EP2A25F672C8 vs EP2A25F672C8N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2A25F672C8 sa pamamagitan ng Altera at EP2A25F672C8N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2A25F672C8 | EP2A25F672C8N |
|---|---|---|
| Brand | Altera | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | NRND |
| Family | APEX II (EP2A25) | APEX II |
| Logic Elements | 25,000 (typical gates) | — |
| Maximum System Gates | 40,960 | — |
| Macrocells / Embedded Logic | 2,432 macros | — |
| User I/O Count | 492 | — |
| Packhaging | 672-FBGA (FineLine BGA, 27x27 mm, 1.0 mm pitch) | 672-ball FC-FBGA (FineLine BGA) |
| Propagation Delay (tpd) | 1.69 ns | — |
| Speed Grade | C8 | C8 |
| Temperature na Operasyon | 0 C to 85 C (commercial) | 0 C to 85 C (commercial) |
| Process Technology | 0.15 microm CMOS, 8-layer copper interconnect | — |
| I/O Standards Supported | LVTTL, LVCMOS, PCI-X, GTL+, SSTL-2/3, HSTL, LVDS, LVPECL | — |
| LVDS Data Rate | 1 Gbps | — |
| PLL Count | 4 | — |
| Embedded Memory | ESB blocks (dual-port RAM, FIFO, CAM, ROM) | — |
| I/O Banks | 16 | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Tindminan RoHS | Non-compliant (legacy product) | Compliant |
| Technology Node | — | 0.15 um all-layer copper process |
| System Gates | — | 900,000 |
| Logic Elements / Cells | — | 24,320 |
| Maximum Internal Frequency | — | 333 MHz |
| Propagation Delay | — | 1.69 ns |
| User I/Os | — | 492 |
| Package Body Size | — | 27 x 27 mm |
| Ball Pitch | — | 1.0 mm |
| Core Supply Voltage | — | 1.5 V |
| Multi-Gigabit Transceiver Rate | — | Up to 1 Gbps per channel |
| Lead-Free Suffix | — | N (lead-free, Pb-free finish) |