10M50DCF256C8G vs 10M50DCF256A7G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10M50DCF256C8G disebabkan oleh Intel dan 10M50DCF256A7G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10M50DCF256C8G | 10M50DCF256A7G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | MAX 10 | MAX 10 |
| Logic Elements (LE) | 50,000 | 50,000 |
| Embedded Memory | 1,677,312 bits (user flash) + 5,151 Kbits (M9K RAM) | M9K blocks, 9 Kbits each |
| User Flash Memory | 1,677,312 bits | 1,677,312 bits |
| DSP Blocks (18x18 Multipliers) | 172 | — |
| Maximum User I/O Pins | 178 | — |
| Kemasan | 256-pin FBGA (FBGA256), 17x17 mm | 256-ball FBGA (F256), 17 x 17 mm, 1.0 mm pitch |
| Temperature Grade | Commercial (C suffix) | — |
| Speed Grade | 8 | 7 (DCF = dual-supply, commercial/industrial) |
| PLLs | 4 | — |
| Hard ADC Blocks | 2 (12-bit, 1 MSPS) | — |
| Process Technology | TSMC 55 nm embedded flash CMOS | — |
| Core Voltage | 1.0 V (internal) | 1.2 V |
| I/O Bank Voltage | 2.5 V / 3.3 V (LVCMOS compatible) | — |
| Configuration Method | On-die non-volatile flash (instant-on); dual-boot supported | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount (BGA) |
| Status RoHS | Compliant | Compliant |
| User I/O Count | — | 178 |
| Process Node | — | 55 nm |
| I/O Bank Voltages | — | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V |
| Suhu Operasi | — | -40 C to +85 C (industrial) |
| Embedded Multipliers | — | 144 x 18 x 18 |
| PLL | — | 4 |
| On-chip ADC | — | 12-bit, 1 MSPS, 16 channels |
| Configuration | — | Internal flash (single-chip, instant-on) |
| Aras MSL | — | 3 (168 hours) |