EP2A70F1508C8ES vs EP2A70F1508C9 比較

詳細並排比較 EP2A70F1508C8ES 由 Intel 與 EP2A70F1508C9 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Intel
EP2A70F1508C8ES EP2A70F1508C8ES - APEX II FPGA 1.14M Gates 1508-FCBGA | Intel

EP2A70F1508C8ES - APEX II FPGA 1.14M Gates 1508-FCBGA | Intel

EP2A70F1508C8ES ⚠ 最後購買機會

規格比較

參數 EP2A70F1508C8ES EP2A70F1508C9
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 最後購買 最後購買
Family APEX II APEX II FPGA
Series EP2A APEX II
System Gates 1,146,880 —
Logic Elements 67,200 —
Embedded System Blocks (ESB) Available (dual-port RAM/ROM/FIFO/CAM) —
Maximum User I/O 1,060 —
Number of I/O Banks [DATA_NEEDED: I/O bank count] —
Core Voltage 1.5 V —
Speed Grade -8 C9
封裝 1508-ball FCBGA (Fine-pitch Chip-Scale BGA) —
Configuration Memory SRAM (in-system programmable) —
工作溫度 Commercial (0C to +85C) 0 °C to 85 °C
安裝類型 Surface Mount (BGA) Surface Mount
MSL 等級 3 [DATA_NEEDED: MSL level]
RoHS 狀態 Check manufacturer page - APEX II is a mature family with mixed compliance [DATA_NEEDED: RoHS status]
Manufacturer — Intel (formerly Altera)
Logic Elements / Cells — 67,200
Total RAM Bits — 1,146,880
Number of I/O — 1,060
Number of Logic Array Blocks (LABs) — [DATA_NEEDED: number of LABs]
Number of PLLs — 4
Number of Gates — [DATA_NEEDED: typical gate count]
Voltage - Supply (Core) — 1.425 V to 1.575 V
封裝 / 外殼 — 1508-BBGA, FCBGA
Supplier Device Package — 1508-FBGA (40 × 40 mm)
Process Technology — 0.15 µm all-layer copper, up to 8 metal layers
High-Speed I/O Standards — True-LVDS (1 Gbps), LVPECL, PCML, HyperTransport
Configuration Modes — Passive Serial, Passive Parallel Sync/Async, Fast Passive Parallel
Embedded Multiplier Blocks — Yes
Embedded Memory Type — Dual-port RAM (ESB) / ROM / FIFO

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