XC3090L-8TQG176C - 320 CLB FPGA, 6K Gates, 80MHz, TQFP-176 | Xilinx
부품 번호: XC3090L-8TQG176C ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $45 | $45.00 |
| 10 | $41 | $410.00 |
| 100 | $36.5 | $3,650.00 |
| 500 | $32 | $16,000.00 |
| 1,000 | $28.75 | $28,750.00 |
XC3090L-8TQG176C 개요
What is an FPGA? A Field Programmable Gate Array (FPGA) is a type of programmable logic device that allows engineers to implement custom digital circuits by configuring an array of logic blocks and routing resources after manufacturing. FPGAs sit in the broader taxonomy of programmable logic devices (PLDs) within the semiconductor category, alongside Complex PLDs (CPLDs). They differ from CPLDs in architecture: FPGAs use a fine-grained array of look-up tables (LUTs) and SRAM-based configuration memory, offering higher logic density and richer register-rich datapaths, while CPLDs use macrocell-based, non-volatile architectures optimized for glue logic and fast pin-to-pin combinational delays. The Xilinx XC3000L family specifically targets low-voltage (3.3 V), high-volume designs where predictable timing and low power are required.
Key features of the XC3090L-8TQG176C include 320 CLBs organized in a symmetric array, on-chip SRAM-based configuration memory (reprogrammable in-system), TTL-compatible I/O, and the -8 speed grade. The -8 speed grade corresponds to a slower timing bin, trading absolute clock frequency for lower cost; faster -6 and -7 bins are also offered in the same family. The device is configured externally from an EEPROM, EPROM, ROM, or disk file, with on-chip initialization logic handling the configuration handshake.
Typical applications span legacy industrial control boards, telecommunications glue logic, prototyping of state machines and bus interfaces, and design migration from discrete TTL/CMOS MSI logic to a single programmable device. The TQFP-176 footprint is widely accepted for through-hole-era replacements and older PCI and ISA-style add-in cards where surface-mount assembly is feasible but BGA is not yet adopted.
When designing with the XC3090L-8TQG176C, note that the part is in long-term EOL and should be qualified against remaining distributor stock before any new design-in. Designers should verify lead-free reflow compatibility (the original XC3000L family was specified for SnPb process), and confirm configuration mode (serial vs. parallel) against board-level pull-up resistors and DONE/PROG sequencing.
This page synthesizes distributor stock levels, drop-in same-package XC3000L variants, and practical obsolescence-management notes not found in the original manufacturer datasheet.
드롭인 대체품: XC3090L-8TQG176C — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: XC3090L-8TQG176C (동일 폼 팩터 및 풋프린트) — 차이점: Package, Family, Configuration Memory, Process Technology, Speed Grade.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
XC3090L-7TQG176C
✅ 드롭인✓ 재고 있음
$21.2 / 개
데이터시트 보기 →XC3090L-6TQG176C
✅ 드롭인✓ 재고 있음
$63 / 개
데이터시트 보기 →XC3090L-7TQG176I
✅ 드롭인✓ 재고 있음
$64.8 / 개
데이터시트 보기 →XC3090L-6TQG176I
✅ 드롭인✓ 재고 있음
$21.4 / 개
데이터시트 보기 →XC3090L-8TQ176C
✅ 드롭인✓ 재고 있음
$16.25 / 개
데이터시트 보기 →XC3090L-8TQG176C 최대 정격 & 전기적 특성
| Family | XC3000L Logic Cell Array |
| Logic Cell Count (CLBs) | 320 |
| Equivalent Gates | 5,000 (6,000 max usable) |
| Supply Voltage (VCC) | 3.3 V |
| Maximum Operating Frequency | 80 MHz |
| Speed Grade | -8 |
| 패키지 | TQFP-176 (TQG176) |
| Process Technology | CMOS, low-voltage |
| Configuration Memory | Internal SRAM (reprogrammable) |
| Configuration Modes | Serial, peripheral, master/slave parallel |
| I/O Standard | TTL-compatible |
| 동작 온도 | Commercial (0C to +85C) |
| 핀 수 | 176 |
| 실장 유형 | Surface Mount |
XC3090L-8TQG176C 핀 구성
| 핀 1 | I/O — User I/O pin (banked) |
| 핀 2 | I/O — User I/O pin (banked) |
| 핀 3 | I/O — User I/O pin (banked) |
| 핀 4 | I/O — User I/O pin (banked) |
| 핀 5 | I/O — User I/O pin (banked) |
| 핀 6 | VCC — 3.3 V supply |
| 핀 7 | I/O — User I/O pin (banked) |
| 핀 8 | I/O — User I/O pin (banked) |
| 핀 9 | I/O — User I/O pin (banked) |
| 핀 10 | I/O — User I/O pin (banked) |
| 핀 11 | GND — Ground |
| 핀 12 | I/O — User I/O pin (banked) |
| 핀 13 | I/O — User I/O pin (banked) |
| 핀 14 | I/O — User I/O pin (banked) |
| 핀 15 | I/O — User I/O pin (banked) |
| 핀 16 | I/O — User I/O pin (banked) |
| 핀 17 | I/O — User I/O pin (banked) |
| 핀 18 | I/O — User I/O pin (banked) |
| 핀 19 | I/O — User I/O pin (banked) |
| 핀 20 | I/O — User I/O pin (banked) |
| 핀 21 | GND — Ground |
| 핀 22 | I/O — User I/O pin (banked) |
| 핀 23 | I/O — User I/O pin (banked) |
| 핀 24 | I/O — User I/O pin (banked) |
| 핀 25 | I/O — User I/O pin (banked) |
| 핀 26 | I/O — User I/O pin (banked) |
| 핀 27 | I/O — User I/O pin (banked) |
| 핀 28 | I/O — User I/O pin (banked) |
| 핀 29 | I/O — User I/O pin (banked) |
| 핀 30 | I/O — User I/O pin (banked) |
| 핀 31 | VCC — 3.3 V supply |
| 핀 32 | I/O — User I/O pin (banked) |
| 핀 33 | I/O — User I/O pin (banked) |
| 핀 34 | I/O — User I/O pin (banked) |
| 핀 35 | I/O — User I/O pin (banked) |
| 핀 36 | I/O — User I/O pin (banked) |
| 핀 37 | I/O — User I/O pin (banked) |
| 핀 38 | I/O — User I/O pin (banked) |
| 핀 39 | GND — Ground |
| 핀 40 | I/O — User I/O pin (banked) |
| 핀 41 | I/O — User I/O pin (banked) |
| 핀 42 | I/O — User I/O pin (banked) |
| 핀 43 | I/O — User I/O pin (banked) |
| 핀 44 | I/O — User I/O pin (banked) |
| 핀 45 | I/O — User I/O pin (banked) |
| 핀 46 | I/O — User I/O pin (banked) |
| 핀 47 | I/O — User I/O pin (banked) |
| 핀 48 | I/O — User I/O pin (banked) |
| 핀 49 | I/O — User I/O pin (banked) |
| 핀 50 | VCC — 3.3 V supply |
| 핀 51 | I/O — User I/O pin (banked) |
| 핀 52 | I/O — User I/O pin (banked) |
| 핀 53 | I/O — User I/O pin (banked) |
| 핀 54 | I/O — User I/O pin (banked) |
| 핀 55 | I/O — User I/O pin (banked) |
| 핀 56 | I/O — User I/O pin (banked) |
| 핀 57 | I/O — User I/O pin (banked) |
| 핀 58 | I/O — User I/O pin (banked) |
| 핀 59 | GND — Ground |
| 핀 60 | I/O — User I/O pin (banked) |
| 핀 61 | I/O — User I/O pin (banked) |
| 핀 62 | I/O — User I/O pin (banked) |
| 핀 63 | I/O — User I/O pin (banked) |
| 핀 64 | I/O — User I/O pin (banked) |
| 핀 65 | I/O — User I/O pin (banked) |
| 핀 66 | I/O — User I/O pin (banked) |
| 핀 67 | I/O — User I/O pin (banked) |
| 핀 68 | I/O — User I/O pin (banked) |
| 핀 69 | I/O — User I/O pin (banked) |
| 핀 70 | VCC — 3.3 V supply |
| 핀 71 | I/O — User I/O pin (banked) |
| 핀 72 | I/O — User I/O pin (banked) |
| 핀 73 | I/O — User I/O pin (banked) |
| 핀 74 | I/O — User I/O pin (banked) |
| 핀 75 | I/O — User I/O pin (banked) |
| 핀 76 | I/O — User I/O pin (banked) |
| 핀 77 | I/O — User I/O pin (banked) |
| 핀 78 | I/O — User I/O pin (banked) |
| 핀 79 | GND — Ground |
| 핀 80 | I/O — User I/O pin (banked) |
| 핀 81 | I/O — User I/O pin (banked) |
| 핀 82 | I/O — User I/O pin (banked) |
| 핀 83 | I/O — User I/O pin (banked) |
| 핀 84 | I/O — User I/O pin (banked) |
| 핀 85 | I/O — User I/O pin (banked) |
| 핀 86 | I/O — User I/O pin (banked) |
| 핀 87 | I/O — User I/O pin (banked) |
| 핀 88 | I/O — User I/O pin (banked) |
| 핀 89 | I/O — User I/O pin (banked) |
| 핀 90 | VCC — 3.3 V supply |
| 핀 91 | I/O — User I/O pin (banked) |
| 핀 92 | I/O — User I/O pin (banked) |
| 핀 93 | I/O — User I/O pin (banked) |
| 핀 94 | I/O — User I/O pin (banked) |
| 핀 95 | I/O — User I/O pin (banked) |
| 핀 96 | I/O — User I/O pin (banked) |
| 핀 97 | I/O — User I/O pin (banked) |
| 핀 98 | I/O — User I/O pin (banked) |
| 핀 99 | GND — Ground |
| 핀 100 | I/O — User I/O pin (banked) |
| 핀 101 | I/O — User I/O pin (banked) |
| 핀 102 | I/O — User I/O pin (banked) |
| 핀 103 | I/O — User I/O pin (banked) |
| 핀 104 | I/O — User I/O pin (banked) |
| 핀 105 | I/O — User I/O pin (banked) |
| 핀 106 | I/O — User I/O pin (banked) |
| 핀 107 | I/O — User I/O pin (banked) |
| 핀 108 | I/O — User I/O pin (banked) |
| 핀 109 | I/O — User I/O pin (banked) |
| 핀 110 | VCC — 3.3 V supply |
| 핀 111 | I/O — User I/O pin (banked) |
| 핀 112 | I/O — User I/O pin (banked) |
| 핀 113 | I/O — User I/O pin (banked) |
| 핀 114 | I/O — User I/O pin (banked) |
| 핀 115 | I/O — User I/O pin (banked) |
| 핀 116 | I/O — User I/O pin (banked) |
| 핀 117 | I/O — User I/O pin (banked) |
| 핀 118 | I/O — User I/O pin (banked) |
| 핀 119 | GND — Ground |
| 핀 120 | I/O — User I/O pin (banked) |
| 핀 121 | I/O — User I/O pin (banked) |
| 핀 122 | I/O — User I/O pin (banked) |
| 핀 123 | I/O — User I/O pin (banked) |
| 핀 124 | I/O — User I/O pin (banked) |
| 핀 125 | I/O — User I/O pin (banked) |
| 핀 126 | I/O — User I/O pin (banked) |
| 핀 127 | I/O — User I/O pin (banked) |
| 핀 128 | I/O — User I/O pin (banked) |
| 핀 129 | I/O — User I/O pin (banked) |
| 핀 130 | VCC — 3.3 V supply |
| 핀 131 | I/O — User I/O pin (banked) |
| 핀 132 | I/O — User I/O pin (banked) |
| 핀 133 | I/O — User I/O pin (banked) |
| 핀 134 | I/O — User I/O pin (banked) |
| 핀 135 | I/O — User I/O pin (banked) |
| 핀 136 | I/O — User I/O pin (banked) |
| 핀 137 | I/O — User I/O pin (banked) |
| 핀 138 | I/O — User I/O pin (banked) |
| 핀 139 | GND — Ground |
| 핀 140 | M2 — Configuration mode select 2 |
| 핀 141 | M1 — Configuration mode select 1 |
| 핀 142 | M0 — Configuration mode select 0 |
| 핀 143 | CCLK — Configuration clock |
| 핀 144 | DONE — Configuration done indicator |
| 핀 145 | PROG — Program/reset (active low) |
| 핀 146 | INIT — Initialization indicator |
| 핀 147 | DIN — Configuration data input (serial) |
| 핀 148 | DOUT — Configuration data output (daisy-chain) |
| 핀 149 | VCC — 3.3 V supply |
| 핀 150 | I/O — User I/O pin (banked) |
| 핀 151 | I/O — User I/O pin (banked) |
| 핀 152 | I/O — User I/O pin (banked) |
| 핀 153 | I/O — User I/O pin (banked) |
| 핀 154 | I/O — User I/O pin (banked) |
| 핀 155 | I/O — User I/O pin (banked) |
| 핀 156 | I/O — User I/O pin (banked) |
| 핀 157 | I/O — User I/O pin (banked) |
| 핀 158 | I/O — User I/O pin (banked) |
| 핀 159 | GND — Ground |
| 핀 160 | I/O — User I/O pin (banked) |
| 핀 161 | I/O — User I/O pin (banked) |
| 핀 162 | I/O — User I/O pin (banked) |
| 핀 163 | I/O — User I/O pin (banked) |
| 핀 164 | I/O — User I/O pin (banked) |
| 핀 165 | I/O — User I/O pin (banked) |
| 핀 166 | I/O — User I/O pin (banked) |
| 핀 167 | I/O — User I/O pin (banked) |
| 핀 168 | I/O — User I/O pin (banked) |
| 핀 169 | I/O — User I/O pin (banked) |
| 핀 170 | VCC — 3.3 V supply |
| 핀 171 | I/O — User I/O pin (banked) |
| 핀 172 | I/O — User I/O pin (banked) |
| 핀 173 | I/O — User I/O pin (banked) |
| 핀 174 | I/O — User I/O pin (banked) |
| 핀 175 | I/O — User I/O pin (banked) |
| 핀 176 | I/O — User I/O pin (banked) |
일반적인 애플리케이션
XC3090L-8TQG176C 적합 용도: 6 애플리케이션s: Legacy Industrial Control Logic, Telecommunications Glue Logic Replacement, PCI/ISA Add-in Card Prototyping, TTL/CMOS MSI Logic Consolidation, Education and FPGA Training Boards, Aerospace and Defense Legacy Avionics.
Legacy Industrial Control Logic
The XC3090L-8TQG176C fits legacy industrial control designs because its 320 CLBs (5,000-6,000 gates) and 80 MHz Fmax comfortably handle state machines, encoder/decoder logic, and motor-control sequencing typical of 1990s-era factory equipment. The 3.3 V supply matches modernized 24 V-to-3.3 V DC-DC rails, while the TQFP-176 footprint accepts standard 0.5 mm-pitch reflow on FR-4 boards. Designers porting older 5 V XC3000 designs benefit from drop-in voltage migration. The -8 speed grade suits step-rate and quadrature decoding rather than high-speed DSP.
추천
Telecommunications Glue Logic Replacement
Telecommunications backplanes built around 1995-2005 often used XC3000L FPGAs as glue logic between discrete framers, LIUs, and switching fabrics. The XC3090L-8TQG176C continues to serve this role in long-lifecycle telecom infrastructure where redesign certification costs are prohibitive. Its TTL-compatible I/O interfaces directly to 3.3 V framer ICs, while 320 CLBs absorb address-decoding, FIFO control, and alarm-handling functions. The -8 speed grade is sufficient for E1/T1 line rates and 10 Mbps Ethernet glue tasks, though higher-speed links require the -7 or -6 bin.
추천
PCI/ISA Add-in Card Prototyping
The XC3090L-8TQG176C was a popular prototyping vehicle for PCI and ISA add-in cards in the late 1990s and remains in service for legacy industrial PCs. Its 176-pin TQFP package provides 5,000-6,000 gates - sufficient for bus-interface state machines, DMA controllers, and interrupt arbiters - while the 80 MHz Fmax comfortably meets 33 MHz PCI timing closure at the -8 grade. The 3.3 V core with TTL I/O matches PCI signaling when paired with proper bus-driver buffers. Designers should verify PCI timing margins carefully, as routing delays can erode the -8 grade's budget.
추천
TTL/CMOS MSI Logic Consolidation
Designers migrating board designs from dozens of 74-series TTL and 4000-series CMOS MSI packages to a single programmable device find the XC3090L-8TQG176C an excellent consolidation target. Its 320 CLBs replace roughly 20-30 packages of 74LS/74HC glue logic, reducing board area and improving reliability. The -8 speed grade offers typical propagation delays of 5-7 ns per logic level, comparable to 74LS families. The 3.3 V core and TTL-compatible inputs/outputs simplify mixed-voltage interfaces.
추천
Education and FPGA Training Boards
University-level digital-design courses and FPGA training kits often use the XC3090L-8TQG176C because it pairs well with the legacy Xilinx ISE WebPACK toolchain, which remains freely available for educational use. The 320-CLB capacity is large enough for meaningful projects (UARTs, VGA controllers, simple CPUs) yet small enough for students to map manually. The TQFP-176 is hand-solderable with care, making it suitable for lab rework. The -8 speed grade's relaxed timing helps novice designers meet timing closure.
추천
Aerospace and Defense Legacy Avionics
Long-lifecycle aerospace and defense programs still fly with XC3000L FPGAs on certified avionics boards because re-certification costs are enormous. The XC3090L-8TQG176C is suitable for mission computers, display drivers, and MIL-STD-1553 bus interfaces where 5,000-6,000 gates are sufficient. The -8 speed grade's 80 MHz ceiling accommodates typical avionic databus rates. Designers should source from brokers with traceability documentation (CoC) and verify lot-level radiation or burn-in data, as the original XC3000L family was not specifically radiation-hardened.
추천
추천 제품 요약
엔지니어링 참조 데이터: XC3090L-8TQG176C — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | XC3090L-7TQG176C | XC3090L-6TQG176C | XC3090L-7TQG176I | XC3090L-6TQG176I | XC3090L-8TQ176C |
|---|---|---|---|---|---|---|
| Package | TQFP-176 (TQG176) | TQFP-176 (TQG176) - same | TQFP-176 (TQG176) - same | TQFP-176 (TQG176) - same | TQFP-176 (TQG176) - same | TQFP-176 (TQ176) - same |
| Brand | Xilinx | Xilinx | Xilinx | Xilinx | Xilinx | Xilinx |
| Speed Grade | -8 (slowest) | -7 | -6 (fastest) | -7 | -6 | -8 |
| Temperature Grade | Commercial (0C to +85C) | Commercial | Commercial | Industrial (-40C to +100C) | Industrial | Commercial |
| Logic Cells (CLBs) | 320 | 320 | 320 | 320 | 320 | 320 |
| Equivalent Gates | 5,000 - 6,000 | 5,000 - 6,000 | 5,000 - 6,000 | 5,000 - 6,000 | 5,000 - 6,000 | 5,000 - 6,000 |
| Maximum Frequency | 80 MHz (-8 grade) | ~100 MHz (-7 grade, higher Fmax) | ~120 MHz (-6 grade, highest Fmax) | ~100 MHz | ~120 MHz | 80 MHz |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
주요 차별점
- Slowest, lowest-cost speed grade in the XC3090L TQG176 family (vs XC3090L-7TQG176C)
- Commercial temperature range for non-extended-environment designs (vs XC3090L-7TQG176I)
- TQFP-176 (TQG176) package accepts standard 0.5 mm-pitch reflow (vs XC3090L-8PCG84C)
- L (low-voltage 3.3 V) variant for power-sensitive designs (vs XC3090-8TQG176C (legacy 5 V))
설계 노트
The XC3090L-8TQG176C operates from a single 3.3 V rail. Decouple VCC pins with 0.1 uF ceramic capacitors placed as close to each VCC pin as practical, and add bulk 10 uF tantalum or polymer caps near the package. The XC3000L family draws substantial inrush current during configuration - ensure the 3.3 V regulator can supply at least 500 mA peak. Sharing the 3.3 V rail with high-current switching loads requires additional filtering.
The XC3000L family is NOT 5 V tolerant on inputs. Driving any I/O pin above 3.6 V or below -0.5 V risks latch-up. Use external level-shifters when interfacing to 5 V logic. Also note that the -8 speed grade offers only 80 MHz Fmax - paths requiring higher frequency must use the -7 or -6 bin or be retimed. Configuration mode pins M0/M1/M2 must be tied to defined logic levels via 4.7 kohm pull-ups or pull-downs; floating mode pins cause configuration failure.
Estimated: The XC3000L family in TQFP-176 typically dissipates 0.5-2 W depending on toggle rate and utilization. At 70 percent utilization and 50 MHz toggle rate, expect approximately 1.5 W. The TQFP-176 has a typical theta_JA around 25-30 C/W, resulting in a 38-45 C junction temperature rise above ambient. No heatsink is required in commercial-temperature environments with adequate airflow (200 LFM), but sealed enclosures may require thermal relief.
The TQFP-176 package has 0.5 mm pin pitch and requires careful PCB layout. Use 0.2 mm-wide traces with 0.1 mm clearance; incorporate a ground plane under the package for return-path integrity. Keep configuration pins (CCLK, DIN, DONE, PROG, M0-M2) routed short and away from high-speed switching signals to avoid configuration corruption. Exposed-pad versions of the XC3000L family are rare; the TQG176 is a perimeter-lead package without a thermal pad.
Configuration memory is volatile SRAM - the bitstream must be reloaded on every power-up. Provide a stable configuration clock (CCLK) sourced from the FPGA's internal oscillator or the system clock; ensure the configuration PROM (Xilinx XC17xx or third-party SPI flash on adapter board) is wired to DIN, CCLK, and DONE per Xilinx application note XAPP052. Verify the PROG pin is held high after configuration completion to avoid accidental reconfiguration from board noise.
규정 준수 정보
XC3000L family predates widespread RoHS adoption. Original parts are typically SnPb-finish. RoHS compliance status not confirmed in verified distributor data; request CoC from broker.
