BSC9132NXN7MNMB vs BSC9132NSE7MNMB Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci BSC9132NXN7MNMB disebabkan oleh NXP Semiconductors dan BSC9132NSE7MNMB disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
NXP Semiconductors
BSC9132NXN7MNMB - QorIQ Qonverge BSC SoC, 2x e500 + 2x SC3850 | NXP
BSC9132NXN7MNMB ✓ AktifNXP Semiconductors
BSC9132NSE7MNMB - QorIQ Qonverge SoC, 1.333GHz, FCBGA-780 | NXP
BSC9132NSE7MNMB ✓ AktifPengandingan Spesifikasi
| Parametr | BSC9132NXN7MNMB | BSC9132NSE7MNMB |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Aktif | Aktif |
| Part Number | BSC9132NXN7MNMB | — |
| Manufacturer | NXP Semiconductors (formerly Freescale) | — |
| Series | QorIQ Qonverge BSC | — |
| Core Processor | PowerPC e500 | — |
| Number of Cores / Bus Width | 2 Core, 32-Bit | — |
| CPU Speed | 1.333 GHz | — |
| Co-Processors / DSP | SC3850 StarCore DSP, dual 1.2 GHz; MAPLE-B2P baseband accelerator | — |
| RAM Controllers | DDR3, DDR3L (dual controllers, ECC support) | — |
| Graphics Acceleration | No | — |
| Ethernet | Multiple MACs (10/100/1000) | — |
| USB | USB 2.0 | — |
| PCIe | PCIe lanes (number varies by SerDes config) | — |
| SerDes Lanes | Multi-lane SerDes for CPRI/OBSAI fronthaul | — |
| Kemasan | 780-FCBGA (23x23 mm) | 780-pin FCBGA (23x23 mm) |
| Suhu Operasi | -40C to +105C | 0C to +105C |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount (BGA) |
| Status RoHS | Compliant (per NXP product page) | Compliant (per DigiKey) |
| Product Type | — | Multicore Baseband SoC (MPU + DSP) |
| Architecture | — | QorIQ Qonverge BSC |
| CPU Cores | — | 2x PowerPC e500, 1.2 GHz |
| DSP Cores | — | 2x StarCore SC3850, 1.2 GHz |
| Max Core Frequency | — | 1.333 GHz |
| Baseband Accelerator | — | MAPLE-B2P (Turbo + Viterbi + FEC) |
| Security Engine | — | SEC (Integrated) |
| Process Technology | — | 45 nm CMOS |
| Aras MSL | — | 3 (per Partstack listing) |
| Peak Reflow Temperature | — | 245C (per Partstack listing) |
| Lead-Free / Solder Finish | — | e1 (per Partstack listing) |
| Lebar Bus Data | — | 32-bit |