10M08SAM153I7G vs 10M04SAM153I7G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10M08SAM153I7G disebabkan oleh Intel dan 10M04SAM153I7G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10M08SAM153I7G | 10M04SAM153I7G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | MAX 10 | MAX® 10 FPGA |
| Logic Elements (LE) | 8,000 | — |
| Embedded Memory (M9K blocks) | 378 Kbit | — |
| Maximum User I/O | 112 | — |
| DSP Blocks (18x18 multipliers) | 24 | — |
| Kemasan | 153-MBGA (VFBGA), 8 x 8 mm, 0.5 mm pitch | 153-ball MBGA (Micro FineLine BGA) |
| Suhu Operasi | -40 °C to +100 °C (Industrial) | -40 °C to +100 °C (industrial) |
| Speed Grade | I7 (industrial, 7) | — |
| On-die Flash Configuration | Yes (instant-on, dual-boot) | — |
| PLLs | 4 (periphery) | [DATA_NEEDED: PLL count] |
| Global Clocks | 20 | — |
| User Flash Memory (UFM) | Up to 736 Kbyte | — |
| ADC Block | 12-bit, 1 MSPS (1 hard IP block) | [DATA_NEEDED: ADC presence on this density] |
| Configuration Method | Internal flash, JTAG | On-die flash, instant-on |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Status RoHS | Compliant | Compliant |
| Aras MSL | 3 (168 hours) | — |
| Series | — | MAX 10 (10M04) |
| Logic Elements (LEs) | — | 4,000 |
| Embedded Memory (bits) | — | 193,536 |
| User I/O Count | — | 112 |
| Process Technology | — | 55 nm (embedded flash, TSMC) |
| Core Voltage | — | 1.2 V |
| I/O Voltage Support | — | 3.0 V / 3.3 V LVCMOS |
| Package Pitch | — | [DATA_NEEDED: package ball pitch] |
| Multiplier Blocks (18×18) | — | [DATA_NEEDED: multiplier count] |
| User Flash | — | [DATA_NEEDED: user flash size] |
| Lead-Free | — | Yes |