10AS032E4F27I3SG vs 10AS048E1F29I1HG Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10AS032E4F27I3SG sa pamamagitan ng Intel at 10AS048E1F29I1HG sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
10AS032E4F27I3SG - Arria 10 SX SoC FPGA, 320K LE, 672-FBGA | Intel
10AS032E4F27I3SG ✓ NakahandaPagsanggunian na paghahambing
| Parametro | 10AS032E4F27I3SG | 10AS048E1F29I1HG |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Manufacturer | Intel (formerly Altera) | — |
| Series | Arria 10 SX | — |
| Device Family | Arria 10 SX SoC FPGA | — |
| Logic Elements | 320,000 | 480,000 |
| Hard Processor System | Dual-core ARM Cortex-A9 MPCore with CoreSight | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Clock Frequency | Up to 1.5 GHz | Up to 1.5 GHz |
| Process Technology | 20 nm | — |
| Core Voltage (typ.) | 0.9 V | — |
| Packhaging | 672-pin FCBGA (Flip-Chip BGA), 27 x 27 mm | 780-ball FCBGA, 29x29 mm |
| Terminal Form | Ball | Ball |
| Number of Terminals | 672 | 780 |
| Operating Temperature Grade | Industrial (-40C to +100C junction) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (Flip-Chip BGA) |
| Compliance / Lead-Free | RoHS compliant, lead-free | — |
| Katayuan ng Lifecycle | Active | — |
| FPGA Architecture | SRAM-based, volatile configuration | — |
| Family | — | Arria 10 SX SoC FPGA |
| Process Node | — | 20 nm |
| Temperature na Operasyon | — | -40C to +100C (Industrial) |
| Package Code | — | BGA |
| Package Shape | — | Square |
| DSP Blocks | — | [DATA_NEEDED: DSP block count] |
| Transceivers | — | [DATA_NEEDED: transceiver count and data rate] |
| Embedded Memory | — | [DATA_NEEDED: embedded RAM bits] |
| Level ng MSL | — | [DATA_NEEDED: MSL rating] |
| Tindminan RoHS | — | Compliant |