10M25DAF484I7G vs 10M08DAF484I7G Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng 10M25DAF484I7G sa pamamagitan ng Intel at 10M08DAF484I7G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Intel
10M25DAF484I7G 10M25DAF484I7G - MAX 10 FPGA 25K LE 484-FBGA | Intel

10M25DAF484I7G - MAX 10 FPGA 25K LE 484-FBGA | Intel

10M25DAF484I7G ✓ Nakahanda
Intel
10M08DAF484I7G 10M08DAF484I7G - MAX 10 FPGA, 8K LE, 484-FBGA | Intel

10M08DAF484I7G - MAX 10 FPGA, 8K LE, 484-FBGA | Intel

10M08DAF484I7G ✓ Nakahanda

Pagsanggunian na paghahambing

Parametro 10M25DAF484I7G 10M08DAF484I7G
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Family MAX 10 MAX 10 FPGA
Logic Elements (LE) 25,000 8000
Embedded Memory (bits) 691,200 387072
User I/Os 360 —
Packhaging 484-FBGA (FBGA) —
Core Voltage 1.2 V —
Speed Grade I7 —
Temperature Grade Industrial (-40 C to +100 C ambient) —
Uri ng Pagpapasok Surface Mount (BGA) Surface Mount
Tray / Reel Tray —
18 x 18 Multipliers 66 —
PLLs 2 —
On-chip Configuration Flash Dual (instant-on, dual-boot) —
Integrated ADC 12-bit SAR, up to 17 analog inputs —
Tindminan RoHS Compliant Compliant
Series — MAX 10
Embedded Memory (Kb) — 378
Number of I/Os — 250
Number of LABs/CLBs — [DATA_NEEDED: number of LABs]
Number of Logic Array Blocks — [DATA_NEEDED: LAB count]
Temperature na Operasyon — -40 °C to +100 °C (Industrial)
Supply Voltage - Core — 1.2 V
Packhaging / Kaso — 484-BGA
Supplier Device Package — 484-FBGA (23x23 mm)
Process Technology — 55 nm
Lead Free — Yes
Configuration Memory — Internal flash (non-volatile)

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