XC7VX330T-2FFG1157I - Virtex-7 XT FPGA 326K Cells | AMD
Référence : XC7VX330T-2FFG1157I ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $1895 | $1 895,00 |
| 10 | $1750 | $17 500,00 |
| 100 | $1620 | $162 000,00 |
| 500 | $1490 | $745 000,00 |
| 1 000 | $1380 | $1 380 000,00 |
XC7VX330T-2FFG1157I Présentation
A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer after manufacturing to implement any digital logic function. FPGAs belong to the programmable logic device (PLD) family, which sits between application-specific integrated circuits (ASICs) and general-purpose processors in the semiconductor hierarchy. Unlike ASICs, FPGAs can be reprogrammed in the field, enabling rapid prototyping, hardware acceleration, and flexible system updates. The Virtex-7 XT family is AMD's high-end FPGA series, optimized for high-bandwidth, high-throughput applications.
Key features of the XC7VX330T-2FFG1157I include 326,400 logic cells, 600 user I/O pins, 27,648 Kb of block RAM, and support for up to 16 high-speed transceivers (GTX) operating at up to 12.5 Gbps. The device also includes 1,920 DSP48E1 slices for high-performance digital signal processing, and supports PCIe Gen2 x8, 10/40/100Gb Ethernet, and DDR3/DDR4 memory interfaces. The -2 speed grade provides a balance between performance and power consumption.
Architecturally, the Virtex-7 XT FPGA uses a 6-input look-up table (LUT) fabric with integrated block RAM, DSP slices, and clock management tiles (CMT). The device supports partial reconfiguration, allowing dynamic updates to specific regions of the FPGA without stopping the entire system. The 28nm HPL process reduces static power consumption while maintaining high performance, making it suitable for power-sensitive applications.
Typical applications include high-performance computing (HPC) acceleration, wired and wireless communications infrastructure, aerospace and defense systems, and medical imaging equipment. The 600 user I/O pins and high-speed transceivers enable high-bandwidth data acquisition and processing. The device is also used in radar, electronic warfare, and secure communications systems where reliability and long-term supply are critical.
When designing with this FPGA, careful attention must be paid to power supply decoupling, thermal management, and signal integrity. The 1156-ball FCBGA package requires a multi-layer PCB with dedicated power and ground planes. Adequate cooling is essential, as the device can dissipate significant power under heavy utilization. Use AMD's Vivado Design Suite for configuration and implementation.
Alternatives de remplacement direct pour XC7VX330T-2FFG1157I — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec XC7VX330T-2FFG1157I (même facteur de forme et même empreinte) — différant par Core Voltage, Operating Temperature, Package, Process Technology, Speed Grade.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
XC7VX330T-1FFG1157I
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
XC7VX330T-3FFG1157I
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
XC7VX330T-2FFG1157C
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
XC7VX330T-2FFG1157E
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
XC7VX330T-2FFG1157I
✅ Remplacement direct✓ En stock
$1380 / unité
Voir la fiche technique →XC7VX330T-2FFG1157I Valeurs maximales et caractéristiques électriques
| Family | Virtex-7 XT |
| Logic Cells | 326400 |
| Block RAM | 27648000 bits (27,648 Kb) |
| DSP Slices | 1920 |
| User I/O | 600 |
| Boîtier | 1156-BBGA, FCBGA (FFG1157) |
| Core Voltage | 1.0 V |
| Process Technology | 28nm HPL |
| Speed Grade | -2 |
| Température de fonctionnement | -40C to +100C (I grade) |
| Transceivers | 16 GTX (up to 12.5 Gbps) |
| PCIe Support | Gen2 x8 |
| Configuration | SRAM-based, supports partial reconfiguration |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
Configuration des broches de XC7VX330T-2FFG1157I
| Broche A1 | IO_L1P_T0 — User I/O differential pair positive |
| Broche A2 | IO_L1N_T0 — User I/O differential pair negative |
| Broche B1 | VCCINT — Internal core voltage 1.0V |
| Broche B2 | GND — Ground |
| Broche C1 | IO_L2P_T0 — User I/O differential pair positive |
| Broche C2 | IO_L2N_T0 — User I/O differential pair negative |
| Broche D1 | VCCAUX — Auxiliary voltage 1.8V |
| Broche D2 | GND — Ground |
| Broche E1 | IO_L3P_T0 — User I/O differential pair positive |
| Broche E2 | IO_L3N_T0 — User I/O differential pair negative |
| Broche F1 | VCCIO — I/O bank voltage |
| Broche F2 | GND — Ground |
Applications typiques
XC7VX330T-2FFG1157I convient pour 6 applications: High-Performance Computing (HPC) Acceleration, Wired Communications Infrastructure, Aerospace and Defense Systems, Medical Imaging Equipment, High-Speed Data Acquisition, Secure Communications and Cryptography.
High-Performance Computing (HPC) Acceleration
The XC7VX330T-2FFG1157I is ideal for HPC acceleration due to its 326,400 logic cells and 1,920 DSP slices, enabling parallel processing of complex algorithms. Its 600 user I/O pins and high-speed transceivers support high-bandwidth data movement between compute nodes. The -2 speed grade provides the performance needed for real-time data processing in scientific simulations and financial modeling. The 28nm HPL process balances power and performance, making it suitable for power-constrained data centers.
Recommandé
Wired Communications Infrastructure
This FPGA excels in wired communications, supporting 10/40/100Gb Ethernet and PCIe Gen2 x8 interfaces. The 16 GTX transceivers at up to 12.5 Gbps enable high-speed serial links for switches, routers, and base stations. The 600 I/O pins allow flexible interfacing with PHYs and network processors. The device's high logic density supports complex packet processing and traffic management. Its reliability and long-term supply make it suitable for telecom infrastructure.
Recommandé
Aerospace and Defense Systems
The XC7VX330T-2FFG1157I is used in aerospace and defense for radar, electronic warfare, and secure communications. Its industrial temperature grade (-40C to +100C) ensures operation in harsh environments. The 326,400 logic cells support complex signal processing algorithms, while the 1,920 DSP slices handle beamforming and FFT operations. The device's security features, including bitstream encryption, protect against unauthorized copying. Long-term supply guarantees support mission-critical programs.
Recommandé
Medical Imaging Equipment
In medical imaging, this FPGA accelerates image processing for CT, MRI, and ultrasound systems. The 1,920 DSP slices enable real-time filtering and reconstruction algorithms. The 600 I/O pins interface with high-speed ADCs and image sensors. The -2 speed grade provides the throughput needed for high-resolution imaging. The device's reliability and industrial temperature range support continuous operation in clinical environments. Its reprogrammability allows algorithm updates without hardware changes.
Recommandé
High-Speed Data Acquisition
The XC7VX330T-2FFG1157I is ideal for high-speed data acquisition systems, with 600 user I/O pins for interfacing with multiple ADCs and DACs. The 16 GTX transceivers support high-speed serial data streaming. The 27,648 Kb of block RAM provides ample buffering for real-time data capture. The device's logic density enables complex triggering and preprocessing. Its industrial temperature grade supports deployment in test and measurement equipment.
Recommandé
Secure Communications and Cryptography
This FPGA is used in secure communications systems for encryption and decryption. The 326,400 logic cells implement complex cryptographic algorithms like AES and RSA. The device supports bitstream encryption to protect intellectual property. The 600 I/O pins interface with secure key management modules. The -2 speed grade provides the throughput for high-speed encrypted data streams. Its reliability and long-term supply support government and defense applications.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour XC7VX330T-2FFG1157I — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | XC7VX330T-1FFG1157I | XC7VX330T-3FFG1157I | XC7VX330T-2FFG1157C |
|---|---|---|---|---|
| Package | 1156-BBGA, FCBGA (FFG1157) | 1156-BBGA, FCBGA (FFG1157) | 1156-BBGA, FCBGA (FFG1157) | 1156-BBGA, FCBGA (FFG1157) |
| Brand | AMD | AMD | AMD | AMD |
| Logic Cells | 326400 | 326400 | 326400 | 326400 |
| Block RAM | 27648000 bits | 27648000 bits | 27648000 bits | 27648000 bits |
| DSP Slices | 1920 | 1920 | 1920 | 1920 |
| User I/O | 600 | 600 | 600 | 600 |
| Speed Grade | -2 | -1 | -3 | -2 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) |
Principaux différenciateurs
- Higher speed grade than -1 variant (vs XC7VX330T-1FFG1157I)
- Industrial temperature grade (vs XC7VX330T-2FFG1157C)
- Balanced performance and power (vs XC7VX330T-3FFG1157I)
Notes de conception
The XC7VX330T-2FFG1157I requires multiple power rails: VCCINT at 1.0V, VCCAUX at 1.8V, and VCCIO for each I/O bank. Use dedicated power regulators with low output noise and fast transient response. Place decoupling capacitors (0.1uF and 0.01uF) close to each power pin. Follow AMD's power distribution network (PDN) guidelines in UG583 for optimal performance.
The XC7VX330T-2FFG1157I can dissipate significant power under heavy utilization. The 1156-ball FCBGA package requires a heatsink or active cooling for high-performance applications. Calculate the junction temperature using the package thermal resistance (theta_JA) and ensure it stays below 100C for industrial grade. Use thermal vias under the package to improve heat transfer to the PCB.
Design a multi-layer PCB with dedicated power and ground planes for the XC7VX330T-2FFG1157I. Route high-speed transceiver signals with controlled impedance (typically 100 ohm differential). Keep trace lengths matched for differential pairs. Follow AMD's PCB design guidelines in UG583 for signal integrity and power integrity. Use high-quality FR4 or low-loss materials for high-speed signals.
Informations de conformité
RoHS compliant per AMD product page. Not AEC-Q100 qualified as it is not an automotive-grade device.
