10AS032E4F27I3SG vs 10AS048E1F29I1HG Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10AS032E4F27I3SG disebabkan oleh Intel dan 10AS048E1F29I1HG disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10AS032E4F27I3SG | 10AS048E1F29I1HG |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Manufacturer | Intel (formerly Altera) | — |
| Series | Arria 10 SX | — |
| Device Family | Arria 10 SX SoC FPGA | — |
| Logic Elements | 320,000 | 480,000 |
| Hard Processor System | Dual-core ARM Cortex-A9 MPCore with CoreSight | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Clock Frequency | Up to 1.5 GHz | Up to 1.5 GHz |
| Process Technology | 20 nm | — |
| Core Voltage (typ.) | 0.9 V | — |
| Kemasan | 672-pin FCBGA (Flip-Chip BGA), 27 x 27 mm | 780-ball FCBGA, 29x29 mm |
| Terminal Form | Ball | Ball |
| Number of Terminals | 672 | 780 |
| Operating Temperature Grade | Industrial (-40C to +100C junction) | — |
| Jenis Pemasangan | Surface Mount | Surface Mount (Flip-Chip BGA) |
| Compliance / Lead-Free | RoHS compliant, lead-free | — |
| Status Lingkungan Hidup | Active | — |
| FPGA Architecture | SRAM-based, volatile configuration | — |
| Family | — | Arria 10 SX SoC FPGA |
| Process Node | — | 20 nm |
| Suhu Operasi | — | -40C to +100C (Industrial) |
| Package Code | — | BGA |
| Package Shape | — | Square |
| DSP Blocks | — | [DATA_NEEDED: DSP block count] |
| Transceivers | — | [DATA_NEEDED: transceiver count and data rate] |
| Embedded Memory | — | [DATA_NEEDED: embedded RAM bits] |
| Aras MSL | — | [DATA_NEEDED: MSL rating] |
| Status RoHS | — | Compliant |