XC7VX330T-2FFG1157I - Virtex-7 XT FPGA 326K Cells | AMD
MPN: XC7VX330T-2FFG1157I β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1895 | $1,895.00 |
| 10 | $1750 | $17,500.00 |
| 100 | $1620 | $162,000.00 |
| 500 | $1490 | $745,000.00 |
| 1,000 | $1380 | $1,380,000.00 |
Drop-in alternatives for XC7VX330T-2FFG1157I β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
XC7VX330T-1FFG1157I
β Drop-Inπ Reference alternative (not in catalog)
XC7VX330T-3FFG1157I
β Drop-Inπ Reference alternative (not in catalog)
XC7VX330T-2FFG1157C
β Drop-Inπ Reference alternative (not in catalog)
XC7VX330T-2FFG1157E
β Drop-Inπ Reference alternative (not in catalog)
XC7VX330T-2FFG1157I
β Drop-Inβ In Stock
$1380 / Unit
View Datasheet βXC7VX330T-2FFG1157I Maximum Ratings & Electrical Characteristics
| Family | Virtex-7 XT |
| Logic Cells | 326400 |
| Block RAM | 27648000 bits (27,648 Kb) |
| DSP Slices | 1920 |
| User I/O | 600 |
| Package | 1156-BBGA, FCBGA (FFG1157) |
| Core Voltage | 1.0 V |
| Process Technology | 28nm HPL |
| Speed Grade | -2 |
| Operating Temperature | -40C to +100C (I grade) |
| Transceivers | 16 GTX (up to 12.5 Gbps) |
| PCIe Support | Gen2 x8 |
| Configuration | SRAM-based, supports partial reconfiguration |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
XC7VX330T-2FFG1157I Pin Configuration
| Pin A1 | IO_L1P_T0 β User I/O differential pair positive |
| Pin A2 | IO_L1N_T0 β User I/O differential pair negative |
| Pin B1 | VCCINT β Internal core voltage 1.0V |
| Pin B2 | GND β Ground |
| Pin C1 | IO_L2P_T0 β User I/O differential pair positive |
| Pin C2 | IO_L2N_T0 β User I/O differential pair negative |
| Pin D1 | VCCAUX β Auxiliary voltage 1.8V |
| Pin D2 | GND β Ground |
| Pin E1 | IO_L3P_T0 β User I/O differential pair positive |
| Pin E2 | IO_L3N_T0 β User I/O differential pair negative |
| Pin F1 | VCCIO β I/O bank voltage |
| Pin F2 | GND β Ground |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
XC7VX330T-2FFG1157I is suitable for 6 applications: High-Performance Computing (HPC) Acceleration, Wired Communications Infrastructure, Aerospace and Defense Systems, Medical Imaging Equipment, High-Speed Data Acquisition, Secure Communications and Cryptography.
High-Performance Computing (HPC) Acceleration
The XC7VX330T-2FFG1157I is ideal for HPC acceleration due to its 326,400 logic cells and 1,920 DSP slices, enabling parallel processing of complex algorithms. Its 600 user I/O pins and high-speed transceivers support high-bandwidth data movement between compute nodes. The -2 speed grade provides the performance needed for real-time data processing in scientific simulations and financial modeling. The 28nm HPL process balances power and performance, making it suitable for power-constrained data centers.
Recommended
Wired Communications Infrastructure
This FPGA excels in wired communications, supporting 10/40/100Gb Ethernet and PCIe Gen2 x8 interfaces. The 16 GTX transceivers at up to 12.5 Gbps enable high-speed serial links for switches, routers, and base stations. The 600 I/O pins allow flexible interfacing with PHYs and network processors. The device's high logic density supports complex packet processing and traffic management. Its reliability and long-term supply make it suitable for telecom infrastructure.
Recommended
Aerospace and Defense Systems
The XC7VX330T-2FFG1157I is used in aerospace and defense for radar, electronic warfare, and secure communications. Its industrial temperature grade (-40C to +100C) ensures operation in harsh environments. The 326,400 logic cells support complex signal processing algorithms, while the 1,920 DSP slices handle beamforming and FFT operations. The device's security features, including bitstream encryption, protect against unauthorized copying. Long-term supply guarantees support mission-critical programs.
Recommended
Medical Imaging Equipment
In medical imaging, this FPGA accelerates image processing for CT, MRI, and ultrasound systems. The 1,920 DSP slices enable real-time filtering and reconstruction algorithms. The 600 I/O pins interface with high-speed ADCs and image sensors. The -2 speed grade provides the throughput needed for high-resolution imaging. The device's reliability and industrial temperature range support continuous operation in clinical environments. Its reprogrammability allows algorithm updates without hardware changes.
Recommended
High-Speed Data Acquisition
The XC7VX330T-2FFG1157I is ideal for high-speed data acquisition systems, with 600 user I/O pins for interfacing with multiple ADCs and DACs. The 16 GTX transceivers support high-speed serial data streaming. The 27,648 Kb of block RAM provides ample buffering for real-time data capture. The device's logic density enables complex triggering and preprocessing. Its industrial temperature grade supports deployment in test and measurement equipment.
Recommended
Secure Communications and Cryptography
This FPGA is used in secure communications systems for encryption and decryption. The 326,400 logic cells implement complex cryptographic algorithms like AES and RSA. The device supports bitstream encryption to protect intellectual property. The 600 I/O pins interface with secure key management modules. The -2 speed grade provides the throughput for high-speed encrypted data streams. Its reliability and long-term supply support government and defense applications.
Recommended
Recommended Products Summary
Engineering reference data for XC7VX330T-2FFG1157I β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XC7VX330T-1FFG1157I | XC7VX330T-3FFG1157I | XC7VX330T-2FFG1157C |
|---|---|---|---|---|
| Package | 1156-BBGA, FCBGA (FFG1157) | 1156-BBGA, FCBGA (FFG1157) | 1156-BBGA, FCBGA (FFG1157) | 1156-BBGA, FCBGA (FFG1157) |
| Brand | AMD | AMD | AMD | AMD |
| Logic Cells | 326400 | 326400 | 326400 | 326400 |
| Block RAM | 27648000 bits | 27648000 bits | 27648000 bits | 27648000 bits |
| DSP Slices | 1920 | 1920 | 1920 | 1920 |
| User I/O | 600 | 600 | 600 | 600 |
| Speed Grade | -2 | -1 | -3 | -2 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) |
Key Differentiators
- Higher speed grade than -1 variant (vs XC7VX330T-1FFG1157I)
- Industrial temperature grade (vs XC7VX330T-2FFG1157C)
- Balanced performance and power (vs XC7VX330T-3FFG1157I)
Design Notes
The XC7VX330T-2FFG1157I requires multiple power rails: VCCINT at 1.0V, VCCAUX at 1.8V, and VCCIO for each I/O bank. Use dedicated power regulators with low output noise and fast transient response. Place decoupling capacitors (0.1uF and 0.01uF) close to each power pin. Follow AMD's power distribution network (PDN) guidelines in UG583 for optimal performance.
The XC7VX330T-2FFG1157I can dissipate significant power under heavy utilization. The 1156-ball FCBGA package requires a heatsink or active cooling for high-performance applications. Calculate the junction temperature using the package thermal resistance (theta_JA) and ensure it stays below 100C for industrial grade. Use thermal vias under the package to improve heat transfer to the PCB.
Design a multi-layer PCB with dedicated power and ground planes for the XC7VX330T-2FFG1157I. Route high-speed transceiver signals with controlled impedance (typically 100 ohm differential). Keep trace lengths matched for differential pairs. Follow AMD's PCB design guidelines in UG583 for signal integrity and power integrity. Use high-quality FR4 or low-loss materials for high-speed signals.
Compliance Information
RoHS compliant per AMD product page. Not AEC-Q100 qualified as it is not an automotive-grade device.
