruction set also benefits control, communications and signal-processing algorithms.
A key design consideration is thermal and layout complexity. Place decoupling capacitors at each supply pin, route high-speed memory and communication interfaces with short controlled-impedance traces, and follow STMicroelectronics guidance for the exposed-pad and power-grid layout. Validate the PCB assembly process early because the 10 x 10 mm UFBGA geometry limits inspection and rework.
This page consolidates manufacturer and distributor information, verified pricing, package identification, family alternatives, application guidance and engineering considerations. It also distinguishes confirmed specifications from data that still requires direct confirmation from the complete STM32F745xx/STM32F746xx datasheet.
드롭인 대체품: STM32F745IEK6 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: STM32F745IEK6 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Flash Memory, Mounting Type, Graphics Accelerator, Memory Protection.
STM32F746IEK6
✅ 드롭인가격 문의
데이터시트 보기 →STM32F745IGK6
✅ 드롭인 ⚠️ 사양 미검증가격 문의
데이터시트 보기 →STM32F746IGK6
✅ 드롭인 ⚠️ 사양 미검증가격 문의
데이터시트 보기 →STM32F756IEK6
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
STM32F756IGK6
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
STM32F745IEK6 최대 정격 & 전기적 특성
| Manufacturer | STMicroelectronics |
| Product Type | 32-bit ARM Cortex-M7 microcontroller with FPU |
| Processor Core | Arm Cortex-M7 with single-precision FPU |
| Maximum CPU Frequency | 216 MHz |
| Flash Memory | 512 KB (512K x 8) |
| 패키지 | 176-ball UFBGA, 10 x 10 mm |
| 실장 유형 | Surface Mount |
| Supply Voltage Options | 1.8 V, 2.5 V, 3.3 V |
| Floating-Point Unit | Single precision |
| DSP Instruction Support | Yes, full set of Cortex-M7 DSP instructions |
| Memory Protection | Supported by Cortex-M7 core |
| Cache | L1 cache |
| Graphics Accelerator | Art Accelerator |
| External Memory Interface | SDRAM interface |
| Distributor Price as of 2026-10-28 | USD 6.0072 starting price at LCSC |
STM32F745IEK6 176-ball ufbga, 10 x 10 mm 핀 구성 가이드
STM32F745IEK6(176-ball ufbga, 10 x 10 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: STM32F745IEK6.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
STM32F745IEK6 적합 용도: 6 애플리케이션s: Industrial Human-Machine Interface, Audio and Digital Signal Processing Controller, Connected Sensor Gateway and Data Acquisition, Camera-Facing Embedded Vision System, Precision Motor and Motion Controller, Compact Industrial Communications Gateway.
Industrial Human-Machine Interface
The STM32F745IEK6 suits a compact industrial HMI because its 216 MHz Cortex-M7 core combines single-precision floating-point hardware with an integrated Art Accelerator and L1 cache. These blocks can accelerate graphical composition, touch-response logic and local filtering without the power cost of a separate display processor. The 512 KB of Flash provides application storage for graphics assets and firmware, while the SDRAM interface allows an external frame buffer to be used when panel resolution requires it. Compared with a basic Cortex-M3 device, the Cortex-M7 offers substantially more compute headroom, and its DSP instruction set accelerates filter and control operations. The main engineering constraint is the 176-ball 10 x 10 mm UFBGA assembly, which demands fine-pitch PCB layout, adequate thermal spreading and an assembly process proven before volume production.
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Audio and Digital Signal Processing Controller
The STM32F745IEK6 is appropriate for real-time audio and digital signal processing because its Arm Cortex-M7 core provides a single-precision FPU and a full DSP instruction set at up to 216 MHz. Those resources support filtering, mixing, modulation and control loops with less reliance on fixed-point workarounds. Its 512 KB of Flash can hold control firmware and compact parameter tables, while the SDRAM interface offers external working memory for longer sample buffers. Compared with an entry-level Cortex-M microcontroller, the M7 core has more throughput and instruction-level parallelism for time-critical processing. Designers should still partition memory carefully and benchmark interrupt latency, DMA movement and cache behavior. The fine-pitch UFBGA package also requires verified power distribution and a manufacturing flow capable of assembling it reliably.
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Connected Sensor Gateway and Data Acquisition
The STM32F745IEK6 fits a connected data-acquisition gateway that must combine communications, real-time sampling and local control in a compact module. The 216 MHz Cortex-M7 core provides the processing throughput needed for protocol handling and signal conditioning, while its DSP instructions and single-precision FPU accelerate filter calculations. The 512 KB Flash is suitable for firmware and configuration data, and the SDRAM interface can expand buffering when burst logging or local processing is required. Unlike a simple low-cost MCU, this device has enough performance to compress, validate and filter data before transmission. Design work should include DMA assignment, memory bandwidth checks, watchdog strategy and independent rail sequencing. With 176 UFBGA balls, careful escape routing and power-plane integrity are essential for reliable high-speed operation.
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Camera-Facing Embedded Vision System
The STM32F745IEK6 is suitable for camera-oriented embedded systems that require local image processing and a high-performance 32-bit control core. Its Art Accelerator can assist 2D graphics and media workloads, while the 216 MHz Cortex-M7 core handles control flow, exposure management and algorithm scheduling. The 512 KB of on-chip Flash stores boot code and compact models, and the SDRAM interface can accommodate external frame buffers required by higher-resolution image pipelines. Compared with an entry-level Cortex-M MCU, the STM32F745IEK6 offers additional caching, DSP and floating-point resources for edge processing. Bandwidth utilization must be verified because SDRAM latency can dominate naïve frame-buffer access. The compact 10 x 10 mm UFBGA package helps minimize board area but increases assembly risk and requires pin-accurate routing against the manufacturer diagram.
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Precision Motor and Motion Controller
The STM32F745IEK6 is applicable to precision motor and motion control because the 216 MHz Cortex-M7 core can execute current-loop and motion algorithms using its single-precision FPU and DSP instructions. The 512 KB of Flash provides room for control code, lookup tables and tuning parameters, while the SDRAM interface can support larger diagnostic or trajectory buffers when required. Compared with a basic Cortex-M3 MCU, the M7 offers more headroom for combining control, communications and diagnostics in one core. For real results, developers should use hardware timers, DMA and the appropriate peripheral rather than relying on software timing, and must validate worst-case interrupt latency under full bus traffic. Fine-pitch UFBGA assembly and controlled-impedance routing also require early manufacturing validation.
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Compact Industrial Communications Gateway
The STM32F745IEK6 works well as a compact industrial communications gateway because its 216 MHz Cortex-M7 core can process protocol stacks while maintaining headroom for diagnostics and local control. The 512 KB of Flash can hold a substantial embedded application, and the SDRAM interface permits external buffering for high-throughput traffic. Compared with a low-end Cortex-M part, the M7 core provides more performance for simultaneous communication tasks and full DSP support for signal-oriented gateway functions. A practical design should allocate DMA channels carefully, isolate real-time traffic on the correct peripherals and monitor thermal rise during sustained data transfer. The 176-ball UFBGA package allows a dense board but restricts routing, so power, ground, high-speed interfaces and debug access must be planned against the official pinout and layout guidance.
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추천 제품 요약
엔지니어링 참조 데이터: STM32F745IEK6 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | STM32F746IEK6 | STM32F745IGK6 | STM32F746IGK6 | STM32F756IEK6 | STM32F756IGK6 |
|---|---|---|---|---|---|---|
| Package | 176-ball UFBGA, 10 x 10 mm | 176-ball UFBGA, 10 x 10 mm | 176-ball UFBGA, 10 x 10 mm | 176-ball UFBGA, 10 x 10 mm | 176-ball UFBGA, 10 x 10 mm | 176-ball UFBGA, 10 x 10 mm |
| Brand | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics |
| Processor Core | Arm Cortex-M7 with single-precision FPU | Arm Cortex-M7 with single-precision FPU | Arm Cortex-M7 with single-precision FPU | Arm Cortex-M7 with single-precision FPU | Arm Cortex-M7 with single-precision FPU | Arm Cortex-M7 with single-precision FPU |
| Maximum CPU Frequency | 216 MHz | 216 MHz | 216 MHz | 216 MHz | 216 MHz | 216 MHz |
주요 차별점
- High-performance Cortex-M7 processing with integrated media acceleration (vs STM32F746IEK6)
- Compact 176-ball UFBGA integration (vs STM32F098RCH6)
- Substantially higher processing class than entry-level STM32 devices (vs STM32F446ZCH6)
- Verified commercial availability across multiple channels (vs MK20DN512VLQ10)
설계 노트
Treat the 176-ball UFBGA as a fine-pitch assembly constraint rather than a conventional IC placement. Route every supply and ground connection through the package pin definitions and follow the STMicroelectronics recommended footprint, power-grid arrangement and via pattern. Confirm courtyard, solder-mask clearance and stencil data against the official package drawing before release. Prototype early because an assembly defect in a 10 x 10 mm ball-grid package can require board respin rather than simple rework.
Provide local bulk and high-frequency decoupling at each supply ball, and keep the return path for high-speed interfaces continuous. The verified distributor listing identifies 1.8 V, 2.5 V and 3.3 V operation, so the actual rail plan must match the selected core and peripheral voltage configuration in the manufacturer table. Confirm maximum supply tolerance, regulator startup sequencing and analog supply requirements against the datasheet. Validate brownout and thermal behavior across the intended industrial temperature range.
Estimated: the Cortex-M7 can sustain high switching activity at 216 MHz, and the compact UFBGA has limited escape area for heat removal. Actual junction rise depends on supply voltage, switching activity, board copper, ambient temperature and the number of active I/O banks, none of which was supplied for this part. Use the datasheet thermal model rather than a generic junction limit, maintain uninterrupted ground planes beneath the device, and stress-test sustained control, communications and SDRAM activity.
Plan SDRAM and other high-speed interfaces as controlled-impedance nets with short point-to-point routing, continuous reference planes and via matching. The 176-ball package offers many I/O connections, but the compact footprint can force layer transitions and coupling between signal groups. Cross-check every ball assignment and alternate function against the official STM32F745xx datasheet. Validate signal integrity with the actual stack-up and, where available, the manufacturer's hardware design guidance rather than relying on generic length matching.
Do not treat a shared family, Cortex-M7 core or similar package as proof of firmware compatibility. Before substituting any alternative, verify the exact ball map, Flash size, RAM size, pin alternate functions, boot configuration, supply voltages, crystal requirements and peripheral assignments. The alternative ordering code can also change the Flash-density suffix. A valid drop-in decision therefore requires both footprint comparison and a complete ordering-information comparison.
규정 준수 정보
The supplied verified snippets do not state the STM32F745IEK6's RoHS, REACH, AEC-Q100, lead-free, halogen-free or conflict-minerals status. These fields must be updated from the manufacturer product declaration or distributor compliance records. A cross-reference comparison page was found, but its individual compliance conclusions were not included in the supplied snippet and were therefore not treated as verified facts.
