TLE94112ESXUMA1 - 12-Fold Half-Bridge DC Motor Driver | Infineon
부품 번호: TLE94112ESXUMA1 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $2.1 | $2.10 |
| 10 | $1.95 | $19.50 |
| 100 | $1.78 | $178.00 |
| 500 | $1.55 | $775.00 |
| 1,000 | $1.32 | $1,320.00 |
| 3,000 | $1.1 | $3,300.00 |
TLE94112ESXUMA1 개요
What is a multi half-bridge driver? It is a power-management IC that integrates multiple low-side/high-side FET half-bridges into a single package, replacing discrete H-bridge MOSFET assemblies. Within the broader taxonomy, the TLE94112ESXUMA1 sits as: half-bridge driver -> full/half-bridge driver -> motor driver -> power management IC -> semiconductor. Other members of Infineon's TLE94xyz family span 3 to 12 outputs and offer either direct PWM inputs or SPI control.
Key features include per-channel current limiting, over-temperature shutdown, open-load detection, and short-circuit protection to ground or supply. The wide supply range supports 5.5 V to 18 V operation (with load-dump tolerance up to 40 V typical for 12 V automotive systems), and the exposed thermal pad of the PG-TSDSO-24 package provides a low-resistance path to PCB copper for heatsinking. SPI daisy-chaining reduces microcontroller GPIO count when controlling multiple drivers in a vehicle.
Typical applications span HVAC flap DC motors, seat-adjustment modules, window lift and sunroof drives, mirror adjusters, and other small brushed-DC loads in body-electronics modules. The integrated protection set reduces external component count and improves functional safety metrics when paired with a host MCU.
A design consideration is that even though the TLE94112ESXUMA1 is highly integrated, paralleling outputs to achieve higher continuous current still requires careful thermal layout - the PG-TSDSO-24 EP must be soldered to a sufficiently large copper area to keep junction temperature within the -40 C to +150 C operating range. Always close an input bulk capacitor near the VS pin to absorb load-dump transients.
This page consolidates Infineon datasheet parameters, cross-distributor pricing, drop-in same-brand family variants, and practical PCB layout guidance not found in the manufacturer datasheet alone.
드롭인 대체품: TLE94112ESXUMA1 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: TLE94112ESXUMA1 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Product Type, Operating Temperature Range, Communication Interface, Maximum Output Current per Channel.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
TLE94112ELXUMA1
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
TLE94110ESXUMA1
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$2.45 / 개
데이터시트 보기 →TLE94108ESXUMA1
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
TLE9104SHXUMA1
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$3.72 / 개
데이터시트 보기 →TLE94112ESXUMA1 최대 정격 & 전기적 특성
| 출력 구성 | 12 half-bridge drivers |
| 출력 수 | 12 |
| Output Current per Channel | 0.9 A (typical, see datasheet) |
| Supply Voltage VS | 5.5 V to 18 V |
| Load-Dump Tolerance | Up to 40 V (per family datasheet) |
| 인터페이스 | SPI (daisy-chainable up to 16 devices) |
| Topology Support | Half-bridge, full-bridge, parallel outputs |
| 동작 온도 | -40 C to +150 C |
| Protection Features | Over-temperature, over-current, open-load, short to GND/VBAT |
| 패키지 | PG-TSDSO-24 (exposed pad) |
| 실장 유형 | Surface Mount |
| Standard Pack Quantity | 3000 (Tape & Reel) |
| Application Family | TLE94xyz DC motor driver family |
TLE94112ESXUMA1 핀 구성
| 핀 1 | VS — Battery supply input (5.5 V to 18 V) |
| 핀 2 | OUT1 — Half-bridge output 1 |
| 핀 3 | OUT2 — Half-bridge output 2 |
| 핀 4 | OUT3 — Half-bridge output 3 |
| 핀 5 | OUT4 — Half-bridge output 4 |
| 핀 6 | OUT5 — Half-bridge output 5 |
| 핀 7 | OUT6 — Half-bridge output 6 |
| 핀 8 | GND — Power ground |
| 핀 9 | OUT7 — Half-bridge output 7 |
| 핀 10 | OUT8 — Half-bridge output 8 |
| 핀 11 | OUT9 — Half-bridge output 9 |
| 핀 12 | OUT10 — Half-bridge output 10 |
| 핀 13 | OUT11 — Half-bridge output 11 |
| 핀 14 | OUT12 — Half-bridge output 12 |
| 핀 15 | CSN — SPI chip-select (active low) |
| 핀 16 | SCLK — SPI clock input |
| 핀 17 | SDI — SPI data input |
| 핀 18 | SDO — SPI data output (daisy-chain) |
| 핀 19 | INT — Interrupt / fault output |
| 핀 20 | RST — Reset input |
| 핀 21 | VDD — Logic 5V supply |
| 핀 22 | TEST — Test pin (tie to GND in application) |
| 핀 23 | NC — Not connected (per datasheet) |
| 핀 24 | EP — Exposed thermal pad - solder to GND copper |
일반적인 애플리케이션
TLE94112ESXUMA1 적합 용도: 6 애플리케이션s: Automotive HVAC Flap DC Motor Control, Power Seat Adjustment Modules, Power Window Lift and Sunroof Drive, Side Mirror Adjustment and Fold, Body Electronics Central Control Module, Industrial Multi-Axis Stepper and Solenoid Driver Hub.
Automotive HVAC Flap DC Motor Control
The TLE94112ESXUMA1 is purpose-built by Infineon for Heating, Ventilation and Air Conditioning (HVAC) flap DC motor control, where a single ECU drives multiple small brushed DC motors that mix air and direct airflow. With twelve half-bridge outputs configurable as full H-bridges, one device can replace several discrete MOSFET H-bridges and cut PCB area dramatically. The integrated SPI daisy-chain interface enables cascading up to sixteen drivers for higher-end climate-control modules. Built-in open-load, short-circuit, and over-temperature diagnostics support ISO 26262 functional-safety goals by letting the host MCU detect stuck flaps without external current-sense amplifiers.
추천
Power Seat Adjustment Modules
Power seat modules use four to eight brushed DC motors for recline, slide, height, and lumbar adjustment. The TLE94112ESXUMA1's twelve half-bridge outputs can be configured as six full H-bridges, which exactly matches a typical 6-motor seat cluster with margin for headrest adjusters. SPI control reduces the host MCU's pin count compared to direct-PWM drivers, and the integrated over-current protection prevents seat-trap events by detecting stalled motors. The -40 C to +150 C junction range covers the harsh cabin environment after sun-load derating.
추천
Power Window Lift and Sunroof Drive
Power window lifters and sunroofs require full H-bridge control with anti-pinch current sensing, which the TLE94112ESXUMA1 supports through its SPI-accessible status registers and per-channel current-limit thresholds. Each window motor can be driven from one full H-bridge pair, leaving spare channels for mirror fold and door-lock control. Compared to discrete relay-based designs, the TLE94112ESXUMA1 eliminates click noise and extends mechanical life by enabling soft-start PWM profiles from the host MCU.
추천
Side Mirror Adjustment and Fold
Side mirrors typically use two DC motors - one for horizontal mirror glass adjustment and one for vertical adjustment - plus a third for power-fold. The TLE94112ESXUMA1 can drive all three with one half-bridge pair plus a third channel, and its open-load detection flags jammed mirror mechanisms to the body-control module. Combined with BTS7200x2EPAXUMA1 high-side switches for mirror heating, the design scales to a complete mirror module on a compact PCB.
추천
Body Electronics Central Control Module
A central body-control module consolidates multiple low-current DC loads such as seat heaters, mirror heaters, headlamp levelers, and trunk-lid actuators. The TLE94112ESXUMA1 sits at the heart of such a module, providing SPI-controlled half-bridges for each function while companion high-side drivers like the BTS621L1E3128AAUMA1 or ITS4200SSJDXUMA1 handle purely resistive loads. SPI daisy-chaining lets the BCM scale from four to twelve driver ICs on a single SPI bus, dramatically reducing MCU pin count compared to discrete low-side switches.
추천
Industrial Multi-Axis Stepper and Solenoid Driver Hub
Outside automotive, the TLE94112ESXUMA1's twelve half-bridges are well suited to industrial control hubs that drive multiple 24 V solenoid valves, small stepper motors via dual full-bridges, or LED indicator strings. The wide 5.5 V to 18 V VS range with 40 V load-dump tolerance extends to 24 V industrial supplies with adequate derating. SPI diagnostics integrate with PLC or industrial-IO-link controllers, while the small PG-TSDSO-24 footprint simplifies dense DIN-rail module layouts.
추천
추천 제품 요약
엔지니어링 참조 데이터: TLE94112ESXUMA1 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | TLE94112ELXUMA1 | TLE94110ESXUMA1 | TLE94108ESXUMA1 | TLE9104SHXUMA1 |
|---|---|---|---|---|---|
| Brand | Infineon | Infineon | Infineon | Infineon | Infineon |
| Package | PG-TSDSO-24 | PG-TSDSO-24 - same | PG-TSDSO-24 - same | PG-TSDSO-24 - same | PG-DSO-20 (smaller) |
| Half-Bridge Outputs | 12 | 12 | 10 | 8 | 4 |
| Interface | SPI (daisy-chainable) | SPI | SPI | SPI | SPI |
| Supply Voltage VS | 5.5 V to 18 V | 5.5 V to 18 V | 5.5 V to 18 V | 5.5 V to 18 V | 5.5 V to 18 V |
| Operating Temperature | -40 C to +150 C | -40 C to +150 C | -40 C to +150 C | -40 C to +150 C | -40 C to +150 C |
| Topology | Half/Full/Parallel | Half/Full/Parallel | Half/Full/Parallel | Half/Full/Parallel | Half/Full/Parallel |
| Automotive Grade | Yes (AEC-Q100 family) | Yes | Yes | Yes | Yes |
| Approx. Unit Price @1000 | $1.32 | Comparable | Comparable | Slightly lower | Lower (4-ch) |
주요 차별점
- Twelve half-bridge outputs in a single PG-TSDSO-24 package (vs TLE9104SHXUMA1)
- Full SPI daisy-chain capability for up to 16 devices (vs Discrete half-bridge ICs)
- Integrated open-load, short-to-GND/VBAT, and over-temperature diagnostics (vs Discrete MOSFET H-bridges)
설계 노트
Estimated: at full-load operation with twelve channels delivering 0.9 A each, the TLE94112ESXUMA1 dissipates substantial power through its PG-TSDSO-24 exposed pad. Solder the EP to a copper pour of at least 1 square inch on top and bottom layers with thermal vias to keep junction temperature below 150 C. Without adequate copper, output current must be derated linearly with ambient.
Place the VS bulk capacitor (>= 47 uF) within 5 mm of the VS pin to absorb load-dump transients up to 40 V. Add a 100 nF ceramic bypass directly at the VS pin for high-frequency noise suppression. Keep SPI traces (CSN, SCLK, SDI, SDO) short and routed away from OUT switching nodes to avoid crosstalk into logic signals.
Route each OUT pin trace with sufficient copper width to carry the expected peak current (recommend 0.5 mm width per 100 mA). Star-ground the power GND and logic GND at a single point near the IC's EP to prevent ground bounce from corrupting SPI communication. Use guard traces around OUT nets to limit EMI to neighboring analog or RF sections.
Do not leave the TEST pin floating - tie it to GND per the Infineon datasheet. Always configure unused outputs to high-impedance via SPI rather than leaving them floating, otherwise leakage currents can trigger false open-load diagnostics. Initialize SPI daisy-chain configuration before enabling any output to prevent spurious switching during power-up.
규정 준수 정보
AEC-Q100 qualification inferred from Infineon automotive-grade TLE94xyz family. RoHS compliance confirmed by Infineon product family datasheet. Halogen-free status not explicitly stated in verified web data - set to unknown.
