EP1SGX40DF1020I6N vs EP1SGX25DF1020I6N Karşılaştırma
Ayrıntılı yan yana karşılaştırma EP1SGX40DF1020I6N tarafından Intel ve EP1SGX25DF1020I6N tarafından IntelAnahtar özellikleri, elektriksel parametreleri, ambalajı, yaşam döngüsü durumu, fiyatlandırma ve mevcudiyeti karşılaştırarak tasarım gereksinimleriniz için en iyi bileşeni belirleyin.
Özellik Karşılaştırması
| Parametre | EP1SGX40DF1020I6N | EP1SGX25DF1020I6N |
|---|---|---|
| Marka | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Yaşam Döngüsü Durumu | Aktif | Obsolete |
| Series | Stratix GX | EP1SGX25 |
| Family | Stratix (First Generation) | Stratix GX |
| Manufacturer | Intel (formerly Altera) | Intel (formerly Altera) |
| Core Supply Voltage | 1.425 V to 1.575 V (1.5 V nominal) | 1.425 V to 1.575 V (1.5 V nominal) |
| Number of Logic Elements (LEs) | 41,250 | — |
| Number of LABs (Logic Array Blocks) | 4,125 | — |
| Total RAM Bits | 3,423,744 | — |
| Maximum User I/O Pins | 624 | — |
| Number of I/O Banks | [DATA_NEEDED: I/O bank count] | — |
| High-Speed Transceivers | Integrated GX SerDes (channels, data rate: [DATA_NEEDED: per Stratix GX handbook]) | — |
| Embedded DSP Blocks | Yes (DSP block count: [DATA_NEEDED: per device datasheet]) | — |
| Paket / Kas | 1020-BBGA / 1020-FBGA | — |
| Package Size | 33 x 33 mm, 1.0 mm pitch | — |
| Supplier Device Package | 1020-FBGA (33 x 33) | — |
| İşletim Sıcaklığı | 0 C to 85 C (industrial grade 'I') | 0 °C to +85 °C (industrial) |
| Speed Grade | 6 (I6) | — |
| Montaj Türü | Surface Mount (BGA) | Surface Mount (BGA) |
| MSL Seviyesi | [DATA_NEEDED: MSL rating] | [DATA_NEEDED: moisture sensitivity level] |
| RoHS Durumu | [DATA_NEEDED: confirm RoHS on datasheet] | Compliant |
| Logic Family | CMOS (SRAM-based configuration) | — |
| Packaging | Tray / Bulk | — |
| Configuration Mode | Passive Serial / Fast Passive Parallel / JTAG (per Stratix GX handbook) | — |
| Logic Elements | — | 25,660 |
| Configurable Logic Blocks (CLBs) | — | 2,566 |
| User I/Os | — | 607 |
| Maximum Operating Frequency | — | [DATA_NEEDED: max internal clock frequency in MHz] |
| Process Technology | — | 130 nm CMOS |
| Multi-Gigabit Transceivers | — | Integrated (up to 3.125 Gbps per channel) |
| Paket | — | 1020-ball FC-FBGA, 33 mm × 33 mm, 1.0 mm pitch |
| Lead Finish | — | Lead Free |
| Memory | — | Embedded TriMatrix memory blocks |
| DSP Blocks | — | Integrated DSP blocks for fixed/floating-point arithmetic |
| Clock Management | — | PLLs with dynamic phase alignment (DPA) |
| Grade Identifier | — | I6 (industrial, speed grade 6) |