10M16DCU324I7G vs 10M08DCU324I7G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10M16DCU324I7G sa pamamagitan ng Intel at 10M08DCU324I7G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | 10M16DCU324I7G | 10M08DCU324I7G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | MAX 10 | — |
| Logic Elements | 16,000 | — |
| Adaptive Logic Modules (ALMs) | 9,920 | — |
| User I/O Count (Maximum) | 246 | — |
| Embedded Memory (M9K Blocks) | 558 Kbits | — |
| Distributed Logic RAM | 12.5 Kbits | — |
| Embedded User Flash | 562,176 bits (70 KB) | — |
| Embedded 18x18 Multipliers | 45 | — |
| PLLs | 4 | [DATA_NEEDED: PLL count] |
| Maximum LVDS Channels | 125 | — |
| Packhaging | 324-UBGA (U324), 15 x 15 mm, 0.8 mm pitch | 324-pin UFBGA (U324) |
| Temperature na Operasyon | -40C to +100C (Industrial) | -40C to +100C (industrial, I7) |
| Process Technology | 55 nm NOR-flash-based CMOS | 55 nm NOR flash CMOS |
| Configuration Memory | On-die dual-configuration flash | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (BGA) |
| Tindminan RoHS | Compliant | Compliant |
| Product Family | — | MAX 10 |
| Logic Elements (LE) | — | 8,000 |
| Embedded Memory (M9K blocks / bits) | — | 246 Kbits |
| User Flash Memory | — | 387,072 bits |
| Maximum User I/O Pins | — | 246 |
| Ball Pitch | — | 0.8 mm |
| Integrated ADC | — | 12-bit SAR, up to 18 channels |
| ADC Sampling Rate | — | 1 MSa/s (single-ended) |
| Embedded Multipliers (18x18) | — | [DATA_NEEDED: 18x18 multiplier count] |
| Configuration Modes | — | JTAG, internal flash, external host |
| Core Voltage | — | 3.3 V |
| Lead-Free | — | Yes |