10M16DCU324I7G vs 10M08DCU324I7G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10M16DCU324I7G disebabkan oleh Intel dan 10M08DCU324I7G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10M16DCU324I7G | 10M08DCU324I7G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | MAX 10 | — |
| Logic Elements | 16,000 | — |
| Adaptive Logic Modules (ALMs) | 9,920 | — |
| User I/O Count (Maximum) | 246 | — |
| Embedded Memory (M9K Blocks) | 558 Kbits | — |
| Distributed Logic RAM | 12.5 Kbits | — |
| Embedded User Flash | 562,176 bits (70 KB) | — |
| Embedded 18x18 Multipliers | 45 | — |
| PLLs | 4 | [DATA_NEEDED: PLL count] |
| Maximum LVDS Channels | 125 | — |
| Kemasan | 324-UBGA (U324), 15 x 15 mm, 0.8 mm pitch | 324-pin UFBGA (U324) |
| Suhu Operasi | -40C to +100C (Industrial) | -40C to +100C (industrial, I7) |
| Process Technology | 55 nm NOR-flash-based CMOS | 55 nm NOR flash CMOS |
| Configuration Memory | On-die dual-configuration flash | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount (BGA) |
| Status RoHS | Compliant | Compliant |
| Product Family | — | MAX 10 |
| Logic Elements (LE) | — | 8,000 |
| Embedded Memory (M9K blocks / bits) | — | 246 Kbits |
| User Flash Memory | — | 387,072 bits |
| Maximum User I/O Pins | — | 246 |
| Ball Pitch | — | 0.8 mm |
| Integrated ADC | — | 12-bit SAR, up to 18 channels |
| ADC Sampling Rate | — | 1 MSa/s (single-ended) |
| Embedded Multipliers (18x18) | — | [DATA_NEEDED: 18x18 multiplier count] |
| Configuration Modes | — | JTAG, internal flash, external host |
| Core Voltage | — | 3.3 V |
| Lead-Free | — | Yes |