A3PE3000L-1FG484 vs A3PE3000L-1FG484I Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci A3PE3000L-1FG484 disebabkan oleh Microchip Technology dan A3PE3000L-1FG484I disebabkan oleh Microchip Technology. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Microchip Technology
A3PE3000L-1FG484 - ProASIC3L Flash FPGA 3M Gates 484-BGA | Microchip
A3PE3000L-1FG484 ✓ AktifMicrochip Technology
A3PE3000L-1FG484I - ProASIC3L Low Power Flash FPGA | Microchip
A3PE3000L-1FG484I ✓ AktifPengandingan Spesifikasi
| Parametr | A3PE3000L-1FG484 | A3PE3000L-1FG484I |
|---|---|---|
| Merek | Microchip Technology | Microchip Technology |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | ProASIC3L (Flash FPGA) | ProASIC3L (Low Power Flash FPGA) |
| System Gates | 3000000 | 3,000,000 gates |
| Logic Cells / CLBs | 75264 | — |
| Logic Elements (LEs) | [DATA_NEEDED: LE count] | 35 KLEs |
| User I/O | 341 | — |
| Embedded Memory | 516096 bits | — |
| Core Voltage | 1.2 V to 1.5 V | 1.2 V (family supports 1.2 V to 1.5 V) |
| Speed Grade | -1 | -1 |
| Kemasan | 484-BGA (FBGA), 23 x 23 mm, 1.0 mm pitch | 484-ball FBGA (FG484) |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Configuration Technology | Flash (non-volatile, single-chip) | — |
| Special Features | Flash*Freeze technology, live reprogrammability | Flash*Freeze technology, non-volatile single-chip |
| Status RoHS | Non-Compliant (standard grade; see -FGG484 / M / I variants for compliant options) | [DATA_NEEDED: RoHS compliance status] |
| Suhu Operasi | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: exact min/max operating temperature range] |
| Supply Voltage - I/O | [DATA_NEEDED: I/O voltage range] | [DATA_NEEDED: I/O bank voltage range] |
| Number of PLLs | [DATA_NEEDED: PLL count] | — |
| Package Height | 2.23 mm | — |
| Total RAM Bits | — | 516096 bits |
| Number of I/O | — | 341 |
| Process Technology | — | 130 nm flash |
| Terminal Form | — | Ball (BGA, square) |
| Temperature Grade | — | Industrial (I) |
| Configuration | — | On-chip flash, no external boot device |
| Packaging | — | Tray |