10M25DAF484I7G vs 10M08DAF484I7G 比較
詳細並排比較 10M25DAF484I7G 由 Intel 與 10M08DAF484I7G 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | 10M25DAF484I7G | 10M08DAF484I7G |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Family | MAX 10 | MAX 10 FPGA |
| Logic Elements (LE) | 25,000 | 8000 |
| Embedded Memory (bits) | 691,200 | 387072 |
| User I/Os | 360 | — |
| 封裝 | 484-FBGA (FBGA) | — |
| Core Voltage | 1.2 V | — |
| Speed Grade | I7 | — |
| Temperature Grade | Industrial (-40 C to +100 C ambient) | — |
| 安裝類型 | Surface Mount (BGA) | Surface Mount |
| Tray / Reel | Tray | — |
| 18 x 18 Multipliers | 66 | — |
| PLLs | 2 | — |
| On-chip Configuration Flash | Dual (instant-on, dual-boot) | — |
| Integrated ADC | 12-bit SAR, up to 17 analog inputs | — |
| RoHS 狀態 | Compliant | Compliant |
| Series | — | MAX 10 |
| Embedded Memory (Kb) | — | 378 |
| Number of I/Os | — | 250 |
| Number of LABs/CLBs | — | [DATA_NEEDED: number of LABs] |
| Number of Logic Array Blocks | — | [DATA_NEEDED: LAB count] |
| 工作溫度 | — | -40 °C to +100 °C (Industrial) |
| Supply Voltage - Core | — | 1.2 V |
| 封裝 / 外殼 | — | 484-BGA |
| Supplier Device Package | — | 484-FBGA (23x23 mm) |
| Process Technology | — | 55 nm |
| Lead Free | — | Yes |
| Configuration Memory | — | Internal flash (non-volatile) |