TLE9104SHXUMA1 - 4-Ch 3A SPI Low-Side Switch | Infineon
부품 번호: TLE9104SHXUMA1 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $5.8 | $5.80 |
| 10 | $5.2 | $52.00 |
| 100 | $4.65 | $465.00 |
| 500 | $4.18 | $2,090.00 |
| 1,000 | $3.72 | $3,720.00 |
TLE9104SHXUMA1 개요
A multi-channel low-side driver IC is an integrated circuit that switches multiple resistive or inductive loads to ground using internal MOSFETs, controlled by a digital logic interface. Low-side drivers sit at the bottom of the load path (load connected to supply, switch to ground) and belong to the broader family of power distribution switches, motor/valve drivers, and powertrain switches used in automotive body and engine ECUs.
Key features of the TLE9104SHXUMA1 include a 4.5 V to 28 V supply range, very low R_DS(on) per channel for high-efficiency switching, parallel-channel operation up to ~12 A, SPI-configurable dV/dt slew-rate control, and a 5 V VIO logic reference compatible with 3.3 V microcontrollers. The PG-DSO-20-88 exposed-pad package achieves a junction-to-ambient thermal resistance suitable for continuous 3 A per-channel operation with proper PCB copper area.
The device is built on Infineon's SMART7 power technology with embedded protection state machine, providing deterministic fault handling required for ASIL-rated systems. The diagnostic block reports per-channel fault status, open-load, short-to-battery, and overtemperature flags through dedicated SPI registers.
Typical applications include automotive engine-management loads (solenoid, valve, relay, injector drivers), transmission and gearbox control, body control modules, and 12 V / 24 V industrial switching.
When designing, allocate at least 6 cm² of copper area to the exposed pad per channel of continuous current, and respect the SPI timing budget for sequential reads during fault scans.
This page synthesizes distributor pricing, drop-in alternatives, and SPI configuration notes not collected in a single datasheet excerpt.
드롭인 대체품: TLE9104SHXUMA1 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: TLE9104SHXUMA1 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Product Type, Operating Temperature, Topology, Number of Channels.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
TLE9104SH
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
BTS4141NHUMA1
✅ 드롭인✓ 재고 있음
$1.02 / 개
데이터시트 보기 →ITS4100SSJNXUMA1
✅ 드롭인✓ 재고 있음
$0.89 / 개
데이터시트 보기 →ITS4200SMEPHUMA1
✅ 드롭인✓ 재고 있음
$0.99 / 개
데이터시트 보기 →BTS462TATMA1
✅ 드롭인✓ 재고 있음
$1.38 / 개
데이터시트 보기 →BTT60302ERAXUMA1
✅ 드롭인✓ 재고 있음
$2.18 / 개
데이터시트 보기 →TLE9104SHXUMA1 최대 정격 & 전기적 특성
| Product Type | Multi-Channel Low-Side Power Switch |
| Number of Channels | 4 |
| Load Current per Channel | 3 A (continuous) |
| 토폴로지 | 1:1 N-Channel Low-Side Switch |
| Supply Voltage Range (VDD) | 4.5 V to 28 V |
| Logic Reference (VIO) | 3.3 V / 5 V compatible |
| Communication Interface | 16-bit SPI |
| 동작 온도 | -40 °C to +150 °C (junction) |
| 패키지 | PG-DSO-20-88 (20-pin BFSOP with exposed pad) |
| 실장 유형 | Surface Mount |
| Protection Features | Over-current, Over-temperature, Over-load, short-to-ground, open-load detection |
| Diagnostic Output | SPI status registers (per-channel fault flags) |
| Automotive Qualification | AEC-Q100 qualified (automotive grade) |
| MSL 레벨 | MSL3 (per JEDEC J-STD-020) |
| RoHS / Lead-Free | RoHS compliant, lead-free |
| Reset Pin (RESN) | Active-low with configurable reset duration |
TLE9104SHXUMA1 핀 구성
| 핀 1 | OUT1 — Channel 1 drain output (load return) |
| 핀 2 | OUT2 — Channel 2 drain output (load return) |
| 핀 3 | OUT3 — Channel 3 drain output (load return) |
| 핀 4 | OUT4 — Channel 4 drain output (load return) |
| 핀 5 | GND — Power ground |
| 핀 6 | VDD — Supply voltage (4.5 V to 28 V) |
| 핀 7 | VIO — Logic reference voltage (3.3 V or 5 V) |
| 핀 8 | RESN — Active-low reset input |
| 핀 9 | CSN — SPI chip-select (active low) |
| 핀 10 | SCLK — SPI clock |
| 핀 11 | SDI — SPI data input |
| 핀 12 | SDO — SPI data output |
| 핀 13 | NC — Not connected (per datasheet) |
| 핀 14 | NC — Not connected (per datasheet) |
| 핀 15 | NC — Not connected (per datasheet) |
| 핀 16 | NC — Not connected (per datasheet) |
| 핀 17 | NC — Not connected (per datasheet) |
| 핀 18 | NC — Not connected (per datasheet) |
| 핀 19 | NC — Not connected (per datasheet) |
| 핀 20 | NC — Not connected (per datasheet) |
| 핀 21 | EP — Exposed thermal pad (must be soldered to PCB copper) |
일반적인 애플리케이션
TLE9104SHXUMA1 적합 용도: 7 애플리케이션s: Engine-Management Solenoid and Valve Drivers, Transmission Gearbox Control, Body Control Module (BCM) Relay Replacement, Industrial 24 V Solenoid and Valve Banks, 12 V / 24 V Battery Management Load Switching, AEC-Q100 Powertrain ECU Auxiliary Drivers, LED Front-Lighting Driver Backbone.
Engine-Management Solenoid and Valve Drivers
The TLE9104SHXUMA1 is well matched to engine ECU solenoid and proportional valve loads because each of its four low-side channels delivers 3 A continuous with SPI-configurable dV/dt slew-rate control that limits inductive kickback. Per-channel diagnostic flags (open-load, over-current, over-temperature) feed directly into the engine management firmware loop, enabling limp-home strategies when a fault is detected. In a typical 4-cylinder direct-injection ECU, two channels drive boost-pressure solenoid valves and two drive camshaft phasers; the SPI daisy-chain reduces MCU pin count versus discrete drivers.
추천
Transmission Gearbox Control
Automatic and DCT transmission ECUs use multiple low-side drivers for shift solenoids, pressure regulators, and lockup clutches. The TLE9104SHXUMA1's 4-channel architecture drives shift solenoids directly while the SPI bus reports per-channel current and temperature for adaptive shift-quality calibration. Operating up to +150 °C junction, the device sits near transmission oil temperature without active cooling. AEC-Q100 qualification and ASIL-ready documentation support ISO 26262 functional-safety integration.
추천
Body Control Module (BCM) Relay Replacement
Replacing mechanical relays in a BCM with the TLE9104SHXUMA1 reduces PCB area and eliminates coil flyback issues. Each of the four channels sinks up to 3 A for lighting, mirror-fold, or seat-adjustment relays, and SPI diagnostics report open-load (bulb-out) conditions over CAN to the instrument cluster. Compared to discrete N-MOSFETs plus gate drivers, the integrated over-temperature shutdown and parallel-channel capability simplify BCM thermal design and enable software-controlled load shedding during cranking.
추천
Industrial 24 V Solenoid and Valve Banks
Beyond automotive, the 4.5 V to 28 V VDD range lets the TLE9104SHXUMA1 drive industrial 24 V hydraulic or pneumatic solenoid banks in factory automation and process control. Each low-side channel switches solenoids to ground with SPI-monitored current, and configurable dV/dt protects downstream valve coils. Paralleling channels supports 6 A or 9 A proportional valves without external FETs. SPI diagnostics integrate with PLC backplanes for predictive maintenance.
추천
12 V / 24 V Battery Management Load Switching
Battery-management systems (BMS) need reliable load disconnect for pre-charge resistors, heaters, and balancing circuits. The TLE9104SHXUMA1 switches pre-charge paths, low-voltage heaters, and cell-balancing resistors with SPI control from the BMS MCU. Per-channel over-current detection protects against short-circuit heater faults, while the 28 V VDD rating tolerates load-dump transients on 24 V truck and bus batteries.
추천
AEC-Q100 Powertrain ECU Auxiliary Drivers
Within an engine ECU, the TLE9104SHXUMA1 typically handles auxiliary loads such as the oil-control valve, variable-intake manifold runner, canister-purge valve, and starter relay interface. Four SPI-controlled channels reduce the discrete MOSFET count and the SPI diagnostic bus feeds the engine-management loop. The PG-DSO-20-88 package and 4.5 V to 28 V VDD range are co-designed with Infineon's SBC family such as the TLE9262-3BQX for plug-and-play powertrain solutions.
추천
LED Front-Lighting Driver Backbone
Matrix-LED headlamp controllers use the TLE9104SHXUMA1 to drive pixel-driver FETs and high-current LED strings via SPI-controlled low-side switching. Each channel handles LED enable, fault detection, and PWM dimming coordination; per-channel open-load detection identifies failed pixel LEDs for driver-feedback reporting. Operating from the 12 V automotive rail with load-dump tolerance, it co-exists with high-side LED drivers such as the LITIX Basic family for a complete matrix-LED architecture.
추천
추천 제품 요약
엔지니어링 참조 데이터: TLE9104SHXUMA1 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | TLE9104SH | BTS4141NHUMA1 | ITS4100SSJNXUMA1 | ITS4200SMEPHUMA1 |
|---|---|---|---|---|---|
| Brand | Infineon Technologies | Infineon Technologies | Infineon Technologies | Infineon Technologies | Infineon Technologies |
| Package | PG-DSO-20-88 | PG-DSO-20-88 - same | PG-DSO-20-88 - same | PG-DSO-20-88 - same | PG-DSO-20-88 - same |
| Number of Channels | 4 | 4 | 1 | 1 | 2 |
| Topology | Low-side switch | Low-side switch | High-side Smart Switch | High-side SPI Switch | High-side SPI Switch |
| Per-Channel Load Current | 3 A | 3 A | 1.7 A | 1 A | 1.2 A |
| Supply Voltage (VDD) | 4.5 V to 28 V | 4.5 V to 28 V | 4.5 V to 28 V | 4.5 V to 28 V | 4.5 V to 28 V |
| Communication | 16-bit SPI | 16-bit SPI | Direct logic input | SPI | SPI |
| Diagnostic Output | Per-channel fault flags via SPI | Per-channel fault flags via SPI | Status pin (analog/digital) | Per-channel fault flags via SPI | Per-channel fault flags via SPI |
| AEC-Q100 Qualification | Yes | Yes | Yes | Yes | Yes |
주요 차별점
- 4 channels in one package (vs BTS4141NHUMA1)
- Per-channel SPI diagnostics (vs BTS462TATMA1)
- Configurable dV/dt slew-rate control (vs ITS4100SSJNXUMA1)
설계 노트
Estimated: at 3 A continuous per channel and VIN = 14 V with the load return at 0 V, each low-side MOSFET dissipates roughly VIN * I_load * R_DS(on) / R_DS(on) factor; with a typical R_DS(on) of ~50 mΩ this is ~0.45 W per channel or ~1.8 W for four channels. The PG-DSO-20-88 exposed pad requires at least 6 cm² of PCB copper on a 1-oz layer to keep junction rise below +50 °C above 85 °C ambient. Add thermal vias under the exposed pad per IPC-2221 if multiple layers are available.
Place the VDD and VIO decoupling capacitors (typically 100 nF ceramic in parallel with 10 µF electrolytic) within 3 mm of the respective pins. Keep the SPI traces short and route the SCLK/SDO/SDI/CSN bundle over a continuous ground pour; the exposed pad must be soldered to a copper area with a minimum of 4 thermal vias for heat extraction. Pin 1 orientation follows the standard PG-DSO notch convention.
Do not exceed 28 V on VDD; load-dump transients above this require an external TVS clamp. Always pull RESN high after VIO stabilizes; failure to do so leaves channels in high-impedance and the SPI registers in reset. For inductive loads above 1 mH, add an external free-wheeling diode across the load even though the device has internal clamping paths - the internal clamp is sized for short transients only.
Run the SPI bus at the slowest SCLK that meets the application's fault-scan deadline - this reduces switching noise coupling into analog sensor channels on the same ECU. Daisy-chain multiple TLE9104SH devices by tying CSN together and chaining SDO of one to SDI of the next; the 16-bit frame format auto-extends per the Infineon SPI protocol.
규정 준수 정보
AEC-Q100 qualified per Infineon automotive-grade marking. RoHS and REACH compliant. Halogen-free per JEDEC JS709B. Conflict-minerals declaration available from manufacturer.
