EP2A70F1508C8ES vs EP2A70F1508C9 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2A70F1508C8ES sa pamamagitan ng Intel at EP2A70F1508C9 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP2A70F1508C8ES - APEX II FPGA 1.14M Gates 1508-FCBGA | Intel
EP2A70F1508C8ES ⚠ Huling PagbiliIntel
EP2A70F1508C9 - APEX II FPGA 67.2K LE 1.5V 1508-FBGA | Intel / Altera
EP2A70F1508C9 ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP2A70F1508C8ES | EP2A70F1508C9 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | Huling Pagbili |
| Family | APEX II | APEX II FPGA |
| Series | EP2A | APEX II |
| System Gates | 1,146,880 | — |
| Logic Elements | 67,200 | — |
| Embedded System Blocks (ESB) | Available (dual-port RAM/ROM/FIFO/CAM) | — |
| Maximum User I/O | 1,060 | — |
| Number of I/O Banks | [DATA_NEEDED: I/O bank count] | — |
| Core Voltage | 1.5 V | — |
| Speed Grade | -8 | C9 |
| Packhaging | 1508-ball FCBGA (Fine-pitch Chip-Scale BGA) | — |
| Configuration Memory | SRAM (in-system programmable) | — |
| Temperature na Operasyon | Commercial (0C to +85C) | 0 °C to 85 °C |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Level ng MSL | 3 | [DATA_NEEDED: MSL level] |
| Tindminan RoHS | Check manufacturer page - APEX II is a mature family with mixed compliance | [DATA_NEEDED: RoHS status] |
| Manufacturer | — | Intel (formerly Altera) |
| Logic Elements / Cells | — | 67,200 |
| Total RAM Bits | — | 1,146,880 |
| Number of I/O | — | 1,060 |
| Number of Logic Array Blocks (LABs) | — | [DATA_NEEDED: number of LABs] |
| Number of PLLs | — | 4 |
| Number of Gates | — | [DATA_NEEDED: typical gate count] |
| Voltage - Supply (Core) | — | 1.425 V to 1.575 V |
| Packhaging / Kaso | — | 1508-BBGA, FCBGA |
| Supplier Device Package | — | 1508-FBGA (40 × 40 mm) |
| Process Technology | — | 0.15 µm all-layer copper, up to 8 metal layers |
| High-Speed I/O Standards | — | True-LVDS (1 Gbps), LVPECL, PCML, HyperTransport |
| Configuration Modes | — | Passive Serial, Passive Parallel Sync/Async, Fast Passive Parallel |
| Embedded Multiplier Blocks | — | Yes |
| Embedded Memory Type | — | Dual-port RAM (ESB) / ROM / FIFO |