EP1SGX40DF1020I6N vs EP1SGX25DF1020I6N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP1SGX40DF1020I6N disebabkan oleh Intel dan EP1SGX25DF1020I6N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP1SGX40DF1020I6N | EP1SGX25DF1020I6N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Obsolete |
| Series | Stratix GX | EP1SGX25 |
| Family | Stratix (First Generation) | Stratix GX |
| Manufacturer | Intel (formerly Altera) | Intel (formerly Altera) |
| Core Supply Voltage | 1.425 V to 1.575 V (1.5 V nominal) | 1.425 V to 1.575 V (1.5 V nominal) |
| Number of Logic Elements (LEs) | 41,250 | — |
| Number of LABs (Logic Array Blocks) | 4,125 | — |
| Total RAM Bits | 3,423,744 | — |
| Maximum User I/O Pins | 624 | — |
| Number of I/O Banks | [DATA_NEEDED: I/O bank count] | — |
| High-Speed Transceivers | Integrated GX SerDes (channels, data rate: [DATA_NEEDED: per Stratix GX handbook]) | — |
| Embedded DSP Blocks | Yes (DSP block count: [DATA_NEEDED: per device datasheet]) | — |
| Kemasan / Case | 1020-BBGA / 1020-FBGA | — |
| Package Size | 33 x 33 mm, 1.0 mm pitch | — |
| Supplier Device Package | 1020-FBGA (33 x 33) | — |
| Suhu Operasi | 0 C to 85 C (industrial grade 'I') | 0 °C to +85 °C (industrial) |
| Speed Grade | 6 (I6) | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount (BGA) |
| Aras MSL | [DATA_NEEDED: MSL rating] | [DATA_NEEDED: moisture sensitivity level] |
| Status RoHS | [DATA_NEEDED: confirm RoHS on datasheet] | Compliant |
| Logic Family | CMOS (SRAM-based configuration) | — |
| Packaging | Tray / Bulk | — |
| Configuration Mode | Passive Serial / Fast Passive Parallel / JTAG (per Stratix GX handbook) | — |
| Logic Elements | — | 25,660 |
| Configurable Logic Blocks (CLBs) | — | 2,566 |
| User I/Os | — | 607 |
| Maximum Operating Frequency | — | [DATA_NEEDED: max internal clock frequency in MHz] |
| Process Technology | — | 130 nm CMOS |
| Multi-Gigabit Transceivers | — | Integrated (up to 3.125 Gbps per channel) |
| Kemasan | — | 1020-ball FC-FBGA, 33 mm × 33 mm, 1.0 mm pitch |
| Lead Finish | — | Lead Free |
| Memory | — | Embedded TriMatrix memory blocks |
| DSP Blocks | — | Integrated DSP blocks for fixed/floating-point arithmetic |
| Clock Management | — | PLLs with dynamic phase alignment (DPA) |
| Grade Identifier | — | I6 (industrial, speed grade 6) |