XC7VX330T-2FFG1157I - Virtex-7 XT FPGA 326K Cells | AMD
부품 번호: XC7VX330T-2FFG1157I ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $1895 | $1,895.00 |
| 10 | $1750 | $17,500.00 |
| 100 | $1620 | $162,000.00 |
| 500 | $1490 | $745,000.00 |
| 1,000 | $1380 | $1,380,000.00 |
XC7VX330T-2FFG1157I 개요
A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer after manufacturing to implement any digital logic function. FPGAs belong to the programmable logic device (PLD) family, which sits between application-specific integrated circuits (ASICs) and general-purpose processors in the semiconductor hierarchy. Unlike ASICs, FPGAs can be reprogrammed in the field, enabling rapid prototyping, hardware acceleration, and flexible system updates. The Virtex-7 XT family is AMD's high-end FPGA series, optimized for high-bandwidth, high-throughput applications.
Key features of the XC7VX330T-2FFG1157I include 326,400 logic cells, 600 user I/O pins, 27,648 Kb of block RAM, and support for up to 16 high-speed transceivers (GTX) operating at up to 12.5 Gbps. The device also includes 1,920 DSP48E1 slices for high-performance digital signal processing, and supports PCIe Gen2 x8, 10/40/100Gb Ethernet, and DDR3/DDR4 memory interfaces. The -2 speed grade provides a balance between performance and power consumption.
Architecturally, the Virtex-7 XT FPGA uses a 6-input look-up table (LUT) fabric with integrated block RAM, DSP slices, and clock management tiles (CMT). The device supports partial reconfiguration, allowing dynamic updates to specific regions of the FPGA without stopping the entire system. The 28nm HPL process reduces static power consumption while maintaining high performance, making it suitable for power-sensitive applications.
Typical applications include high-performance computing (HPC) acceleration, wired and wireless communications infrastructure, aerospace and defense systems, and medical imaging equipment. The 600 user I/O pins and high-speed transceivers enable high-bandwidth data acquisition and processing. The device is also used in radar, electronic warfare, and secure communications systems where reliability and long-term supply are critical.
When designing with this FPGA, careful attention must be paid to power supply decoupling, thermal management, and signal integrity. The 1156-ball FCBGA package requires a multi-layer PCB with dedicated power and ground planes. Adequate cooling is essential, as the device can dissipate significant power under heavy utilization. Use AMD's Vivado Design Suite for configuration and implementation.
드롭인 대체품: XC7VX330T-2FFG1157I — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: XC7VX330T-2FFG1157I (동일 폼 팩터 및 풋프린트) — 차이점: Core Voltage, Operating Temperature, Package, Process Technology, Speed Grade.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
XC7VX330T-1FFG1157I
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
XC7VX330T-3FFG1157I
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
XC7VX330T-2FFG1157C
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
XC7VX330T-2FFG1157E
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
XC7VX330T-2FFG1157I
✅ 드롭인✓ 재고 있음
$1380 / 개
데이터시트 보기 →XC7VX330T-2FFG1157I 최대 정격 & 전기적 특성
| Family | Virtex-7 XT |
| Logic Cells | 326400 |
| Block RAM | 27648000 bits (27,648 Kb) |
| DSP Slices | 1920 |
| User I/O | 600 |
| 패키지 | 1156-BBGA, FCBGA (FFG1157) |
| Core Voltage | 1.0 V |
| Process Technology | 28nm HPL |
| Speed Grade | -2 |
| 동작 온도 | -40C to +100C (I grade) |
| Transceivers | 16 GTX (up to 12.5 Gbps) |
| PCIe Support | Gen2 x8 |
| Configuration | SRAM-based, supports partial reconfiguration |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant |
XC7VX330T-2FFG1157I 핀 구성
| 핀 A1 | IO_L1P_T0 — User I/O differential pair positive |
| 핀 A2 | IO_L1N_T0 — User I/O differential pair negative |
| 핀 B1 | VCCINT — Internal core voltage 1.0V |
| 핀 B2 | GND — Ground |
| 핀 C1 | IO_L2P_T0 — User I/O differential pair positive |
| 핀 C2 | IO_L2N_T0 — User I/O differential pair negative |
| 핀 D1 | VCCAUX — Auxiliary voltage 1.8V |
| 핀 D2 | GND — Ground |
| 핀 E1 | IO_L3P_T0 — User I/O differential pair positive |
| 핀 E2 | IO_L3N_T0 — User I/O differential pair negative |
| 핀 F1 | VCCIO — I/O bank voltage |
| 핀 F2 | GND — Ground |
일반적인 애플리케이션
XC7VX330T-2FFG1157I 적합 용도: 6 애플리케이션s: High-Performance Computing (HPC) Acceleration, Wired Communications Infrastructure, Aerospace and Defense Systems, Medical Imaging Equipment, High-Speed Data Acquisition, Secure Communications and Cryptography.
High-Performance Computing (HPC) Acceleration
The XC7VX330T-2FFG1157I is ideal for HPC acceleration due to its 326,400 logic cells and 1,920 DSP slices, enabling parallel processing of complex algorithms. Its 600 user I/O pins and high-speed transceivers support high-bandwidth data movement between compute nodes. The -2 speed grade provides the performance needed for real-time data processing in scientific simulations and financial modeling. The 28nm HPL process balances power and performance, making it suitable for power-constrained data centers.
추천
Wired Communications Infrastructure
This FPGA excels in wired communications, supporting 10/40/100Gb Ethernet and PCIe Gen2 x8 interfaces. The 16 GTX transceivers at up to 12.5 Gbps enable high-speed serial links for switches, routers, and base stations. The 600 I/O pins allow flexible interfacing with PHYs and network processors. The device's high logic density supports complex packet processing and traffic management. Its reliability and long-term supply make it suitable for telecom infrastructure.
추천
Aerospace and Defense Systems
The XC7VX330T-2FFG1157I is used in aerospace and defense for radar, electronic warfare, and secure communications. Its industrial temperature grade (-40C to +100C) ensures operation in harsh environments. The 326,400 logic cells support complex signal processing algorithms, while the 1,920 DSP slices handle beamforming and FFT operations. The device's security features, including bitstream encryption, protect against unauthorized copying. Long-term supply guarantees support mission-critical programs.
추천
Medical Imaging Equipment
In medical imaging, this FPGA accelerates image processing for CT, MRI, and ultrasound systems. The 1,920 DSP slices enable real-time filtering and reconstruction algorithms. The 600 I/O pins interface with high-speed ADCs and image sensors. The -2 speed grade provides the throughput needed for high-resolution imaging. The device's reliability and industrial temperature range support continuous operation in clinical environments. Its reprogrammability allows algorithm updates without hardware changes.
추천
High-Speed Data Acquisition
The XC7VX330T-2FFG1157I is ideal for high-speed data acquisition systems, with 600 user I/O pins for interfacing with multiple ADCs and DACs. The 16 GTX transceivers support high-speed serial data streaming. The 27,648 Kb of block RAM provides ample buffering for real-time data capture. The device's logic density enables complex triggering and preprocessing. Its industrial temperature grade supports deployment in test and measurement equipment.
추천
Secure Communications and Cryptography
This FPGA is used in secure communications systems for encryption and decryption. The 326,400 logic cells implement complex cryptographic algorithms like AES and RSA. The device supports bitstream encryption to protect intellectual property. The 600 I/O pins interface with secure key management modules. The -2 speed grade provides the throughput for high-speed encrypted data streams. Its reliability and long-term supply support government and defense applications.
추천
추천 제품 요약
엔지니어링 참조 데이터: XC7VX330T-2FFG1157I — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | XC7VX330T-1FFG1157I | XC7VX330T-3FFG1157I | XC7VX330T-2FFG1157C |
|---|---|---|---|---|
| Package | 1156-BBGA, FCBGA (FFG1157) | 1156-BBGA, FCBGA (FFG1157) | 1156-BBGA, FCBGA (FFG1157) | 1156-BBGA, FCBGA (FFG1157) |
| Brand | AMD | AMD | AMD | AMD |
| Logic Cells | 326400 | 326400 | 326400 | 326400 |
| Block RAM | 27648000 bits | 27648000 bits | 27648000 bits | 27648000 bits |
| DSP Slices | 1920 | 1920 | 1920 | 1920 |
| User I/O | 600 | 600 | 600 | 600 |
| Speed Grade | -2 | -1 | -3 | -2 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) |
주요 차별점
- Higher speed grade than -1 variant (vs XC7VX330T-1FFG1157I)
- Industrial temperature grade (vs XC7VX330T-2FFG1157C)
- Balanced performance and power (vs XC7VX330T-3FFG1157I)
설계 노트
The XC7VX330T-2FFG1157I requires multiple power rails: VCCINT at 1.0V, VCCAUX at 1.8V, and VCCIO for each I/O bank. Use dedicated power regulators with low output noise and fast transient response. Place decoupling capacitors (0.1uF and 0.01uF) close to each power pin. Follow AMD's power distribution network (PDN) guidelines in UG583 for optimal performance.
The XC7VX330T-2FFG1157I can dissipate significant power under heavy utilization. The 1156-ball FCBGA package requires a heatsink or active cooling for high-performance applications. Calculate the junction temperature using the package thermal resistance (theta_JA) and ensure it stays below 100C for industrial grade. Use thermal vias under the package to improve heat transfer to the PCB.
Design a multi-layer PCB with dedicated power and ground planes for the XC7VX330T-2FFG1157I. Route high-speed transceiver signals with controlled impedance (typically 100 ohm differential). Keep trace lengths matched for differential pairs. Follow AMD's PCB design guidelines in UG583 for signal integrity and power integrity. Use high-quality FR4 or low-loss materials for high-speed signals.
규정 준수 정보
RoHS compliant per AMD product page. Not AEC-Q100 qualified as it is not an automotive-grade device.
