10M50DCF256C8G vs 10M50DCF256A7G 比較
詳細並排比較 10M50DCF256C8G 由 Intel 與 10M50DCF256A7G 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | 10M50DCF256C8G | 10M50DCF256A7G |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Family | MAX 10 | MAX 10 |
| Logic Elements (LE) | 50,000 | 50,000 |
| Embedded Memory | 1,677,312 bits (user flash) + 5,151 Kbits (M9K RAM) | M9K blocks, 9 Kbits each |
| User Flash Memory | 1,677,312 bits | 1,677,312 bits |
| DSP Blocks (18x18 Multipliers) | 172 | — |
| Maximum User I/O Pins | 178 | — |
| 封裝 | 256-pin FBGA (FBGA256), 17x17 mm | 256-ball FBGA (F256), 17 x 17 mm, 1.0 mm pitch |
| Temperature Grade | Commercial (C suffix) | — |
| Speed Grade | 8 | 7 (DCF = dual-supply, commercial/industrial) |
| PLLs | 4 | — |
| Hard ADC Blocks | 2 (12-bit, 1 MSPS) | — |
| Process Technology | TSMC 55 nm embedded flash CMOS | — |
| Core Voltage | 1.0 V (internal) | 1.2 V |
| I/O Bank Voltage | 2.5 V / 3.3 V (LVCMOS compatible) | — |
| Configuration Method | On-die non-volatile flash (instant-on); dual-boot supported | — |
| 安裝類型 | Surface Mount (BGA) | Surface Mount (BGA) |
| RoHS 狀態 | Compliant | Compliant |
| User I/O Count | — | 178 |
| Process Node | — | 55 nm |
| I/O Bank Voltages | — | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V |
| 工作溫度 | — | -40 C to +85 C (industrial) |
| Embedded Multipliers | — | 144 x 18 x 18 |
| PLL | — | 4 |
| On-chip ADC | — | 12-bit, 1 MSPS, 16 channels |
| Configuration | — | Internal flash (single-chip, instant-on) |
| MSL 等級 | — | 3 (168 hours) |