EP2A25F672C8 vs EP2A25F672C8N Karşılaştırma
Ayrıntılı yan yana karşılaştırma EP2A25F672C8 tarafından Altera ve EP2A25F672C8N tarafından IntelAnahtar özellikleri, elektriksel parametreleri, ambalajı, yaşam döngüsü durumu, fiyatlandırma ve mevcudiyeti karşılaştırarak tasarım gereksinimleriniz için en iyi bileşeni belirleyin.
Özellik Karşılaştırması
| Parametre | EP2A25F672C8 | EP2A25F672C8N |
|---|---|---|
| Marka | Altera | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Yaşam Döngüsü Durumu | Obsolete | NRND |
| Family | APEX II (EP2A25) | APEX II |
| Logic Elements | 25,000 (typical gates) | — |
| Maximum System Gates | 40,960 | — |
| Macrocells / Embedded Logic | 2,432 macros | — |
| User I/O Count | 492 | — |
| Paket | 672-FBGA (FineLine BGA, 27x27 mm, 1.0 mm pitch) | 672-ball FC-FBGA (FineLine BGA) |
| Propagation Delay (tpd) | 1.69 ns | — |
| Speed Grade | C8 | C8 |
| İşletim Sıcaklığı | 0 C to 85 C (commercial) | 0 C to 85 C (commercial) |
| Process Technology | 0.15 microm CMOS, 8-layer copper interconnect | — |
| I/O Standards Supported | LVTTL, LVCMOS, PCI-X, GTL+, SSTL-2/3, HSTL, LVDS, LVPECL | — |
| LVDS Data Rate | 1 Gbps | — |
| PLL Count | 4 | — |
| Embedded Memory | ESB blocks (dual-port RAM, FIFO, CAM, ROM) | — |
| I/O Banks | 16 | — |
| Montaj Türü | Surface Mount | Surface Mount |
| RoHS Durumu | Non-compliant (legacy product) | Compliant |
| Technology Node | — | 0.15 um all-layer copper process |
| System Gates | — | 900,000 |
| Logic Elements / Cells | — | 24,320 |
| Maximum Internal Frequency | — | 333 MHz |
| Propagation Delay | — | 1.69 ns |
| User I/Os | — | 492 |
| Package Body Size | — | 27 x 27 mm |
| Ball Pitch | — | 1.0 mm |
| Core Supply Voltage | — | 1.5 V |
| Multi-Gigabit Transceiver Rate | — | Up to 1 Gbps per channel |
| Lead-Free Suffix | — | N (lead-free, Pb-free finish) |