EP2A25B652C7 vs EP2A25F1020C8ES Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2A25B652C7 disebabkan oleh Intel dan EP2A25F1020C8ES disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Intel
EP2A25F1020C8ES EP2A25F1020C8ES - APEX II 24K LE FPGA 1020-BBGA | Intel

EP2A25F1020C8ES - APEX II 24K LE FPGA 1020-BBGA | Intel

EP2A25F1020C8ES ⚠ Bahagian terakhir untuk beli

Pengandingan Spesifikasi

Parametr EP2A25B652C7 EP2A25F1020C8ES
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Obsolete Masa Terakhir Dibeli
Family APEX II APEX II
Logic Elements Approximately 25,000 LE 24,320
Embedded System Blocks (ESBs) [DATA_NEEDED: ESB count] —
Maximum User I/O Pins 488 —
Kemasan 652-ball FineLine BGA 1020-ball FineLine BGA
Speed Grade -7 8
Core Voltage 1.5 V —
I/O Bank Voltage 1.5 V / 1.8 V / 2.5 V / 3.3 V —
RAM Bits (approx.) 40,960 —
PLLs 4 —
Supported I/O Standards LVTTL, LVCMOS, SSTL, LVDS —
Configuration Method JTAG / Passive Serial / Active Serial —
Boundary Scan IEEE 1149.1 compliant —
Design Software Quartus II —
Status RoHS [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status]
Suhu Operasi Commercial 0C to +85C —
System Gates — 2,750,000
Embedded Memory (bits) — 622,592
Maximum User I/O — 735
Package Code Suffix — F1020
Temperature Grade — Commercial (0 C to +85 C)
Suffix Code — ES (Engineering Sample)
Core Voltage (VCCINT) — [DATA_NEEDED: VCCINT nominal]
Process Technology — [DATA_NEEDED: process node]
Jenis Pemasangan — Surface Mount (BGA)
Aras MSL — 3 (168 Hours)
Packaging — Tray

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