10AX090R2F40E2SG vs 10AX090R3F40E2LG Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10AX090R2F40E2SG sa pamamagitan ng Intel at 10AX090R3F40E2LG sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | 10AX090R2F40E2SG | 10AX090R3F40E2LG |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements | 900000 | 900,000 |
| LABs/CLBs | 339620 | — |
| Total RAM Bits | 59234304 | — |
| User I/O Count | 342 | 342 |
| Package Type | 1517-BBGA, FCBGA | Flip-Chip Ball Grid Array |
| Package Code | F40 (approx. 40mm FCBGA) | — |
| Speed Grade | 2 (R2 -2 transceiver rating) | — |
| Temperature Grade | E2 (Extended: -40C to +100C junction) | — |
| Lead-Free / RoHS | Yes (SG suffix) | — |
| Transceivers | Up to 14.1 Gbps (Arria 10 GX feature) | Multi-gigabit serial transceivers (on-die) |
| DSP Blocks | Variable-precision, hardened floating-point capable | Hardened fixed/floating-point DSP blocks (on-die) |
| Process Node | TSMC 20nm | — |
| Uri ng Pagpapasok | Surface Mount (FCBGA ball grid) | Surface Mount |
| Level ng MSL | 3 (168 Hours) | — |
| Packaging | Tray | — |
| Embedded Memory | — | 59,234,304 bits |
| Process Technology | — | 20 nm |
| Core Supply Voltage | — | 0.9 V |
| Packhaging | — | 1517-Ball FCBGA |
| Number of Terminals | — | 1517 |
| Memory Interfaces | — | Hardened DDR3/DDR4 memory controller IP |
| Hard IP | — | PCI Express Gen3, 10/40/100 GbE Ethernet |
| Configuration | — | Partial reconfiguration supported |
| Tindminan RoHS | — | Compliant |