XCZU42DR-1FSVE1156E - Zynq UltraScale+ RFSoC Gen 1 | AMD
MPN: XCZU42DR-1FSVE1156E β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
Drop-in alternatives for XCZU42DR-1FSVE1156E β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
XCZU42DR-2FSVE1156E
β Drop-Inπ Reference alternative (not in catalog)
XCZU42DR-1FSVE1156I
β Drop-Inπ Reference alternative (not in catalog)
XCZU42DR-2FSVE1156I
β Drop-Inβ In Stock
$3950 / Unit
View Datasheet βXCZU43DR-1FSVE1156E
β Drop-Inπ Reference alternative (not in catalog)
XCZU42DR-1FFVE1156E
β‘ Same Packageπ Reference alternative (not in catalog)
XCZU42DR-1FSVE1156E Maximum Ratings & Electrical Characteristics
| Core Processor | Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARM Cortex-R5 with CoreSight |
| Primary Attributes | Zynq UltraScale+ RFSoC, FPGA, 489K+ Logic Cells |
| Number of Logic Cells | 489K+ |
| Speed Grade | -1 |
| Maximum Clock Frequency (PL) | 500 MHz |
| Maximum Clock Frequency (PS) | 1.2 GHz |
| Package / Case | 1156-FCBGA (35x35 mm) |
| Mounting Type | Surface Mount |
| Operating Temperature | 0C to +100C (Tj) |
| Supply Voltage | 0.85V core (typical) |
| Number of I/O | [DATA_NEEDED: Number of I/O] |
| Number of Transceivers | [DATA_NEEDED: Number of Transceivers] |
| RAM Size | [DATA_NEEDED: RAM Size] |
| RoHS Status | Compliant |
| Moisture Sensitivity Level (MSL) | [DATA_NEEDED: Moisture Sensitivity Level (MSL)] |
XCZU42DR-1FSVE1156E 1156-fcbga (35x35 mm) Pin Configuration Guide
Complete pinout information for XCZU42DR-1FSVE1156E (1156-fcbga (35x35 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for XCZU42DR-1FSVE1156E.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
XCZU42DR-1FSVE1156E is suitable for 6 applications: 5G NR Remote Radio Unit (RRU), Phased-Array Radar, Software-Defined Radio (SDR), Test and Measurement Equipment, Military and Aerospace Communications, Wireless Infrastructure.
5G NR Remote Radio Unit (RRU)
The XCZU42DR-1FSVE1156E is ideal for 5G NR RRUs due to its integrated RF data converters and high-speed processing. The quad-core Cortex-A53 handles the protocol stack, while the FPGA fabric implements beamforming and signal processing. The 489K+ logic cells provide ample resources for complex algorithms, and the 1.2 GHz processor ensures low-latency control. This integration reduces board space and power compared to discrete solutions.
Recommended
Phased-Array Radar
In phased-array radar systems, the XCZU42DR-1FSVE1156E provides the necessary processing power for beamforming and target detection. The RFSoC's integrated converters enable direct sampling of multiple channels, reducing analog front-end complexity. The programmable logic can implement parallel FFTs and matched filters, while the ARM cores handle system control and data formatting. The 500 MHz PL clock supports high-throughput processing.
Recommended
Software-Defined Radio (SDR)
The XCZU42DR-1FSVE1156E is well-suited for SDR platforms, offering flexibility through its programmable logic and processing system. The integrated RF converters allow for a wide range of frequencies to be sampled directly, simplifying the RF front-end. The ARM processors can run Linux for waveform control, while the FPGA fabric implements modulation and demodulation. This device enables a compact, reconfigurable radio.
Recommended
Test and Measurement Equipment
For test and measurement, the XCZU42DR-1FSVE1156E provides high-speed data acquisition and processing capabilities. The integrated ADCs and DACs can capture and generate wideband signals, while the FPGA fabric performs real-time analysis. The ARM cores handle user interfaces and data streaming. The 489K+ logic cells allow for complex triggering and measurement algorithms, making it a versatile platform for benchtop instruments.
Recommended
Military and Aerospace Communications
The XCZU42DR-1FSVE1156E is suitable for military and aerospace communications due to its high performance and reliability. The device's integrated RF converters support secure, wideband waveforms, while the programmable logic enables custom encryption and modulation. The quad-core A53 processor can handle network protocols, and the 1.2 GHz clock ensures real-time responsiveness. The 1156-FCBGA package is robust for harsh environments.
Recommended
Wireless Infrastructure
In wireless infrastructure, the XCZU42DR-1FSVE1156E can be used in baseband units and fronthaul processing. The device's processing system and programmable logic can handle multiple protocol layers, from PHY to MAC. The integrated converters support various radio configurations, and the high logic density allows for multi-standard support. This reduces the need for multiple discrete components, lowering system cost and power.
Recommended
Engineering reference data for XCZU42DR-1FSVE1156E β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XCZU42DR-2FSVE1156E | XCZU42DR-1FSVE1156I | XCZU42DR-2FSVE1156I | XCZU43DR-1FSVE1156E | XCZU42DR-1FFVE1156E |
|---|---|---|---|---|---|---|
| Package | 1156-FCBGA (35x35 mm) | 1156-FCBGA (35x35 mm) - same | 1156-FCBGA (35x35 mm) - same | 1156-FCBGA (35x35 mm) - same | 1156-FCBGA (35x35 mm) - same | 1156-FBGA (35x35 mm) - different |
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Speed Grade | -1 | -2 | -1 | -2 | -1 | -1 |
| Temperature Grade | Extended (E) | Extended (E) | Industrial (I) | Industrial (I) | Extended (E) | Extended (E) |
| Logic Cells | 489K+ | 489K+ | 489K+ | 489K+ | Higher (e.g., 930K+) | 489K+ |
| Core Processor | Quad A53, Dual R5 | Quad A53, Dual R5 | Quad A53, Dual R5 | Quad A53, Dual R5 | Quad A53, Dual R5 | Quad A53, Dual R5 |
| Max PL Clock | 500 MHz | Higher (e.g., 600 MHz) | 500 MHz | Higher (e.g., 600 MHz) | 500 MHz | 500 MHz |
| Max PS Clock | 1.2 GHz | 1.2 GHz | 1.2 GHz | 1.2 GHz | 1.2 GHz | 1.2 GHz |
Key Differentiators
- Integrated RF data converters (vs XCZU42DR-2FSVE1156E)
- Lower speed grade for cost optimization (vs XCZU42DR-2FSVE1156E)
- Extended temperature grade (vs XCZU42DR-1FSVE1156I)
Design Notes
The XCZU42DR-1FSVE1156E requires multiple power rails with specific voltage levels and sequencing. Refer to the Zynq UltraScale+ power management documentation for the recommended power-up sequence. Use a dedicated power management IC (PMIC) to ensure proper sequencing and reduce design complexity. Adequate decoupling capacitors are essential for stable operation.
The 1156-FCBGA package can dissipate significant power, especially with high logic utilization and RF converters active. Use a heatsink and ensure adequate airflow in the system enclosure. The thermal resistance (theta_JA) depends on the PCB design and airflow. Perform thermal simulation to verify junction temperature stays within the specified range.
For high-speed signals, including the RF converters and transceivers, use controlled impedance traces and minimize via stubs. Follow the layout guidelines in the Zynq UltraScale+ PCB Design Guide (UG583). Keep the power distribution network low-impedance with multiple vias to the ground plane. Place decoupling capacitors close to the device pins.
Compliance Information
RoHS compliance is indicated by distributor listings. Other compliance details are not specified in the verified data.
