10AS032H2F34E2LG vs 10AS032H3F34E2LG Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10AS032H2F34E2LG disebabkan oleh Intel dan 10AS032H3F34E2LG disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10AS032H2F34E2LG | 10AS032H3F34E2LG |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Arria 10 SX | Arria 10 SX SoC FPGA |
| Device Tier | 10AS032 (mid-density) | — |
| Configuration | SoC FPGA (HPS + FPGA fabric) | — |
| Logic Elements | 320,000 | 320,000 |
| Processor Subsystem | Dual ARM Cortex-A9 MPCore with CoreSight | — |
| Maximum Operating Frequency | 1.5 GHz | — |
| Kemasan | 1152-ball FC-FBGA (F34), 35 x 35 mm | — |
| Speed Grade | 2 | H3 |
| Temperature Grade | E2 (commercial/extended) | E2 (Industrial) |
| On-chip Memory (M20K blocks) | Approx. 21 Mb [DATA_NEEDED: exact Mb from datasheet] | — |
| DSP Blocks | Variable-precision, IEEE 754 single-precision FP support | [DATA_NEEDED: DSP block count] |
| Transceivers | Up to 14.1 Gbps [DATA_NEEDED: exact count for F34 package] | [DATA_NEEDED: transceiver count and rate] |
| Memory Controller Hard IP | DDR4, DDR3, QDRII+, RLDRAM3 | — |
| Process Node | 20 nm | 20 nm |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount (Flip-Chip BGA) |
| Status RoHS | Compliant | Compliant (lead-free) |
| Form of Terminal | Ball (BGA) | — |
| Terminal Pitch | 1 mm | — |
| Hard Processor System | — | Dual ARM Cortex-A9 MPCore with CoreSight |
| Processor Clock | — | Up to 1.5 GHz |
| Package Code | — | F34 (FCBGA) |
| Pin/Ball Count | — | 1152 |
| Package Size | — | 35 x 35 mm |
| Memory Interface | — | DDR3 / DDR4 with hard controllers |
| Status Lingkungan Hidup | — | Active |