XC7VX330T-2FFG1157I - Virtex-7 XT FPGA 326K Cells | AMD
Артикул: XC7VX330T-2FFG1157I ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $1895 | $1.895,00 |
| 10 | $1750 | $17.500,00 |
| 100 | $1620 | $162.000,00 |
| 500 | $1490 | $745.000,00 |
| 1.000 | $1380 | $1.380.000,00 |
XC7VX330T-2FFG1157I Обзор
A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer after manufacturing to implement any digital logic function. FPGAs belong to the programmable logic device (PLD) family, which sits between application-specific integrated circuits (ASICs) and general-purpose processors in the semiconductor hierarchy. Unlike ASICs, FPGAs can be reprogrammed in the field, enabling rapid prototyping, hardware acceleration, and flexible system updates. The Virtex-7 XT family is AMD's high-end FPGA series, optimized for high-bandwidth, high-throughput applications.
Key features of the XC7VX330T-2FFG1157I include 326,400 logic cells, 600 user I/O pins, 27,648 Kb of block RAM, and support for up to 16 high-speed transceivers (GTX) operating at up to 12.5 Gbps. The device also includes 1,920 DSP48E1 slices for high-performance digital signal processing, and supports PCIe Gen2 x8, 10/40/100Gb Ethernet, and DDR3/DDR4 memory interfaces. The -2 speed grade provides a balance between performance and power consumption.
Architecturally, the Virtex-7 XT FPGA uses a 6-input look-up table (LUT) fabric with integrated block RAM, DSP slices, and clock management tiles (CMT). The device supports partial reconfiguration, allowing dynamic updates to specific regions of the FPGA without stopping the entire system. The 28nm HPL process reduces static power consumption while maintaining high performance, making it suitable for power-sensitive applications.
Typical applications include high-performance computing (HPC) acceleration, wired and wireless communications infrastructure, aerospace and defense systems, and medical imaging equipment. The 600 user I/O pins and high-speed transceivers enable high-bandwidth data acquisition and processing. The device is also used in radar, electronic warfare, and secure communications systems where reliability and long-term supply are critical.
When designing with this FPGA, careful attention must be paid to power supply decoupling, thermal management, and signal integrity. The 1156-ball FCBGA package requires a multi-layer PCB with dedicated power and ground planes. Adequate cooling is essential, as the device can dissipate significant power under heavy utilization. Use AMD's Vivado Design Suite for configuration and implementation.
Аналоги без доработки для XC7VX330T-2FFG1157I — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с XC7VX330T-2FFG1157I (тот же форм-фактор и посадочное место) — отличается по Core Voltage, Operating Temperature, Package, Process Technology, Speed Grade.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
XC7VX330T-1FFG1157I
✅ Прямая замена ⚠️ Характеристики не проверены📋 Справочный аналог (нет в каталоге)
XC7VX330T-3FFG1157I
✅ Прямая замена ⚠️ Характеристики не проверены📋 Справочный аналог (нет в каталоге)
XC7VX330T-2FFG1157C
✅ Прямая замена ⚠️ Характеристики не проверены📋 Справочный аналог (нет в каталоге)
XC7VX330T-2FFG1157E
✅ Прямая замена ⚠️ Характеристики не проверены📋 Справочный аналог (нет в каталоге)
XC7VX330T-2FFG1157I
✅ Прямая замена✓ В наличии
$1380 / шт.
Открыть даташит →XC7VX330T-2FFG1157I Максимальные параметры и электрические характеристики
| Family | Virtex-7 XT |
| Logic Cells | 326400 |
| Block RAM | 27648000 bits (27,648 Kb) |
| DSP Slices | 1920 |
| User I/O | 600 |
| Корпус | 1156-BBGA, FCBGA (FFG1157) |
| Core Voltage | 1.0 V |
| Process Technology | 28nm HPL |
| Speed Grade | -2 |
| Рабочая температура | -40C to +100C (I grade) |
| Transceivers | 16 GTX (up to 12.5 Gbps) |
| PCIe Support | Gen2 x8 |
| Configuration | SRAM-based, supports partial reconfiguration |
| Тип монтажа | Surface Mount |
| Статус RoHS | Compliant |
Конфигурация выводов XC7VX330T-2FFG1157I
| Контакт A1 | IO_L1P_T0 — User I/O differential pair positive |
| Контакт A2 | IO_L1N_T0 — User I/O differential pair negative |
| Контакт B1 | VCCINT — Internal core voltage 1.0V |
| Контакт B2 | GND — Ground |
| Контакт C1 | IO_L2P_T0 — User I/O differential pair positive |
| Контакт C2 | IO_L2N_T0 — User I/O differential pair negative |
| Контакт D1 | VCCAUX — Auxiliary voltage 1.8V |
| Контакт D2 | GND — Ground |
| Контакт E1 | IO_L3P_T0 — User I/O differential pair positive |
| Контакт E2 | IO_L3N_T0 — User I/O differential pair negative |
| Контакт F1 | VCCIO — I/O bank voltage |
| Контакт F2 | GND — Ground |
Типичное применение
XC7VX330T-2FFG1157I подходит для 6 применениеs: High-Performance Computing (HPC) Acceleration, Wired Communications Infrastructure, Aerospace and Defense Systems, Medical Imaging Equipment, High-Speed Data Acquisition, Secure Communications and Cryptography.
High-Performance Computing (HPC) Acceleration
The XC7VX330T-2FFG1157I is ideal for HPC acceleration due to its 326,400 logic cells and 1,920 DSP slices, enabling parallel processing of complex algorithms. Its 600 user I/O pins and high-speed transceivers support high-bandwidth data movement between compute nodes. The -2 speed grade provides the performance needed for real-time data processing in scientific simulations and financial modeling. The 28nm HPL process balances power and performance, making it suitable for power-constrained data centers.
Рекомендуется
Wired Communications Infrastructure
This FPGA excels in wired communications, supporting 10/40/100Gb Ethernet and PCIe Gen2 x8 interfaces. The 16 GTX transceivers at up to 12.5 Gbps enable high-speed serial links for switches, routers, and base stations. The 600 I/O pins allow flexible interfacing with PHYs and network processors. The device's high logic density supports complex packet processing and traffic management. Its reliability and long-term supply make it suitable for telecom infrastructure.
Рекомендуется
Aerospace and Defense Systems
The XC7VX330T-2FFG1157I is used in aerospace and defense for radar, electronic warfare, and secure communications. Its industrial temperature grade (-40C to +100C) ensures operation in harsh environments. The 326,400 logic cells support complex signal processing algorithms, while the 1,920 DSP slices handle beamforming and FFT operations. The device's security features, including bitstream encryption, protect against unauthorized copying. Long-term supply guarantees support mission-critical programs.
Рекомендуется
Medical Imaging Equipment
In medical imaging, this FPGA accelerates image processing for CT, MRI, and ultrasound systems. The 1,920 DSP slices enable real-time filtering and reconstruction algorithms. The 600 I/O pins interface with high-speed ADCs and image sensors. The -2 speed grade provides the throughput needed for high-resolution imaging. The device's reliability and industrial temperature range support continuous operation in clinical environments. Its reprogrammability allows algorithm updates without hardware changes.
Рекомендуется
High-Speed Data Acquisition
The XC7VX330T-2FFG1157I is ideal for high-speed data acquisition systems, with 600 user I/O pins for interfacing with multiple ADCs and DACs. The 16 GTX transceivers support high-speed serial data streaming. The 27,648 Kb of block RAM provides ample buffering for real-time data capture. The device's logic density enables complex triggering and preprocessing. Its industrial temperature grade supports deployment in test and measurement equipment.
Рекомендуется
Secure Communications and Cryptography
This FPGA is used in secure communications systems for encryption and decryption. The 326,400 logic cells implement complex cryptographic algorithms like AES and RSA. The device supports bitstream encryption to protect intellectual property. The 600 I/O pins interface with secure key management modules. The -2 speed grade provides the throughput for high-speed encrypted data streams. Its reliability and long-term supply support government and defense applications.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для XC7VX330T-2FFG1157I — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | XC7VX330T-1FFG1157I | XC7VX330T-3FFG1157I | XC7VX330T-2FFG1157C |
|---|---|---|---|---|
| Package | 1156-BBGA, FCBGA (FFG1157) | 1156-BBGA, FCBGA (FFG1157) | 1156-BBGA, FCBGA (FFG1157) | 1156-BBGA, FCBGA (FFG1157) |
| Brand | AMD | AMD | AMD | AMD |
| Logic Cells | 326400 | 326400 | 326400 | 326400 |
| Block RAM | 27648000 bits | 27648000 bits | 27648000 bits | 27648000 bits |
| DSP Slices | 1920 | 1920 | 1920 | 1920 |
| User I/O | 600 | 600 | 600 | 600 |
| Speed Grade | -2 | -1 | -3 | -2 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) |
Ключевые отличия
- Higher speed grade than -1 variant (против XC7VX330T-1FFG1157I)
- Industrial temperature grade (против XC7VX330T-2FFG1157C)
- Balanced performance and power (против XC7VX330T-3FFG1157I)
Заметки по проектированию
The XC7VX330T-2FFG1157I requires multiple power rails: VCCINT at 1.0V, VCCAUX at 1.8V, and VCCIO for each I/O bank. Use dedicated power regulators with low output noise and fast transient response. Place decoupling capacitors (0.1uF and 0.01uF) close to each power pin. Follow AMD's power distribution network (PDN) guidelines in UG583 for optimal performance.
The XC7VX330T-2FFG1157I can dissipate significant power under heavy utilization. The 1156-ball FCBGA package requires a heatsink or active cooling for high-performance applications. Calculate the junction temperature using the package thermal resistance (theta_JA) and ensure it stays below 100C for industrial grade. Use thermal vias under the package to improve heat transfer to the PCB.
Design a multi-layer PCB with dedicated power and ground planes for the XC7VX330T-2FFG1157I. Route high-speed transceiver signals with controlled impedance (typically 100 ohm differential). Keep trace lengths matched for differential pairs. Follow AMD's PCB design guidelines in UG583 for signal integrity and power integrity. Use high-quality FR4 or low-loss materials for high-speed signals.
Информация о соответствии
RoHS compliant per AMD product page. Not AEC-Q100 qualified as it is not an automotive-grade device.
