10AX090N2F45E2LG vs 10AX090N3F45E2LG Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10AX090N2F45E2LG disebabkan oleh Intel dan 10AX090N3F45E2LG disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10AX090N2F45E2LG | 10AX090N3F45E2LG |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements | 900,000 | 900,000 |
| Embedded Memory (bits) | 59,234,304 | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| User I/O Pins | 768 | — |
| Core Voltage | 0.9 V | — |
| Transceivers | [DATA_NEEDED: transceiver count and data rate] | Multi-protocol, up to 12.5 Gbps (24 Gbps backplane on selected channels) |
| DSP Blocks | [DATA_NEEDED: DSP block count] | 768 (variable-precision, with hardened FP) |
| PLLs | [DATA_NEEDED: PLL count] | — |
| Process Technology | 20 nm | 20 nm TSMC |
| Kemasan | 1932-ball FCBGA (FBGA) | 1932-ball FCBGA, F45 (29 mm x 29 mm) |
| Package Type | Flip-Chip BGA, surface mount | — |
| Operating Temperature Grade | Enhanced (E2) | — |
| Lead-Free / RoHS | Yes (per part suffix LG) | — |
| Configuration Memory | SRAM-based, volatile (external flash required) | SRAM-based (requires external flash) |
| Jenis Pemasangan | Surface Mount | — |
| Aras MSL | [DATA_NEEDED: MSL rating] | — |
| Status Lingkungan Hidup | Active | — |
| Embedded Memory Bits | — | 59,234,304 (about 59.2 Mbit) |
| Core Voltage (VCC) | — | 0.9 V |
| Hard PCIe IP | — | PCIe Gen3 x8 controller (hard IP) |
| External Memory Interface | — | DDR4 up to 1600 MHz |
| Temperature Grade | — | Extended (E2) |
| Speed Grade | — | 3 (mid) |
| Status RoHS | — | Compliant |
| Toolchain | — | Intel Quartus Prime Pro Edition |