EP2A25B652C7 vs EP2A25F1020C8ES Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2A25B652C7 sa pamamagitan ng Intel at EP2A25F1020C8ES sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2A25B652C7 | EP2A25F1020C8ES |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Huling Pagbili |
| Family | APEX II | APEX II |
| Logic Elements | Approximately 25,000 LE | 24,320 |
| Embedded System Blocks (ESBs) | [DATA_NEEDED: ESB count] | — |
| Maximum User I/O Pins | 488 | — |
| Packhaging | 652-ball FineLine BGA | 1020-ball FineLine BGA |
| Speed Grade | -7 | 8 |
| Core Voltage | 1.5 V | — |
| I/O Bank Voltage | 1.5 V / 1.8 V / 2.5 V / 3.3 V | — |
| RAM Bits (approx.) | 40,960 | — |
| PLLs | 4 | — |
| Supported I/O Standards | LVTTL, LVCMOS, SSTL, LVDS | — |
| Configuration Method | JTAG / Passive Serial / Active Serial | — |
| Boundary Scan | IEEE 1149.1 compliant | — |
| Design Software | Quartus II | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Temperature na Operasyon | Commercial 0C to +85C | — |
| System Gates | — | 2,750,000 |
| Embedded Memory (bits) | — | 622,592 |
| Maximum User I/O | — | 735 |
| Package Code Suffix | — | F1020 |
| Temperature Grade | — | Commercial (0 C to +85 C) |
| Suffix Code | — | ES (Engineering Sample) |
| Core Voltage (VCCINT) | — | [DATA_NEEDED: VCCINT nominal] |
| Process Technology | — | [DATA_NEEDED: process node] |
| Uri ng Pagpapasok | — | Surface Mount (BGA) |
| Level ng MSL | — | 3 (168 Hours) |
| Packaging | — | Tray |