EP2A25B652C7 vs EP2A25F1020C8ES 比較

詳細並排比較 EP2A25B652C7 由 Intel 與 EP2A25F1020C8ES 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Intel
EP2A25F1020C8ES EP2A25F1020C8ES - APEX II 24K LE FPGA 1020-BBGA | Intel

EP2A25F1020C8ES - APEX II 24K LE FPGA 1020-BBGA | Intel

EP2A25F1020C8ES ⚠ 最後購買機會

規格比較

參數 EP2A25B652C7 EP2A25F1020C8ES
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 Obsolete 最後購買
Family APEX II APEX II
Logic Elements Approximately 25,000 LE 24,320
Embedded System Blocks (ESBs) [DATA_NEEDED: ESB count] —
Maximum User I/O Pins 488 —
封裝 652-ball FineLine BGA 1020-ball FineLine BGA
Speed Grade -7 8
Core Voltage 1.5 V —
I/O Bank Voltage 1.5 V / 1.8 V / 2.5 V / 3.3 V —
RAM Bits (approx.) 40,960 —
PLLs 4 —
Supported I/O Standards LVTTL, LVCMOS, SSTL, LVDS —
Configuration Method JTAG / Passive Serial / Active Serial —
Boundary Scan IEEE 1149.1 compliant —
Design Software Quartus II —
RoHS 狀態 [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status]
工作溫度 Commercial 0C to +85C —
System Gates — 2,750,000
Embedded Memory (bits) — 622,592
Maximum User I/O — 735
Package Code Suffix — F1020
Temperature Grade — Commercial (0 C to +85 C)
Suffix Code — ES (Engineering Sample)
Core Voltage (VCCINT) — [DATA_NEEDED: VCCINT nominal]
Process Technology — [DATA_NEEDED: process node]
安裝類型 — Surface Mount (BGA)
MSL 等級 — 3 (168 Hours)
Packaging — Tray

資料表與資源

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