10AS032H2F34E2LG vs 10AS032H3F34E2LG Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10AS032H2F34E2LG sa pamamagitan ng Intel at 10AS032H3F34E2LG sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | 10AS032H2F34E2LG | 10AS032H3F34E2LG |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Arria 10 SX | Arria 10 SX SoC FPGA |
| Device Tier | 10AS032 (mid-density) | — |
| Configuration | SoC FPGA (HPS + FPGA fabric) | — |
| Logic Elements | 320,000 | 320,000 |
| Processor Subsystem | Dual ARM Cortex-A9 MPCore with CoreSight | — |
| Maximum Operating Frequency | 1.5 GHz | — |
| Packhaging | 1152-ball FC-FBGA (F34), 35 x 35 mm | — |
| Speed Grade | 2 | H3 |
| Temperature Grade | E2 (commercial/extended) | E2 (Industrial) |
| On-chip Memory (M20K blocks) | Approx. 21 Mb [DATA_NEEDED: exact Mb from datasheet] | — |
| DSP Blocks | Variable-precision, IEEE 754 single-precision FP support | [DATA_NEEDED: DSP block count] |
| Transceivers | Up to 14.1 Gbps [DATA_NEEDED: exact count for F34 package] | [DATA_NEEDED: transceiver count and rate] |
| Memory Controller Hard IP | DDR4, DDR3, QDRII+, RLDRAM3 | — |
| Process Node | 20 nm | 20 nm |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (Flip-Chip BGA) |
| Tindminan RoHS | Compliant | Compliant (lead-free) |
| Form of Terminal | Ball (BGA) | — |
| Terminal Pitch | 1 mm | — |
| Hard Processor System | — | Dual ARM Cortex-A9 MPCore with CoreSight |
| Processor Clock | — | Up to 1.5 GHz |
| Package Code | — | F34 (FCBGA) |
| Pin/Ball Count | — | 1152 |
| Package Size | — | 35 x 35 mm |
| Memory Interface | — | DDR3 / DDR4 with hard controllers |
| Katayuan ng Lifecycle | — | Active |