STM32H7A3VIT6 - 280MHz Cortex-M7 MCU, 2MB Flash, LQFP-100 | STMicroelectronics
부품 번호: STM32H7A3VIT6 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $18.5 | $18.50 |
| 10 | $16.2 | $162.00 |
| 100 | $13.85 | $1,385.00 |
| 500 | $11.95 | $5,975.00 |
| 1,000 | $10.45 | $10,450.00 |
STM32H7A3VIT6 개요
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, non-volatile program memory (Flash), volatile working memory (SRAM), and a wide range of peripheral interfaces into one package. Within the broader semiconductor taxonomy, an MCU sits under microcontrollers, which are a subcategory of integrated circuits (ICs); the Cortex-M7 core specifically belongs to the ARM Cortex-M family of embedded cores, optimized for deterministic real-time performance and DSP workloads. The STM32H7 series extends this family with the highest clock rates and largest memory footprints in the STM32 portfolio.
Key features include a 16-bit ADCs sampling up to 3.6 MSPS, fast 12-bit DACs, two USB 2.0 Full-Speed/High-Speed OTG controllers, multiple CAN FD, SDMMC, FMC, and a TFT-LCD controller. On-chip math accelerators (FMAC, CORDIC) and the Chrom-ART (DMA2D) graphics engine offload CPU-intensive operations, while hardware cryptographic accelerators and a true random number generator (TRNG) support secure connectivity use cases.
The Cortex-M7 core includes a double-precision FPU, L1 instruction and data caches (16 KB each), and a tightly-coupled SRAM region for zero-wait-state execution, enabling 280 MHz operation with sustained DSP throughput. The bus matrix is multi-layer AHB, allowing concurrent high-bandwidth access between the CPU, the Chrom-ART engine, and the SDMMC/USB peripherals without bus starvation.
Typical applications include industrial motor drives, factory automation PLCs, audio processing and professional audio interfaces, HMI panels with TFT displays, IoT edge nodes with secure connectivity, and automotive-grade body and comfort modules (when ordered in the AEC-Q100 'Q' suffix variant).
When designing with the STM32H7A3VIT6, pay close attention to power-supply decoupling and trace impedance around the high-speed SDMMC and USB signals. Proper boot-mode configuration on the BOOT0 pin and OTP area management is essential for field-deployable firmware security.
This page synthesizes distributor pricing, pin-compatible drop-in alternatives, and practical design notes that are not found in the manufacturer datasheet alone.
드롭인 대체품: STM32H7A3VIT6 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: STM32H7A3VIT6 (동일 폼 팩터 및 풋프린트) — 차이점: Package, ADC, Core, SRAM, DAC.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
STM32H7A3VIT6Q
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
STM32H7A3RIT6
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$10.2 / 개
데이터시트 보기 →STM32H753XIH6
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$13.2 / 개
데이터시트 보기 →STM32H745IIT6
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$10.62 / 개
데이터시트 보기 →STM32F767IIT6
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$11.95 / 개
데이터시트 보기 →STM32F765IGT6
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$13.1 / 개
데이터시트 보기 →STM32F767IGK6
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$14.05 / 개
데이터시트 보기 →STM32H7A3VIT6 최대 정격 & 전기적 특성
| Core | ARM Cortex-M7 (32-bit) |
| Maximum CPU Clock | 280 MHz |
| Flash Memory | 2 MB (2M x 8) |
| SRAM | 1.4 MB total (SRAM1/SRAM2/SRAM3/SRAM4 + DTCM + AXI SRAM) |
| Supply Voltage (VDD) | 1.62 V to 3.6 V |
| 패키지 | 100-pin LQFP (14x14 mm) |
| 동작 온도 | -40 C to +85 C (industrial grade) |
| ADC | 3 x 16-bit, up to 3.6 MSPS |
| DAC | 2 x 12-bit |
| Communication | USB 2.0 FS+HS OTG, CAN FD, USART/UART, SPI, I2C, SAI, SDMMC, FMC |
| Graphics | Chrom-ART (DMA2D) accelerator, TFT-LCD controller (LTDC) |
| Math Accelerators | FMAC, CORDIC, single-precision hardware MAC |
| Security | Cryptographic accelerators, TRNG, secure boot support |
| FPU | Double-precision IEEE 754 |
| Cache | 16 KB I-cache + 16 KB D-cache |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant |
STM32H7A3VIT6 핀 구성
| 핀 1 | PE2 — General-purpose I/O (TRACECLK on some packages) |
| 핀 2 | PE3 — General-purpose I/O (TRACED0) |
| 핀 3 | PE4 — General-purpose I/O (TRACED1) |
| 핀 4 | PE5 — General-purpose I/O (TRACED2) |
| 핀 5 | PE6 — General-purpose I/O (TRACED3) |
| 핀 6 | VBAT — Backup battery supply for RTC/TAMP |
| 핀 7 | PC13 — GPIO / TAMPER-RTC (anti-tamper) |
| 핀 8 | PC14 — GPIO / OSC32_IN (LSE crystal) |
| 핀 9 | PC15 — GPIO / OSC32_OUT (LSE crystal) |
| 핀 10 | VSS — Ground reference |
| 핀 11 | VDD — Digital supply (1.62-3.6 V) |
| 핀 12 | PH0 — OSC_IN (HSE crystal) |
| 핀 13 | PH1 — OSC_OUT (HSE crystal) |
| 핀 14 | NRST — Reset input (active low) |
| 핀 15 | PC0 — GPIO / ADC1_INP10 |
| 핀 16 | PC1 — GPIO / ADC1_INP11 / DAC2 |
| 핀 17 | PC2 — GPIO / ADC1_INP12 |
| 핀 18 | PC3 — GPIO / ADC1_INP13 |
| 핀 19 | VSSA — Analog ground |
| 핀 20 | VDDA — Analog supply (1.62-3.6 V) |
| 핀 21 | PA0 — GPIO / ADC1_INP0 / TIM5_CH1 |
| 핀 22 | PA1 — GPIO / ADC1_INP1 / TIM5_CH2 |
| 핀 23 | PA2 — GPIO / ADC1_INP2 / USART2_TX |
| 핀 24 | PA3 — GPIO / ADC1_INP3 / USART2_RX |
| 핀 25 | VSS — Ground reference |
| 핀 26 | VDD — Digital supply (1.62-3.6 V) |
| 핀 27 | PA4 — GPIO / ADC1_INP4 / DAC1 |
| 핀 28 | PA5 — GPIO / ADC1_INP5 |
| 핀 29 | PA6 — GPIO / ADC1_INP6 / TIM13_CH1 |
| 핀 30 | PA7 — GPIO / ADC1_INP7 / TIM14_CH1 |
| 핀 31 | PC4 — GPIO / ADC2_INP4 |
| 핀 32 | PC5 — GPIO / ADC2_INP5 |
| 핀 33 | PB0 — GPIO / ADC2_INP8 / TIM3_CH3 |
| 핀 34 | PB1 — GPIO / ADC2_INP9 / TIM3_CH4 |
| 핀 35 | PB2 — GPIO / BOOT1 |
| 핀 36 | PE7 — GPIO / TIM1_ETR |
| 핀 37 | PE8 — GPIO / TIM1_CH1N |
| 핀 38 | PE9 — GPIO / TIM1_CH1 |
| 핀 39 | PE10 — GPIO / TIM1_CH2N |
| 핀 40 | PE11 — GPIO / TIM1_CH2 |
| 핀 41 | PE12 — GPIO / TIM1_CH3N |
| 핀 42 | PE13 — GPIO / TIM1_CH3 |
| 핀 43 | PE14 — GPIO / TIM1_CH4 |
| 핀 44 | PE15 — GPIO / TIM1_BKIN |
| 핀 45 | PB10 — GPIO / I2C2_SCL / USART3_TX |
| 핀 46 | PB11 — GPIO / I2C2_SDA / USART3_RX |
| 핀 47 | VCAP_1 — Core voltage decoupling (1.0 V regulator output) |
| 핀 48 | VDD — Digital supply (1.62-3.6 V) |
| 핀 49 | PB12 — GPIO / SPI2_NSS / TIM1_BKIN |
| 핀 50 | PB13 — GPIO / SPI2_SCK |
| 핀 51 | PB14 — GPIO / SPI2_MISO |
| 핀 52 | PB15 — GPIO / SPI2_MOSI |
| 핀 53 | PD8 — GPIO / USART3_TX |
| 핀 54 | PD9 — GPIO / USART3_RX |
| 핀 55 | PD10 — GPIO |
| 핀 56 | PD11 — GPIO |
| 핀 57 | PD12 — GPIO / TIM4_CH1 |
| 핀 58 | PD13 — GPIO / TIM4_CH2 |
| 핀 59 | PD14 — GPIO / TIM4_CH3 |
| 핀 60 | PD15 — GPIO / TIM4_CH4 |
| 핀 61 | PC6 — GPIO / TIM3_CH1 / USART6_TX |
| 핀 62 | PC7 — GPIO / TIM3_CH2 / USART6_RX |
| 핀 63 | PC8 — GPIO / TIM3_CH3 / SDMMC1_D0 |
| 핀 64 | PC9 — GPIO / TIM3_CH4 / SDMMC1_D1 |
| 핀 65 | PA8 — GPIO / TIM1_CH1 / MCO1 |
| 핀 66 | PA9 — GPIO / USART1_TX |
| 핀 67 | PA10 — GPIO / USART1_RX |
| 핀 68 | PA11 — GPIO / USB1_DM |
| 핀 69 | PA12 — GPIO / USB1_DP |
| 핀 70 | PA13 — GPIO / SWDIO (JTMS) |
| 핀 71 | VCAP_2 — Core voltage decoupling (1.0 V regulator output) |
| 핀 72 | VDD — Digital supply (1.62-3.6 V) |
| 핀 73 | PA14 — GPIO / SWCLK (JTCK) |
| 핀 74 | PA15 — GPIO / JTDI / TIM2_CH1 |
| 핀 75 | PC10 — GPIO / SDMMC1_D2 / USART3_TX |
| 핀 76 | PC11 — GPIO / SDMMC1_D3 / USART3_RX |
| 핀 77 | PC12 — GPIO / SDMMC1_CK |
| 핀 78 | PD0 — GPIO / CAN1_RX / FMC_D2 |
| 핀 79 | PD1 — GPIO / CAN1_TX / FMC_D3 |
| 핀 80 | PD2 — GPIO / SDMMC1_CMD / TIM3_ETR |
| 핀 81 | PD3 — GPIO / USART2_CTS |
| 핀 82 | PD4 — GPIO / USART2_RTS / FMC_NOE |
| 핀 83 | PD5 — GPIO / USART2_TX / FMC_NWE |
| 핀 84 | PD6 — GPIO / USART2_RX / FMC_NWAIT |
| 핀 85 | PD7 — GPIO / USART2_CK / FMC_NE1 |
| 핀 86 | PB3 — GPIO / JTDO / TIM2_CH2 |
| 핀 87 | PB4 — GPIO / JTRST / TIM3_CH1 |
| 핀 88 | PB5 — GPIO / I2C1_SMBAI / TIM3_CH2 |
| 핀 89 | PB6 — GPIO / I2C1_SCL / USART1_TX |
| 핀 90 | PB7 — GPIO / I2C1_SDA / USART1_RX |
| 핀 91 | BOOT0 — Boot mode selection |
| 핀 92 | PB8 — GPIO / I2C1_SCL / TIM4_CH3 |
| 핀 93 | PB9 — GPIO / I2C1_SDA / TIM4_CH4 |
| 핀 94 | PE0 — GPIO / TIM4_ETR |
| 핀 95 | PE1 — GPIO |
| 핀 96 | VSS — Ground reference |
| 핀 97 | VSS — Ground reference (additional) |
| 핀 98 | VSS — Ground reference (additional) |
| 핀 99 | VCAP_3 — Core voltage decoupling (1.0 V regulator output) |
| 핀 100 | VSS — Ground reference |
일반적인 애플리케이션
STM32H7A3VIT6 적합 용도: 7 애플리케이션s: Industrial Motor Drives, Human-Machine Interface (HMI) Panels, Professional Audio Interfaces and DSP, Factory Automation PLCs and Edge Gateways, Medical Diagnostic and Monitoring Equipment, Automotive Body and Comfort Modules, IoT Edge Devices with Secure Connectivity.
Industrial Motor Drives
The STM32H7A3VIT6 is a strong fit for industrial motor drives because its Cortex-M7 core runs at 280 MHz with hardware FMAC and CORDIC accelerators that offload field-oriented control (FOC) math. Engineers benefit from three 16-bit ADCs sampling up to 3.6 MSPS for simultaneous current/voltage sensing, plus HRTIM-style timers (per the STM32H7 peripheral set) for precise PWM generation. The 100-pin LQFP gives enough GPIO for multiple encoder/HALL inputs and CAN FD for drive networking. Designers migrating from F7 parts gain ~30 percent extra CPU headroom, allowing longer control loops or onboard condition monitoring.
추천
Human-Machine Interface (HMI) Panels
For HMI panels, the STM32H7A3VIT6's integrated LTDC controller and Chrom-ART DMA2D engine drive TFT-LCD displays up to XGA without an external graphics controller. The 280 MHz Cortex-M7 with 1.4 MB total SRAM keeps frame buffers in on-chip memory for smoother UI animations and reduces external SDRAM cost. Hardware JPEG decode and the double-precision FPU accelerate image rendering pipelines. Verified ST product documentation highlights LTDC + DMA2D as key H7A3 differentiators against the H753 line.
추천
Professional Audio Interfaces and DSP
Audio interfaces benefit from the STM32H7A3VIT6's Cortex-M7 DSP extensions, double-precision FPU, and SAI/SDMMC peripherals. At 280 MHz the part sustains multi-channel audio codecs at 192 kHz while running UI and USB streaming tasks. The 2 MB Flash stores firmware plus audio effects, and the ~1.4 MB SRAM allows large I/O buffers. Compared with the STM32F4 line, the H7A3 doubles headroom for reverb and EQ DSP, while keeping the same LQFP-100 footprint for layout reuse.
추천
Factory Automation PLCs and Edge Gateways
Edge gateways and PLCs leverage the STM32H7A3VIT6's mix of high-speed communication peripherals: USB 2.0 High-Speed OTG, multiple CAN FD controllers, SDMMC for storage, and FMC for legacy parallel memory or FPGA links. The Cortex-M7's 280 MHz speed lets engineers run TLS, OPC UA PubSub, or lightweight container logic in parallel with deterministic control. Verified Mouser listings describe the H7A3 family as 'High-performance & DSP DP-FPU, Arm Cortex-M7 MCU 2MBytes of Flash 1376 KB SRAM', which aligns with edge-compute workloads.
추천
Medical Diagnostic and Monitoring Equipment
Patient monitors and portable diagnostics require both deterministic processing and trustworthy security. The STM32H7A3VIT6 provides the Cortex-M7 with hardware crypto accelerators and TRNG, supporting secure boot and encrypted firmware updates. Three 16-bit ADCs at 3.6 MSPS are ideal for high-fidelity biosignal acquisition (ECG, SpO2, EEG), while the 2 MB Flash stores waveforms and reference data. The -40 C to +85 C industrial temperature range supports bedside and laboratory environments.
추천
Automotive Body and Comfort Modules
For body controllers, HVAC modules, and lighting ECUs, the automotive-grade STM32H7A3VIT6Q variant offers AEC-Q100 qualification in the same 100-pin LQFP. Verified DigiKey listings confirm the 'Q' suffix part ships with the same die and 280 MHz clock, but adds -40 C to +125 C operation. CAN FD and the rich timer set (per the H7A3 peripheral map) handle body-network messaging and PWM-driven lighting. Using the non-Q version for non-automotive designs keeps the BOM cost down while retaining the same firmware base.
추천
IoT Edge Devices with Secure Connectivity
IoT edge nodes benefit from the STM32H7A3VIT6's hardware crypto accelerators, TRNG, and secure-boot support, which are mandatory for OTA update integrity. The Cortex-M7 at 280 MHz runs TLS handshakes and on-device ML inference (CMSIS-NN) while still leaving headroom for sensor fusion. The 2 MB Flash accommodates OTA staging, and 1.4 MB SRAM keeps neural-network activations on-chip. The 100-pin LQFP exposes SDMMC and USB HS for high-throughput logging and provisioning.
추천
추천 제품 요약
엔지니어링 참조 데이터: STM32H7A3VIT6 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | STM32H7A3VIT6Q | STM32H7A3RIT6 | STM32H753XIH6 | STM32H745IIT6 | STM32F767IIT6 |
|---|---|---|---|---|---|---|
| Brand | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics |
| Package | 100-LQFP (14x14) | 100-LQFP (14x14) - same | 100-LQFP (14x14) - same | 100-LQFP (14x14) - same | 100-LQFP (14x14) - same | 100-LQFP (14x14) - same |
| Core | ARM Cortex-M7 (single) | ARM Cortex-M7 (single) | ARM Cortex-M7 (single) | ARM Cortex-M7 (single) | ARM Cortex-M7 + Cortex-M4 (dual) | ARM Cortex-M7 (single) |
| Maximum Clock | 280 MHz | 280 MHz | 280 MHz | 280 MHz | 280 MHz | 216 MHz |
| Flash Memory | 2 MB | 2 MB | 64 KB | 2 MB | 2 MB | 2 MB |
| SRAM | ~1.4 MB | ~1.4 MB | ~1 MB | ~1 MB | ~1 MB | ~512 KB |
| Graphics (LTDC + DMA2D) | Yes | Yes | Yes | No | Yes | Yes |
| Ethernet MAC | No | No | No | Yes | Yes | Yes |
| Automotive Grade (AEC-Q100) | No | Yes (-40 C to +125 C) | No | No | No | No |
주요 차별점
- Highest-frequency single-core Cortex-M7 with LTDC graphics (vs STM32H753XIH6)
- Larger SRAM budget than the H745 dual-core variant in the same footprint (vs STM32H745IIT6)
- Doubles CPU headroom versus the STM32F7 generation (vs STM32F767IIT6)
설계 노트
Decouple the four VDD/VDDA/VBAT rails with 100 nF X7R ceramics placed within 5 mm of each supply pin, plus a bulk 4.7 uF per rail. The internal SMPS (when present on the die) requires the VCAP_1/VCAP_2/VCAP_3 pins to be tied to a 2.2 uF low-ESR ceramic; inadequate capacitance is a common cause of brown-out resets at high dI/dt loads. Verified ST reference designs recommend 4.7 uF on VDD and a ferrite bead between VDD and VDDA if the analog rails must be quiet for ADC SNR.
Route the 100-pin LQFP (14x14) escape with 0.2 mm traces and 0.2 mm spacing; break out inner-row pins on the top layer with micro vias. Place a continuous ground pour on layer 2 below the package to give the SDRAM/USB reference planes a low-impedance return path. The USB DP/DM traces must be 90 ohm differential, length-matched within 150 mil, and free of stubs.
Do not leave BOOT0 floating: tie it to GND through a 10 k resistor for normal boot from Flash, or drive it high to enter the system bootloader for recovery. Field firmware updates that rely on secure boot must configure the option-byte OTP area before production; OTP writes are one-time-only. Finally, the LSE crystal requires a load capacitor matching its CL spec (typically 7 pF for ECS-3x8x crystals); mismatched capacitance drifts the RTC.
규정 준수 정보
RoHS and REACH compliance confirmed via STMicroelectronics product page. Non-Q variant is not AEC-Q100 qualified; choose STM32H7A3VIT6Q for AEC-Q100. Halogen-free status not explicitly stated in verified web data.
