10M25DAF484I7G vs 10M08DAF484I7G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10M25DAF484I7G disebabkan oleh Intel dan 10M08DAF484I7G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10M25DAF484I7G | 10M08DAF484I7G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | MAX 10 | MAX 10 FPGA |
| Logic Elements (LE) | 25,000 | 8000 |
| Embedded Memory (bits) | 691,200 | 387072 |
| User I/Os | 360 | — |
| Kemasan | 484-FBGA (FBGA) | — |
| Core Voltage | 1.2 V | — |
| Speed Grade | I7 | — |
| Temperature Grade | Industrial (-40 C to +100 C ambient) | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Tray / Reel | Tray | — |
| 18 x 18 Multipliers | 66 | — |
| PLLs | 2 | — |
| On-chip Configuration Flash | Dual (instant-on, dual-boot) | — |
| Integrated ADC | 12-bit SAR, up to 17 analog inputs | — |
| Status RoHS | Compliant | Compliant |
| Series | — | MAX 10 |
| Embedded Memory (Kb) | — | 378 |
| Number of I/Os | — | 250 |
| Number of LABs/CLBs | — | [DATA_NEEDED: number of LABs] |
| Number of Logic Array Blocks | — | [DATA_NEEDED: LAB count] |
| Suhu Operasi | — | -40 °C to +100 °C (Industrial) |
| Supply Voltage - Core | — | 1.2 V |
| Kemasan / Case | — | 484-BGA |
| Supplier Device Package | — | 484-FBGA (23x23 mm) |
| Process Technology | — | 55 nm |
| Lead Free | — | Yes |
| Configuration Memory | — | Internal flash (non-volatile) |