10AX090R2F40E2SG vs 10AX090R3F40E2LG Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10AX090R2F40E2SG disebabkan oleh Intel dan 10AX090R3F40E2LG disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10AX090R2F40E2SG | 10AX090R3F40E2LG |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements | 900000 | 900,000 |
| LABs/CLBs | 339620 | — |
| Total RAM Bits | 59234304 | — |
| User I/O Count | 342 | 342 |
| Package Type | 1517-BBGA, FCBGA | Flip-Chip Ball Grid Array |
| Package Code | F40 (approx. 40mm FCBGA) | — |
| Speed Grade | 2 (R2 -2 transceiver rating) | — |
| Temperature Grade | E2 (Extended: -40C to +100C junction) | — |
| Lead-Free / RoHS | Yes (SG suffix) | — |
| Transceivers | Up to 14.1 Gbps (Arria 10 GX feature) | Multi-gigabit serial transceivers (on-die) |
| DSP Blocks | Variable-precision, hardened floating-point capable | Hardened fixed/floating-point DSP blocks (on-die) |
| Process Node | TSMC 20nm | — |
| Jenis Pemasangan | Surface Mount (FCBGA ball grid) | Surface Mount |
| Aras MSL | 3 (168 Hours) | — |
| Packaging | Tray | — |
| Embedded Memory | — | 59,234,304 bits |
| Process Technology | — | 20 nm |
| Core Supply Voltage | — | 0.9 V |
| Kemasan | — | 1517-Ball FCBGA |
| Number of Terminals | — | 1517 |
| Memory Interfaces | — | Hardened DDR3/DDR4 memory controller IP |
| Hard IP | — | PCI Express Gen3, 10/40/100 GbE Ethernet |
| Configuration | — | Partial reconfiguration supported |
| Status RoHS | — | Compliant |