10M08SAM153I7G vs 10M04SAM153I7G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10M08SAM153I7G sa pamamagitan ng Intel at 10M04SAM153I7G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | 10M08SAM153I7G | 10M04SAM153I7G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | MAX 10 | MAX® 10 FPGA |
| Logic Elements (LE) | 8,000 | — |
| Embedded Memory (M9K blocks) | 378 Kbit | — |
| Maximum User I/O | 112 | — |
| DSP Blocks (18x18 multipliers) | 24 | — |
| Packhaging | 153-MBGA (VFBGA), 8 x 8 mm, 0.5 mm pitch | 153-ball MBGA (Micro FineLine BGA) |
| Temperature na Operasyon | -40 °C to +100 °C (Industrial) | -40 °C to +100 °C (industrial) |
| Speed Grade | I7 (industrial, 7) | — |
| On-die Flash Configuration | Yes (instant-on, dual-boot) | — |
| PLLs | 4 (periphery) | [DATA_NEEDED: PLL count] |
| Global Clocks | 20 | — |
| User Flash Memory (UFM) | Up to 736 Kbyte | — |
| ADC Block | 12-bit, 1 MSPS (1 hard IP block) | [DATA_NEEDED: ADC presence on this density] |
| Configuration Method | Internal flash, JTAG | On-die flash, instant-on |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Tindminan RoHS | Compliant | Compliant |
| Level ng MSL | 3 (168 hours) | — |
| Series | — | MAX 10 (10M04) |
| Logic Elements (LEs) | — | 4,000 |
| Embedded Memory (bits) | — | 193,536 |
| User I/O Count | — | 112 |
| Process Technology | — | 55 nm (embedded flash, TSMC) |
| Core Voltage | — | 1.2 V |
| I/O Voltage Support | — | 3.0 V / 3.3 V LVCMOS |
| Package Pitch | — | [DATA_NEEDED: package ball pitch] |
| Multiplier Blocks (18×18) | — | [DATA_NEEDED: multiplier count] |
| User Flash | — | [DATA_NEEDED: user flash size] |
| Lead-Free | — | Yes |