10M40DCF484I7G vs 10M50DAF484I7P Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10M40DCF484I7G disebabkan oleh Intel dan 10M50DAF484I7P disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10M40DCF484I7G | 10M50DAF484I7P |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | MAX 10 | — |
| Logic Elements | 40,000 | — |
| Embedded Memory | 1,290,240 bits (Kb) | — |
| User I/O Count | 360 | — |
| Kemasan | 484-FBGA (FineLine BGA, 23 x 23 mm, 1.0 mm pitch) | 484-ball FineLine BGA (F484) |
| Process Technology | 55 nm CMOS | — |
| Core Voltage | 1.2 V | — |
| Maximum Internal Frequency | 472.5 MHz | — |
| PLLs | 4 | 8 (general-purpose, fractional on selected devices) |
| I/O Banks | 2 (with LVDS support) | — |
| Configuration Memory | On-chip flash (instant-on, no external boot PROM) | — |
| Temperature Grade | Commercial (DC suffix) | — |
| Speed Grade | I7 | 7 (slowest industrial bin, highest margin) |
| Lead-Free Finish | Yes (G suffix) | — |
| Status RoHS | Compliant | Compliant |
| Product Family | — | MAX 10 |
| Logic Elements (LE) | — | 50,000 |
| Embedded Memory (bits) | — | 1,677,312 |
| Embedded Memory Blocks | — | M9K (and M144K) |
| 18x18 Multipliers | — | 312 |
| User I/O Pins (max) | — | 360 |
| Pitch | — | 1.0 mm |
| Process Node | — | 55 nm embedded flash (TSMC) |
| On-die Configuration Flash | — | Yes (non-volatile, instant-on) |
| On-die ADC | — | Dual 12-bit SAR, 1 MSPS, up to 16 analog inputs |
| Global Clock Networks | — | 20 |
| Suhu Operasi | — | -40C to +100C (Tj, industrial) |
| Configuration Modes | — | Internal flash, JTAG, dual-boot image support |