XC7K325T-1FB676C - Kintex-7 FPGA, 326080 Cells | AMD
부품 번호: XC7K325T-1FB676C ✓ 활성XC7K325T-1FB676C 개요
A field-programmable gate array, or FPGA, is a programmable semiconductor whose digital logic blocks, I/O, memory, and dedicated processing resources are configured after manufacture. The FPGA hierarchy places this device in the Kintex-7 family, within the broader categories of programmable logic devices, semiconductors, and digital integrated circuits. Unlike fixed-function logic, an FPGA allows interface, protocol, and parallel-algorithm changes to be implemented through bitstream updates rather than PCB redesign.
The XC7K325T part combines 326080 logic cells with 400 I/O in one 676-BBGA FCBGA package. The -1 ordering code identifies a performance grade within the Kintex-7 speed-grade range. Programmable logic resources support parallel datapaths, while dedicated resources commonly address high-speed transceiver, DSP, and block RAM requirements in communications, industrial control, scientific instrumentation, and defense-oriented electronics.
Kintex-7 devices combine configurable logic with high-speed serial transceivers and programmable logic resources for demanding interface designs. The -1 grade targets general-purpose performance-oriented designs rather than the highest -3 speed grade. Because the exact timing, resource counts by type, voltage rails, and transceiver configuration depend on the specific Kintex-7 data sheet and device variant, use the manufacturer tables for final implementation decisions.
Typical deployments include 10G and 40G Ethernet interfaces, high-speed data acquisition, radar and electronic-warfare signal paths, industrial protocol bridges, video-processing pipelines, and test equipment. The large device and fine-pitch BGA package also make power delivery, decoupling, thermal management, and signal integrity central to successful implementation.
For a new board, reproduce the manufacturer reference power and decoupling layout, keep high-speed nets short and continuously referenced, and validate every power rail under maximum transceiver activity. For an existing design, compare the complete ball map, voltage rails, configuration pins, and transceiver assignments before treating another 676-ball device as a replacement.
This page consolidates package, resource, sourcing, and engineering information for the XC7K325T-1FB676C, including drop-in candidate comparisons and design guidance that help shorten component-selection and hardware-integration work.
드롭인 대체품: XC7K325T-1FB676C — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: XC7K325T-1FB676C (동일 폼 팩터 및 풋프린트) — 차이점: Package, Core Voltage, Device Type, Operating Temperature.
XC7K325T-1FBG676C
✅ 드롭인가격 문의
데이터시트 보기 →XC7K325T-1FBG676I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC7K325T-1FFG676C
✅ 드롭인가격 문의
데이터시트 보기 →XC7K325T-1FB676I
✅ 드롭인가격 문의
데이터시트 보기 →XC7K325T-1FB676E
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC7K325T-1FF676C
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC7K325T-1FB676C 최대 정격 & 전기적 특성
| Device Type | Kintex-7 Field Programmable Gate Array |
| Logic Cells | 326080 |
| User I/O | 400 |
| Speed Grade | -1 |
| 패키지 | 676-BBGA FCBGA |
| Package Pin Count | 676 balls |
| Package Type | FCBGA |
| Programmable Logic | Kintex-7 FPGA |
| Device Family | Kintex-7 |
| 실장 유형 | Surface Mount |
| Terminal Type | Ball |
| Package Shape | Square |
XC7K325T-1FB676C square 핀 구성 가이드
XC7K325T-1FB676C(square 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: XC7K325T-1FB676C.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
XC7K325T-1FB676C 적합 용도: 6 애플리케이션s: High-Speed Data Acquisition, Ethernet and Network Packet Processing, DSP and Digital Signal Processing, Industrial Control and Automation, Radar and Electronic-Warfare Signal Paths, Test and Measurement Instrumentation.
High-Speed Data Acquisition
The XC7K325T-1FB676C is suitable for parallel and multi-channel acquisition systems because it provides 326080 logic cells and 400 user I/O in a 676-ball FCBGA package. Engineers can use the programmable logic for channel alignment, digital filtering, triggering, packetization, and real-time data reduction. The 400 I/O allow multiple parallel buses or control interfaces to coexist, although actual channel count depends on the selected I/O standards. Implementation should use the manufacturer pinout files for exact ball assignments and controlled-impedance routing for high-rate interfaces.
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Ethernet and Network Packet Processing
The XC7K325T-1FB676C fits Ethernet aggregation, protocol conversion, and line-rate packet-processing designs where parallel logic must operate alongside programmable serial interfaces. Its 326080 logic cells provide substantial capacity for queues, headers, lookup logic, and traffic management, while 400 I/O support ancillary interfaces. The Kintex-7 family is known for programmable high-speed connectivity, making the device appropriate for network-interface, test, and protocol-conversion equipment. Confirm the required transceiver configuration, reference clocks, and lane ratings in the manufacturer tables.
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DSP and Digital Signal Processing
The XC7K325T-1FB676C can implement parallel filtering, correlation, waveform generation, and spectral-processing pipelines by combining programmable logic with dedicated FPGA processing resources. The 326080-cell footprint allows multiple channels to be processed concurrently without relying on a separate processor for every data path. Use pipelined multipliers, block RAM, and real-time constraints in the implementation to obtain predictable throughput. Exact DSP-slice and RAM availability must be read from the device tables, while the -1 grade provides the timing target for this design.
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Industrial Control and Automation
The XC7K325T-1FB676C is appropriate for industrial controllers that combine deterministic logic, multiple I/O standards, communications, and supervisory control in one device. The 326080 logic cells allow motion control, sequencing, safety logic, and protocol stacks to share a single programmable platform, while 400 I/O reduce the need for external glue logic. The -1 speed grade supports general-purpose control timing. Industrial deployments should confirm temperature qualification, isolation strategy, protection networks, and EMC requirements before the design is released.
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Radar and Electronic-Warfare Signal Paths
The XC7K325T-1FB676C offers the logic capacity required for parallel radar, electronic-warfare, and high-rate signal-chain functions such as pulse processing, correlation, filtering, and test-and-measurement logic. Its 326080 logic cells allow several data paths to operate concurrently, and the -1 grade addresses performance-oriented designs. The 676-ball package also provides substantial I/O and power-delivery capacity for complex boards. Design validation should include timing closure, transceiver usage, power analysis, thermal testing, and controlled-impedance layout review.
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Test and Measurement Instrumentation
The XC7K325T-1FB676C supports high-performance measurement instruments that require wide parallel buses, programmable logic, and high-speed serial connectivity in one device. Logic resources can implement acquisition sequencing, real-time statistics, calibration tables, and instrument control, while 400 I/O provide flexible connections to converters, memory, and front-end modules. The large device allows prototype architectures to be consolidated before hardware completion. Engineers should use the exact AMD pinout files and confirm clocking, power rails, and transceiver population before releasing the PCB layout.
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추천 제품 요약
엔지니어링 참조 데이터: XC7K325T-1FB676C — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | XC7K325T-1FBG676C | XC7K325T-1FBG676I | XC7K325T-1FFG676C | XC7K325T-1FB676I | XC7K325T-1FB676E | XC7K325T-1FF676C |
|---|---|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD | AMD | AMD |
| Package | 676-BBGA FCBGA | 676-BBGA FCBGA | 676-BBGA FCBGA | 676-BBGA FCBGA | 676-BBGA FCBGA | 676-BBGA FCBGA | 676-BBGA FCBGA |
| Device Family | Kintex-7 | Kintex-7 | Kintex-7 | Kintex-7 | Kintex-7 | Kintex-7 | Kintex-7 |
| Logic Cells | 326080 | 326080 | 326080 | 326080 | 326080 | 326080 | 326080 |
| User I/O | 400 | 400 | 400 | 400 | 400 | 400 | 400 |
| Speed Grade | -1 | -1 | -1 | -1 | -1 | -1 | -1 |
| Temperature-Grade Suffix | C | C | I | C | I | E | C |
| Package Designation | FB676 | FBG676 | FBG676 | FFG676 | FB676 | FB676 | FF676 |
| Programmable Resources | FPGA | FPGA | FPGA | FPGA | FPGA | FPGA | FPGA |
주요 차별점
- Matches the target commercial suffix while offering an alternative 676-ball package designation (vs XC7K325T-1FBG676C)
- Provides the same listed core resource profile with an industrial temperature-grade designation (vs XC7K325T-1FBG676I)
- Maintains the same Kintex-7 325T resource count and terminal count (vs XC7K325T-1FFG676C)
- Directly retains the target package designation with only the temperature-grade suffix changed (vs XC7K325T-1FB676I)
설계 노트
Implement the Kintex-7 power architecture as a complete multi-rail system rather than treating the FPGA as a single-supply component. Follow the manufacturer reference layout for core, auxiliary, I/O, and transceiver rails, including plane separation, local decoupling, via distribution, and filtering. Estimated: total dissipation must be taken from Vivado power estimation under the highest expected transceiver and logic activity, then checked against each rail's permissible current before the PCB is released.
The 676-ball FCBGA concentrates heat at the device junction and requires deliberate heat flow through the package substrate, PCB vias, and board structure. Use the package-specific thermal model to select copper area, via density, airflow, and any heat spreader. Estimated: junction rise equals power dissipation multiplied by the effective board-and-ambient thermal resistance, so validate the worst-case corner against the device temperature limit rather than relying on ambient temperature alone.
Assign every high-speed ball from the AMD package-specific pinout file and preserve continuous reference planes beneath clocks and serial links. Match controlled-impedance routes, avoid stubs and unnecessary vias, and provide low-inductance return paths through the BGA escape region. When comparing FB, FBG, and FFG package variants, check the complete ball map because identical ball counts and package dimensions do not by themselves establish electrical or physical interchangeability.
Do not substitute a 676-ball Kintex-7 suffix solely because the logic-cell count and I/O count match. Speed grade, temperature suffix, package code, power rails, configuration pins, dedicated resources, and transceiver options can differ between order codes. Compare the AMD part tables and package files, then run equivalence checks in Vivado to identify changed ports or attributes before releasing a replacement order.
규정 준수 정보
The indexed comparison record identifies a RoHS comparison field but does not state the target's compliance result. Automotive qualification is not applicable to this commercial-grade FPGA ordering code.