EP20K600CF672I8 vs EP20K600CF672C8N Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP20K600CF672I8 disebabkan oleh Altera dan EP20K600CF672C8N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Pengandingan Spesifikasi

Parametr EP20K600CF672I8 EP20K600CF672C8N
Merek Altera Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Obsolete Aktif
Family APEX 20KC APEX 20KC
Device Type SPLD / FPGA SPLD
Logic Elements / Cells 24,320 —
Macros (Logic Cells) 2432 —
Typical Gate Count 600,000 gates —
Embedded Memory 311,296 bits —
User I/Os 488 to 508 —
Bilangan Pin 652 (functional) / 672 (BGA balls) —
Propagation Delay (typical) 1.48 ns —
Internal Frequency (max) [DATA_NEEDED: max internal frequency in MHz] —
Core Supply Voltage 1.8 V —
Process Technology 0.15 µm all-layer copper —
Suhu Operasi 0 °C to +85 °C (Industrial) 0°C to 85°C
Package Type 672-ball BGA, 45 x 45 mm, 1.27 mm pitch —
Jenis Pemasangan Surface Mount Surface mount
Status RoHS Compliant per legacy product records unknown
Configuration Interface JTAG / Passive Serial —
Design Tool Quartus II (legacy MAX+PLUS II) —
Product Type — FPGA / programmable logic device
Nominal Gate Capacity — 600K gates
Logic Elements or Cells — 24,320
Macros — 2,432
User I/O Count — 508
Package Terminals — 652 pins
Kemasan — BGA-652, 45 x 45 mm, 1.27 mm pitch
Package Description — 672-pin FC-FBGA
Tegangan Pemberi Arus — 1.8 V
Listed Frequency — 301.21 MHz
Propagation Delay — 1.48 ns
Fabrication Process — 0.15 µm
Interconnect Metal — All-layer copper metal
I/O Configuration — 508 user I/O
REACH Status — unknown
AEC-Q100 Qualification — unknown
Configuration Method — [DATA_NEEDED: configuration memory and programming method]
Core Current — [DATA_NEEDED: core supply current]
I/O Bank Voltage — [DATA_NEEDED: supported I/O voltage range]
Junction Temperature — [DATA_NEEDED: maximum junction temperature]
Tegangan Panas — [DATA_NEEDED: junction-to-ambient thermal resistance]

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