10AX090N2F45E2LG vs 10AX090N3F45E2LG Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10AX090N2F45E2LG sa pamamagitan ng Intel at 10AX090N3F45E2LG sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | 10AX090N2F45E2LG | 10AX090N3F45E2LG |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements | 900,000 | 900,000 |
| Embedded Memory (bits) | 59,234,304 | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| User I/O Pins | 768 | — |
| Core Voltage | 0.9 V | — |
| Transceivers | [DATA_NEEDED: transceiver count and data rate] | Multi-protocol, up to 12.5 Gbps (24 Gbps backplane on selected channels) |
| DSP Blocks | [DATA_NEEDED: DSP block count] | 768 (variable-precision, with hardened FP) |
| PLLs | [DATA_NEEDED: PLL count] | — |
| Process Technology | 20 nm | 20 nm TSMC |
| Packhaging | 1932-ball FCBGA (FBGA) | 1932-ball FCBGA, F45 (29 mm x 29 mm) |
| Package Type | Flip-Chip BGA, surface mount | — |
| Operating Temperature Grade | Enhanced (E2) | — |
| Lead-Free / RoHS | Yes (per part suffix LG) | — |
| Configuration Memory | SRAM-based, volatile (external flash required) | SRAM-based (requires external flash) |
| Uri ng Pagpapasok | Surface Mount | — |
| Level ng MSL | [DATA_NEEDED: MSL rating] | — |
| Katayuan ng Lifecycle | Active | — |
| Embedded Memory Bits | — | 59,234,304 (about 59.2 Mbit) |
| Core Voltage (VCC) | — | 0.9 V |
| Hard PCIe IP | — | PCIe Gen3 x8 controller (hard IP) |
| External Memory Interface | — | DDR4 up to 1600 MHz |
| Temperature Grade | — | Extended (E2) |
| Speed Grade | — | 3 (mid) |
| Tindminan RoHS | — | Compliant |
| Toolchain | — | Intel Quartus Prime Pro Edition |