10M50DAF484I7G vs 10M50DCF484I6G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10M50DAF484I7G disebabkan oleh Intel dan 10M50DCF484I6G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10M50DAF484I7G | 10M50DCF484I6G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | MAX 10 | MAX 10 FPGA |
| Logic Elements (LE) | 50,000 | — |
| Embedded Memory (bits) | 1,677,312 | — |
| Embedded User Flash (bits) | 1,677,312 (dual configuration) | — |
| User I/O Count | 360 | — |
| Kemasan | 484-ball FBGA (F484) | 484-ball FineLine BGA (F484) |
| Package Pitch | 1.0 mm | — |
| Package Body Size | 23 x 23 mm | — |
| Process Technology | TSMC 55 nm | — |
| Supply Voltage - Core | 1.2 V | 1.2 V |
| Operating Temperature Grade | Industrial (-40C to +100C) | — |
| On-die Configuration Flash | Yes (dual-boot) | — |
| Integrated ADC | 12-bit, 1 MSPS, up to 18 channels | — |
| DSP Blocks | 144 (18x18 multipliers) | — |
| PLLs | 4 | — |
| Configuration Mode | Single-chip (no external boot device required) | — |
| Jenis Pemasangan | Surface Mount (FBGA) | Surface Mount (BGA) |
| Aras MSL | 3 (per JEDEC J-STD-020) | — |
| Status RoHS | Compliant | Compliant |
| Lead-free / Halogen-free | Yes / Yes | — |
| Logic Elements | — | 50,000 |
| Adaptive Logic Modules (ALMs) | — | 25,000 |
| Embedded Memory (RAM) | — | 1,638 Kbit |
| User Flash | — | 512 Kbyte (4,096 Kbit) |
| Total Embedded Memory | — | 2,140 Kbit (RAM + UFM) |
| 18x18 Multipliers | — | 144 |
| General-Purpose PLLs | — | 4 |
| Global Clock Networks | — | 20 |
| Hard PCIe Gen2 Controllers | — | 1 (x1) |
| On-chip ADC | — | 12-bit, 1 Msps SAR, up to 18 channels |
| User I/O Pins | — | 360 |
| Supply Voltage - I/O | — | 1.2 V to 3.3 V |
| Suhu Hubungan Operasi | — | -40C to +100C (industrial) |
| Configuration Memory | — | On-chip non-volatile (dual image) |