10M40DCF484I7G vs 10M50DAF484I7P Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10M40DCF484I7G sa pamamagitan ng Intel at 10M50DAF484I7P sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | 10M40DCF484I7G | 10M50DAF484I7P |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | MAX 10 | — |
| Logic Elements | 40,000 | — |
| Embedded Memory | 1,290,240 bits (Kb) | — |
| User I/O Count | 360 | — |
| Packhaging | 484-FBGA (FineLine BGA, 23 x 23 mm, 1.0 mm pitch) | 484-ball FineLine BGA (F484) |
| Process Technology | 55 nm CMOS | — |
| Core Voltage | 1.2 V | — |
| Maximum Internal Frequency | 472.5 MHz | — |
| PLLs | 4 | 8 (general-purpose, fractional on selected devices) |
| I/O Banks | 2 (with LVDS support) | — |
| Configuration Memory | On-chip flash (instant-on, no external boot PROM) | — |
| Temperature Grade | Commercial (DC suffix) | — |
| Speed Grade | I7 | 7 (slowest industrial bin, highest margin) |
| Lead-Free Finish | Yes (G suffix) | — |
| Tindminan RoHS | Compliant | Compliant |
| Product Family | — | MAX 10 |
| Logic Elements (LE) | — | 50,000 |
| Embedded Memory (bits) | — | 1,677,312 |
| Embedded Memory Blocks | — | M9K (and M144K) |
| 18x18 Multipliers | — | 312 |
| User I/O Pins (max) | — | 360 |
| Pitch | — | 1.0 mm |
| Process Node | — | 55 nm embedded flash (TSMC) |
| On-die Configuration Flash | — | Yes (non-volatile, instant-on) |
| On-die ADC | — | Dual 12-bit SAR, 1 MSPS, up to 16 analog inputs |
| Global Clock Networks | — | 20 |
| Temperature na Operasyon | — | -40C to +100C (Tj, industrial) |
| Configuration Modes | — | Internal flash, JTAG, dual-boot image support |