EP2A70F1508C8ES vs EP2A70F1508C9 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2A70F1508C8ES disebabkan oleh Intel dan EP2A70F1508C9 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP2A70F1508C8ES - APEX II FPGA 1.14M Gates 1508-FCBGA | Intel
EP2A70F1508C8ES ⚠ Bahagian terakhir untuk beliIntel
EP2A70F1508C9 - APEX II FPGA 67.2K LE 1.5V 1508-FBGA | Intel / Altera
EP2A70F1508C9 ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EP2A70F1508C8ES | EP2A70F1508C9 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Masa Terakhir Dibeli | Masa Terakhir Dibeli |
| Family | APEX II | APEX II FPGA |
| Series | EP2A | APEX II |
| System Gates | 1,146,880 | — |
| Logic Elements | 67,200 | — |
| Embedded System Blocks (ESB) | Available (dual-port RAM/ROM/FIFO/CAM) | — |
| Maximum User I/O | 1,060 | — |
| Number of I/O Banks | [DATA_NEEDED: I/O bank count] | — |
| Core Voltage | 1.5 V | — |
| Speed Grade | -8 | C9 |
| Kemasan | 1508-ball FCBGA (Fine-pitch Chip-Scale BGA) | — |
| Configuration Memory | SRAM (in-system programmable) | — |
| Suhu Operasi | Commercial (0C to +85C) | 0 °C to 85 °C |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Aras MSL | 3 | [DATA_NEEDED: MSL level] |
| Status RoHS | Check manufacturer page - APEX II is a mature family with mixed compliance | [DATA_NEEDED: RoHS status] |
| Manufacturer | — | Intel (formerly Altera) |
| Logic Elements / Cells | — | 67,200 |
| Total RAM Bits | — | 1,146,880 |
| Number of I/O | — | 1,060 |
| Number of Logic Array Blocks (LABs) | — | [DATA_NEEDED: number of LABs] |
| Number of PLLs | — | 4 |
| Number of Gates | — | [DATA_NEEDED: typical gate count] |
| Voltage - Supply (Core) | — | 1.425 V to 1.575 V |
| Kemasan / Case | — | 1508-BBGA, FCBGA |
| Supplier Device Package | — | 1508-FBGA (40 × 40 mm) |
| Process Technology | — | 0.15 µm all-layer copper, up to 8 metal layers |
| High-Speed I/O Standards | — | True-LVDS (1 Gbps), LVPECL, PCML, HyperTransport |
| Configuration Modes | — | Passive Serial, Passive Parallel Sync/Async, Fast Passive Parallel |
| Embedded Multiplier Blocks | — | Yes |
| Embedded Memory Type | — | Dual-port RAM (ESB) / ROM / FIFO |