EP2A25F672C8 vs EP2A25F672C8N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2A25F672C8 disebabkan oleh Altera dan EP2A25F672C8N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP2A25F672C8 | EP2A25F672C8N |
|---|---|---|
| Merek | Altera | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | NRND |
| Family | APEX II (EP2A25) | APEX II |
| Logic Elements | 25,000 (typical gates) | — |
| Maximum System Gates | 40,960 | — |
| Macrocells / Embedded Logic | 2,432 macros | — |
| User I/O Count | 492 | — |
| Kemasan | 672-FBGA (FineLine BGA, 27x27 mm, 1.0 mm pitch) | 672-ball FC-FBGA (FineLine BGA) |
| Propagation Delay (tpd) | 1.69 ns | — |
| Speed Grade | C8 | C8 |
| Suhu Operasi | 0 C to 85 C (commercial) | 0 C to 85 C (commercial) |
| Process Technology | 0.15 microm CMOS, 8-layer copper interconnect | — |
| I/O Standards Supported | LVTTL, LVCMOS, PCI-X, GTL+, SSTL-2/3, HSTL, LVDS, LVPECL | — |
| LVDS Data Rate | 1 Gbps | — |
| PLL Count | 4 | — |
| Embedded Memory | ESB blocks (dual-port RAM, FIFO, CAM, ROM) | — |
| I/O Banks | 16 | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Status RoHS | Non-compliant (legacy product) | Compliant |
| Technology Node | — | 0.15 um all-layer copper process |
| System Gates | — | 900,000 |
| Logic Elements / Cells | — | 24,320 |
| Maximum Internal Frequency | — | 333 MHz |
| Propagation Delay | — | 1.69 ns |
| User I/Os | — | 492 |
| Package Body Size | — | 27 x 27 mm |
| Ball Pitch | — | 1.0 mm |
| Core Supply Voltage | — | 1.5 V |
| Multi-Gigabit Transceiver Rate | — | Up to 1 Gbps per channel |
| Lead-Free Suffix | — | N (lead-free, Pb-free finish) |