A3PE3000L-1FG484 vs A3PE3000L-1FG484I Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng A3PE3000L-1FG484 sa pamamagitan ng Microchip Technology at A3PE3000L-1FG484I sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
A3PE3000L-1FG484 - ProASIC3L Flash FPGA 3M Gates 484-BGA | Microchip
A3PE3000L-1FG484 ✓ NakahandaMicrochip Technology
A3PE3000L-1FG484I - ProASIC3L Low Power Flash FPGA | Microchip
A3PE3000L-1FG484I ✓ NakahandaPagsanggunian na paghahambing
| Parametro | A3PE3000L-1FG484 | A3PE3000L-1FG484I |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | ProASIC3L (Flash FPGA) | ProASIC3L (Low Power Flash FPGA) |
| System Gates | 3000000 | 3,000,000 gates |
| Logic Cells / CLBs | 75264 | — |
| Logic Elements (LEs) | [DATA_NEEDED: LE count] | 35 KLEs |
| User I/O | 341 | — |
| Embedded Memory | 516096 bits | — |
| Core Voltage | 1.2 V to 1.5 V | 1.2 V (family supports 1.2 V to 1.5 V) |
| Speed Grade | -1 | -1 |
| Packhaging | 484-BGA (FBGA), 23 x 23 mm, 1.0 mm pitch | 484-ball FBGA (FG484) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Configuration Technology | Flash (non-volatile, single-chip) | — |
| Special Features | Flash*Freeze technology, live reprogrammability | Flash*Freeze technology, non-volatile single-chip |
| Tindminan RoHS | Non-Compliant (standard grade; see -FGG484 / M / I variants for compliant options) | [DATA_NEEDED: RoHS compliance status] |
| Temperature na Operasyon | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: exact min/max operating temperature range] |
| Supply Voltage - I/O | [DATA_NEEDED: I/O voltage range] | [DATA_NEEDED: I/O bank voltage range] |
| Number of PLLs | [DATA_NEEDED: PLL count] | — |
| Package Height | 2.23 mm | — |
| Total RAM Bits | — | 516096 bits |
| Number of I/O | — | 341 |
| Process Technology | — | 130 nm flash |
| Terminal Form | — | Ball (BGA, square) |
| Temperature Grade | — | Industrial (I) |
| Configuration | — | On-chip flash, no external boot device |
| Packaging | — | Tray |