10M08DAF484I7P vs 10M08DCF484C8G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10M08DAF484I7P disebabkan oleh Intel dan 10M08DCF484C8G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10M08DAF484I7P | 10M08DCF484C8G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | MAX 10 | MAX 10 |
| Logic Elements (LE) | 8,000 | — |
| Embedded Memory | 378 Kbits (46,080 M9K bits) | — |
| User I/O Count | 250 | 250 |
| Kemasan | 484-ball FBGA (F484) | 484-ball FBGA (FineLine BGA) |
| Pitch | 1.0 mm | — |
| Core Voltage | 1.0 V | 1.2 V (on-chip regulator) |
| Speed Grade | -7 | C8 (commercial, standard speed) |
| Suhu Operasi | -40 C to +100 C (Industrial) | Commercial (0C to +85C junction, per speed grade) |
| On-chip Configuration Flash | Yes, dual-boot | — |
| Embedded ADC | 12-bit, 1 Msps, 16 channels | — |
| DSP Blocks | Yes (24 x 18-bit multipliers) | — |
| PLLs | 4 | 2 |
| Maximum LVDS Channels | [DATA_NEEDED: per-bank LVDS channel count] | — |
| User Flash | 8 Kbits (non-volatile) | — |
| Status RoHS | Compliant | Compliant |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount (BGA) |
| Aras MSL | [DATA_NEEDED: moisture sensitivity level] | 3 (per JEDEC J-STD-020) |
| Logic Elements | — | 8,000 |
| Embedded Memory (M9K) | — | 378 Kbits (49 M9K blocks) |
| Embedded Multiplier Blocks (18x18) | — | [DATA_NEEDED: 18x18 multiplier count] |
| Process Technology | — | 55 nm TSMC embedded NOR flash |
| Configuration Memory | — | Dual on-chip flash (instant-on, dual-boot) |
| Global Clock Networks | — | Up to 16 |
| Integrated ADC | — | 12-bit SAR, up to 1 Msps |
| LVDS Support | — | True LVDS up to 1.4 Gbps (input), emulated LVDS (output) |